Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Analog Devices' ADRV9010BBCZ-REEL is a cellphone IC with 289 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 110°C and supports RF and baseband circuits at a nominal voltage of 1V. Ideal for telecom applications requiring precise signal processing in compact devices.
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The use of plastic/epoxy as the package body material provides good durability and protection to the internal components of the cellphone IC.
Surface mount technology allows for easy and efficient assembly of the IC onto a PCB, making it ideal for mass production of cellphones.
The square package shape helps in efficient utilization of space on the PCB, making the overall design of the cellphone compact and sleek.
The high number of terminals allows for a greater level of connectivity and functionality in the cellphone IC.
The grid array, low profile, and fine pitch package style enables high density integration of components, leading to improved performance efficiency of the cellphone IC.
The high maximum operating temperature ensures the cellphone IC can handle demanding usage conditions without overheating or malfunctioning.
The low minimum operating temperature allows the cellphone IC to function even in extreme cold environments, ensuring reliable performance in varied conditions.
Bottom terminal position facilitates easier PCB layout and routing of traces, simplifying the overall design process of the cellphone.
The low maximum seated height of the IC enables thinner and more compact cellphone designs, optimizing space utilization within the device.
The compact width of the IC allows for efficient placement on the PCB, contributing to a streamlined and organized layout of components in the cellphone.
The compact length of the IC further enhances space efficiency within the cellphone, enabling sleek and modern designs.
The ball terminal form provides reliable electrical connections and solder joints, ensuring stable and consistent performance of the cellphone IC.
The inclusion of RF and baseband circuitry in the IC supports seamless communication functions in the cellphone, enabling clear and reliable signal transmission.
The low nominal supply voltage of 1V helps in reducing power consumption and improving energy efficiency of the cellphone, extending battery life.
The small terminal pitch of 0.8mm allows for high-density mounting of the IC on the PCB, enhancing the overall performance and functionality of the cellphone.
Cellphone ICs ADRV9010BBCZ-REEL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices
JESD-30 Code:
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ADRV9010BBCZ-REEL Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.
CEO
Vincent Roche
Interim CFO
James Mollica
CAO
Michael Sondel
Limerick Fab
Fabrication
Fab Initiation
1977
Ireland
Limerick
Wafer Capacity
30,000
Hillview Fab
2001
USA
Milpitas
15,000
Wilmington Fab
1967
Wilmington
50,000
Camas Fab
1997
Camas
18,000
Beaverton-Portland
1987
Beaverton
14,000
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
SS14
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
BAV99
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
1N4148WS
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Won-top Electronics
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Nexperia
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
Semitronics
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
PIC18F4550-I/P
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CC1070-RTY1
Texas Instruments
CC1070-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable with a very thin profile, ideal for industrial telecom applications.
ADRF6658BCPZ-RL7
Analog Devices
Analog Devices' ADRF6658BCPZ-RL7 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
MAX4003EUA+
Maxim Integrated
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
HMC600LP4E
Analog Devices' HMC600LP4E is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.
LMV225UR/NOPB
Texas Instruments LMV225UR/NOPB is a cellphone IC with 8mA max supply current. It features grid array package style, very thin profile, and fine pitch. Ideal for telecom applications requiring RF and baseband circuit integration in surface mount designs.
TLV320AC56IN
TLV320AC56IN by Texas Instruments is a 20-terminal IC with 3V power supply, operating b/w -40 to 85°C. It features companding law MU-LAW, 13-bit linear coding, and a filter. Ideal for cellphone baseband circuits due to its industrial temperature grade and compact rectangular package design.
ADRV9010BBCZ-A-RL
Analog Devices' ADRV9010BBCZ-A-RL is a CELLPHONE IC with 289 terminals in a PLASTIC/EPOXY package. It operates b/w -40 to 110 °C, suitable for RF and baseband circuits. The low-profile GRID ARRAY design with 0.8mm terminal pitch makes it ideal for compact mobile devices.
TRF3705IRGET
TRF3705IRGET by Texas Instruments is a 24-terminal cellphone IC with 3.3V supply voltage, operating b/w -40 to 85°C. It features RF and baseband circuitry in a square chip carrier package with nickel palladium gold finish, suitable for industrial telecom applications.
HMC687LP4ETR
Analog Devices' HMC687LP4ETR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. With matte tin finish and 5V supply voltage, it's ideal for RF and baseband circuits requiring surface mount assembly.
CC2510F32RHHT
CC2510F32RHHT by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features CMOS, surface mount capability, and a terminal pitch of 0.5mm for industrial applications.
TCM4300PZR
Texas Instruments TCM4300PZR is a cellphone IC with 100 terminals in a square package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a low profile flatpack design with gull wing terminals, ideal for telecom applications.
MAX20461AATJD/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;
TQP3M9036
Qorvo
TQP3M9036 by Qorvo is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
LMH2121TMX
LMH2121TMX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring high performance in compact spaces.
