Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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ST25R3913-AQFT from STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.
Median Price
-
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Anansix
Digiode
IDEA Electronic Components Group
$7.810
$7.029
MKK Technologies
$14.686
DigiPath Technology Company
AZTECH Wire
$16.170
Corphita
Parana Technologies
$9.338
The surface mount capability allows for efficient and compact integration on PCBs, making it ideal for modern, space-constrained designs.
A square package shape maximizes board space utilization and simplifies layout design, enhancing overall performance.
With 32 terminals, this IC supports a complex array of functions, making it suitable for advanced applications in mobile devices.
This package style provides enhanced thermal management and low-profile design, ensuring reliable operation in tight spaces.
This high operating temperature rating ensures reliability and performance in demanding automotive applications.
The ability to function in extreme cold conditions makes this IC suitable for use in various environmental settings, particularly in automotive applications.
The quad terminal position allows for efficient mounting and connection, simplifying PCB layout and assembly processes.
A low seated height contributes to a compact design, making it ideal for slim devices without compromising on performance.
With a width of just 5 mm, this IC is suitable for miniaturized designs, helping to meet the demands of modern consumer electronics.
The compact length ensures a small footprint on the PCB, enabling more efficient use of available space for design flexibility.
Designed for automotive applications, this temperature grade signifies durability and reliability under rigorous conditions, ensuring safety in critical systems.
No lead design means less material usage and a more eco-friendly product while providing optimal electrical performance.
As an RF and baseband circuit, this IC is perfect for communication applications, facilitating high-quality signal processing for mobile and wireless devices.
Operating at a nominal supply voltage of 3.3 V ensures compatibility with a wide range of digital circuits and lower power consumption.
A 0.5 mm terminal pitch allows for high-density packaging on PCBs, which is ideal for modern devices requiring compact layouts.
Cellphone ICs ST25R3913-AQFT attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
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ST25R3913-AQFT Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - DK OBS NOTICE
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
1N4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
First Components International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
Mde Semiconductor
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
Comchip Technology
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
Rectron
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Jiangsu Jiejie Microelectronics
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LMV226TL
LMV226TL by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has a nominal voltage of 2.7V. This RF and baseband circuit IC is designed for telecom applications requiring precise performance in compact spaces.
HMC683LP6CE
Analog Devices
Analog Devices' HMC683LP6CE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at 5V supply voltage. The compact 0.9mm height and 0.5mm terminal pitch make it ideal for space-constrained designs.
LMV228SD/NOPB
LMV228SD/NOPB by Texas Instruments is a cellphone IC with small outline, heat sink, and very thin profile. It operates at 260°C peak reflow temperature, consuming 8mA max supply current. Ideal for RF and baseband circuits in telecom applications due to its dual terminal position and matte tin finish.
MAX2608EUT+T
Analog Devices' MAX2608EUT+T is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This baseband circuit has a nominal voltage of 2.75V and peak reflow temperature of 260°C, making it ideal for telecom applications.
CC2420-RTB1
CC2420-RTB1 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, RF and baseband circuitry, and CMOS technology. This chip carrier has a square shape, very thin profile, and nickel palladium gold finish for industrial-grade applications.
WFM200S022XNA2
Silicon Labs
Cellular Telephone Circuits; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
CC1070RSQ
The Texas Instruments CC1070RSQ is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.
HMC686LP4TR
Analog Devices' HMC686LP4TR is a 24-terminal cellphone IC in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features BICMOS technology for RF and baseband circuits with a nominal voltage of 5V.
ADF7901BRUZ-REEL
Analog Devices' ADF7901BRUZ-REEL is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w 0 °C to 50°C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications requiring surface mount technology.
ADF7025BCPZ-RL7
Analog Devices' ADF7025BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a 3V supply voltage, 0.5mm terminal pitch, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
SKY85747-11
Skyworks Solutions
SKY85747-11 by Skyworks Solutions is a cellphone IC with 24 terminals in a rectangular package. It operates b/w -40°C to 85°C, with a max supply current of 500mA at 5V. This RF and baseband circuit is ideal for telecom applications due to its compact size and heat sink design.
HMC485MS8GETR
Analog Devices' HMC485MS8GETR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
TRF4900PWRG4
TRF4900PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, suitable for surface mount with a temperature range of -20 to 60°C.
AD6673BCPZRL7-250
AD6673BCPZRL7-250 by Analog Devices is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and consumes 0.282mA current. This CMOS technology baseband circuit comes in a square chip carrier package suitable for industrial applications.
CC113LRTKT
The Texas Instruments CC113LRTKT is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
TLV321AC37IDW
TLV321AC37IDW by Texas Instruments is a 20-terminal cellphone IC with CMOS technology, operating b/w -40 to 85°C. Its small outline package measures 7.5mm in width and 12.8mm in length, suitable for baseband circuit applications in the telecom industry due to its industrial temperature grade.
TS3A26746EYZPR
TS3A26746EYZPR by Texas Instruments is a 6-terminal cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range -40 to 85°C with 2 channels for baseband circuits at a nominal voltage of 3.3V. Ideal for compact mobile devices due to its small dimensions 1.4mm x 0.9mm x 0.5mm.
LMH6523SQ/NOPB
LMH6523SQ/NOPB by Texas Instruments is a 54-terminal cellphone IC with a rectangular package style. It operates in industrial temperature range (-40 to 85°C) and has 4 channels for RF and baseband circuits. With a max gain tolerance of 25.74 dB, it consumes up to 485 mA at nominal voltage of 5V, making it suitable for telecom applications.
MAX2685EEE+T
MAX2685EEE+T by Analog Devices is a 16-terminal cellphone IC in small outline package. With operating temp range of -40 to 85 °C, it's ideal for RF and baseband circuits. Features include matte tin finish, shrink pitch style, and 3V supply voltage.
MAX5863E/D
Analog Devices' MAX5863E/D is a cellphone IC with CMOS technology, operating b/w -40 °C to 85°C. It features a 3V supply voltage, suitable for RF and baseband circuits. This surface-mount chip has tin-lead finish and is ideal for industrial telecom applications.
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ST25R3911B-AQFT
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ST25R3916-AQWT
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ST25R3911B-AQWT
RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
ST25R3912-AWLT
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 30; Package Code: VFBGA; Package Shape: RECTANGULAR;
ST25R3920B-AQWT
RF AND BASEBAND CIRCUIT;
ST25R3918AQWT
ST25R3912-AQWT
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ST25R3911B-ASWB
ST25R3920AQWT
ST25R36911B-AQFT
ST25R3911B-AQFB
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
ST25R3911B-AQWB
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
ST25R3911B-ASWT
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN;
ST25R3912-AQFT
RF AND BASEBAND CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
ST25R3913-AQWT
ST25R3913-AWLT
Supply Digital Components
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