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ADF7901BRU-REEL7

Analog Devices

ADF7901BRU-REEL7 by Analog Devices

ADF7901BRU-REEL7 by Analog Devices is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates at temperatures from 0 to 50 °C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,823 parts In-Stock

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6,823

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Digiode

USA . 584 parts In-Stock

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584

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Distributors (Availability)

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Native Components

USA . 28 parts In-Stock

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$0.292

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$0.281

28

$0.292

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$0.281

Northwest PG Solutions

USA . 1,876 parts In-Stock

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$0.322

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$0.284

1,876

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$0.284

Parana Technologies

USA . 1,632 parts In-Stock

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$10.504

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$9.769

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1,632

$10.504

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$9.769

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IDEA Electronic Components Group

UK . 1,818 parts In-Stock

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$11.295

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$10.730

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$10.730

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1,818

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$10.730

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DigiPath Technology Company

USA . 2,079 parts In-Stock

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$17.620

100+ parts

$16.915

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$16.915

2,079

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$16.915

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$16.915

AZTECH Wire

Italy . 659 parts In-Stock

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$19.146

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659

$19.146

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Semicontronic

India . 595 parts In-Stock

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$283.000

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$275.925

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$274.510

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595

$283.000

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One Stop Electronics

USA . 1,569 parts In-Stock

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$539.000

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1,569

$539.000

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Corphita

USA . 203 parts In-Stock

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Overview

Experience the cutting-edge technology of Analog Devices with the ADF7901BRU-REEL7, a high-quality Cellphone IC. With a compact design and versatile applications, this product offers unmatched value for customers seeking reliable performance in their electronic devices. Trust in Analog Devices' reputation for excellence and innovation, and elevate your products with the advantages that the ADF7901BRU-REEL7 brings.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the ICs less prone to damage during handling and installation.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Power Supplies (V): 3

Operating at a low voltage of 3V helps in reducing power consumption and heat generation, making it more energy-efficient.

No. of Terminals: 24

Having 24 terminals provides connectivity options for various components and peripherals, enhancing the versatility of the IC.

Maximum Operating Temperature: 50 °C

With a high maximum operating temperature of 50 °C, the IC can function reliably in elevated temperature environments without performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures that the IC can operate efficiently in cold conditions without any issues.

Terminal Finish: TIN LEAD

The Tin Lead terminal finish provides good solderability and reliability during the assembly process, ensuring a strong connection.

Temperature Grade: COMMERCIAL

Rated for commercial temperature range, the IC is suitable for standard operating environments, making it ideal for a wide range of applications.

Technical Specifications

Cellphone ICs ADF7901BRU-REEL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

240

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ADF7901BRU-REEL7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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