NRF9160-SIAA-B1A-R
Nordic Semiconductor Asa
Nordic Semiconductor's NRF9160-SIAA-B1A-R is a Cellphone IC with RF and Baseband Circuit for telecom. It operates in industrial temperature range (-40 to 85°C) with 3.8V supply voltage. The package is rectangular, surface mountable, grid array style, measuring 10.5mm x 16mm with 127 terminals at 0.5mm pitch suitable for various wireless applications.
TCM4400EPET
Texas Instruments TCM4400EPET is a BICMOS technology Cellphone IC with 80 terminals in a square flatpack package. Operating b/w -25 to 85 °C, it has a supply voltage of 3V and max current of 0.03mA. Ideal for baseband circuits in telecom applications due to its compact size and low power consumption.
SKY13437-11
Skyworks Solutions
SKY13437-11 by Skyworks Solutions is a Cellphone IC with 22 terminals in RECTANGULAR package. Telecom IC Type: RF AND BASEBAND CIRCUIT, Nominal Voltage: 2.85V, Terminal Pitch: 0.4mm. Ideal for cellphone applications due to its compact MICROELECTRONIC ASSEMBLY and low operating temperatures of -35°C to 90°C.
MAX20461ATJD/V+
BASEBAND CIRCUIT; Terminal Finish: Matte Tin (Sn) - annealed; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
CC1100ERTKT
CC1100ERTKT by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits, it features CMOS technology and nickel palladium gold terminal finish.
LMV228SDX/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ADAQ23876BBCZ
Analog Devices' ADAQ23876BBCZ is a 16-bit ADC with 0.00125% EL, 15 MHz sample rate, and 2'S COMPLEMENT BINARY output. Ideal for wireless data acquisition applications due to its compact GRID ARRAY package and fast 0.063 us conversion time. Operating from -40 to 85 °C, it offers precise analog-to-digital conversion in a small form factor.
AD3542RBCPZ16-RL7
AD3542RBCPZ16-RL7 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V, 0.006103% linearity error, and 0.1us settling time. Ideal for applications requiring precise analog signal generation in temperature-sensitive environments.
ADMV8420ACPZ
Analog Devices' ADMV8420ACPZ is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50Ω. Operating b/w -40°C to 85°C, it's ideal for applications requiring precise filtering in electronic systems.
ADMV8420ACPZ-R5
ADMV8420ACPZ-R5 by Analog Devices is a 24-terminal BAND PASS FILTER with a Center Frequency of 15500 MHz and Input Impedance of 50 OHM. It operates b/w -40 to 85 °C and is ideal for applications requiring precise frequency filtering in electronic circuits.
ADN4693E-1BCPZ-RL7
ADN4693E-1BCPZ-RL7 by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V. It offers a max transmit delay of 2.4ns and max supply current of 24mA. Ideal for applications requiring differential output and EIA/TIA interface standards compliance in tight spaces due to its very thin profile chip carrier package style.
ADPA7005CHIP
ADPA7005CHIP by Analog Devices is a wide band medium power RF amplifier with 11.5 dB gain, operating from 20-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -55 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
ADN4693E-1BCPZ
ADN4693E-1BCPZ by Analog Devices is a Line Driver & Receiver with 16 terminals, operating at 3.3V nominal voltage. It features a max transmit delay of 2.4ns and differential output for EIA/TIA-899 interface standard applications in industrial settings.
ADPA7005AEHZ
ADPA7005AEHZ by Analog Devices is a wide band medium power RF amplifier with 12 dB gain. It operates b/w 18-44 GHz, handling up to 27 dBm CW input power. Ideal for applications requiring high frequency amplification in temperatures ranging from -40 to 85°C.
ADPA7005AEHZ-R7
ADPA7005AEHZ-R7 by Analog Devices is a wide band medium power RF amplifier with 12 dB gain, operating from 18-44 GHz. It can handle up to 27 dBm CW input power and operates in temperatures ranging from -40 °C to 85°C. Ideal for applications requiring high frequency amplification in RF & microwave systems.
AD3542RBCPZ16
AD3542RBCPZ16 by Analog Devices is a 16-bit D/A converter with max analog output voltage of 7.5V and linearity error of 0.006103%. It features a nominal settling time of 0.1us, making it ideal for applications requiring precise analog signal generation in temperature-sensitive environments. With a compact square package shape and surface mount capability, this chip carrier is suitable for space-constrained designs where high performance is essential.
ADRV9010BBCZ
RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
ADRV9010BBCZ-A
RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
RF AND BASEBAND CIRCUIT; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
ADRV9029BBCZ
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
ADRV9029BBCZ-REEL
ADRV9029-HB/PCBZ
RF AND BASEBAND CIRCUIT;
ADRV9029-LB/PCBZ
ADRV9029-MB/PCBZ
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