Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SARA-R412M-02B by U-blox Ag is a Cellphone IC with 96 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a nominal voltage of 3.8V, this surface-mount IC measures 16mm x 26mm and has a low seated height of 2.78mm suitable for compact devices.
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Surface mount packaging allows for compact and efficient assembly on circuit boards, saving space and reducing production costs.
Rectangular shape is common and easy to handle during manufacturing and integration into electronic devices.
Having a high number of terminals allows for more connections and functions to be integrated into the IC, increasing its versatility.
Grid array packaging provides high terminal density and excellent thermal performance, ensuring reliable operation under various conditions.
With a high maximum operating temperature, this IC can withstand demanding usage environments without overheating.
Having a low minimum operating temperature ensures the IC can function reliably even in cold environments.
Bottom terminal position simplifies PCB layout and assembly, facilitating manufacturing processes.
Low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.
Compact width dimension enables the IC to be integrated into smaller devices, contributing to overall miniaturization.
Moderate length dimension provides a balance between functionality and space efficiency in device designs.
Butt terminal form is commonly used and ensures reliable electrical connections during assembly and operation.
Combining RF and baseband circuitry in a single IC offers comprehensive communication capabilities, making it suitable for telecom applications.
Optimal nominal supply voltage ensures stable and efficient operation of the IC within specified performance parameters.
MSL 4 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage during assembly and storage.
Cellphone ICs SARA-R412M-02B attributes and parameters. Explore more Cellphone ICs devices from U-blox Ag
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
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Maximum Time At Peak Reflow Temperature (s):
Width:
SARA-R412M-02B Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - SARA-R412M-0 Hardware Rev 5/Mar/2021
PCN Design/Specification - SARA-R412 FW 21-Apr-2022
PCN Other - Service 14-Jun-2022
Our world is moving fast, soon your car will drive itself and you will carry your doctor in your pocket. Your home will power the grid and you will be connected like never before. At u-blox we are setting the beat delivering the core technology to locate and wirelessly connect people, machines and everything else making us the agile and reliable partner that will take you beyond expectations. With our innovative products and services, we empower customers to locate their devices and connect them from silicon to cloud. Ever since three bright ETH doctorate students and their professor founded u-blox in 1997, two things have driven everything we do: a desire to innovate and a constant focus on giving our customers a real competitive edge.
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Synsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
B340A-13-F
Diodes Incorporated
B340A-13-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 3A max output current, and 0.5V max forward voltage. It is used for efficiency applications in electronics due to its small outline package and high operating temperature range of -55°C to 150°C.
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
LM358AN
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
Semitronics
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
ADF7025BCPZ
Analog Devices
Analog Devices' ADF7025BCPZ is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85 °C, with power supplies of 2.5/3.3V. Ideal for baseband circuits, it has a very thin profile and matte tin finish for industrial telecom applications.
ADRF5549BCPZN
Analog Devices' ADRF5549BCPZN is a 40-terminal cellphone IC with a square package shape and chip carrier style. Operating b/w -40 to 105 °C, it's ideal for RF and baseband circuits in telecom applications. With a terminal pitch of 0.5mm and no-lead form, this industrial-grade IC has a nominal voltage of 5V.
HMC422MS8TR
Analog Devices' HMC422MS8TR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications due to its compact size and dual terminal position.
CC1070RGWR
Texas Instruments
The Texas Instruments CC1070RGWR is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105°C and has a supply voltage of 3V. This RF and baseband circuit uses CMOS technology, making it suitable for industrial telecom applications.
AD6653BCPZ-80
AD6653BCPZ-80 by Analog Devices is a cellphone IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This baseband circuit has a nominal voltage of 1.8V and terminal pitch of 0.5mm, making it ideal for telecom applications.
MAX2606EUT+T
MAX2606EUT+T by Analog Devices is a cellphone IC in small outline package with 6 terminals. Operating temp range -40 to 85°C, peak reflow temp 260°C. Telecom IC for baseband circuits with nominal voltage of 2.75V, ideal for industrial applications.
CC110LRTKR
CC110LRTKR by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V and terminal finish of NiPdAu. Ideal for RF and baseband circuits, it has a compact size of 4x4mm and is suitable for industrial temperature grades.
CC2511F8RSPG3
CC2511F8RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features RF and baseband circuit technology, with a nominal voltage of 3V for telecom applications.
TLV321AC36CN
TLV321AC36CN by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It has a rectangular package style, suitable for baseband circuits in commercial temperature grades. Dimensions are 7.62mm width, 24.325mm length, and 5.08mm seated height for through-hole mounting at temperatures ranging from 0 to 70°C.
MAX20461ATJA/V+
BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;
ADL5387ACPZ-R2
ADL5387ACPZ-R2 by Analog Devices is a 24-terminal cellphone IC with 5V power supply, operating from -40 to 85°C. It features a square surface mount package style and matte tin terminal finish. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.
ADF4360-8BCPZRL
Analog Devices' ADF4360-8BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85 °C.
TRF5901PT
TRF5901PT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, consuming 0.053mA at 3V supply voltage. This RF and baseband circuit uses CMOS technology for industrial applications.
HMC687LP4ETR
Analog Devices' HMC687LP4ETR is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial telecom applications. With matte tin finish and 5V supply voltage, it's ideal for RF and baseband circuits requiring surface mount assembly.
LMV228URX/NOPB
RF AND BASEBAND CIRCUIT; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
CC1150-RTY1
CC1150-RTY1 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and CMOS technology. This surface-mount chip carrier has a square shape, 0.65mm terminal pitch, and MSL level of 3 for industrial applications.
HPA00471RSSR
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
CC1111F8RSPG3
The Texas Instruments CC1111F8RSPG3 is a cellphone IC with 36 terminals in a square chip carrier package. Operating at 3V, it features RF and baseband circuit technology, suitable for telecom applications. With a temperature range of 0-85°C, this CMOS device has a terminal pitch of 0.5mm and is surface mountable.
MAX2029ETP+
MAX2029ETP+ by Analog Devices is a BICMOS technology Cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. Features include 5V supply voltage, peak reflow temp of 260°C, and 0.65mm terminal pitch.
LMH6522SQ/NOPB
LMH6522SQ/NOPB by Texas Instruments is a 54-terminal cellphone IC with a package style of CHIP CARRIER. It operates b/w -40 to 85°C, has 4 channels, and a gain tolerance of 25.74 dB. This RF and baseband circuit is ideal for industrial telecom applications due to its low supply current of 485 mA at 5V.
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SARA-R510M8S-00B
U-blox Ag
RF AND BASEBAND CIRCUIT;
SARA-R410M-02B
SARA-R410M-02B by U-blox Ag is a CELL IC with RECTANGULAR package, 96 terminals, and operates b/w -20 to 65 °C. It is used for RF and baseband circuits in telecom applications due to its 3.8V supply voltage and compact size of 16x26mm.
SARA-R410M-02B-01
SARA-R410M-02B-01 by U-blox Ag is a CELLPHONE IC with 96 terminals in a RECTANGULAR GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits. With a supply voltage of 3.8V, it's suitable for commercial telecom applications.
SARA-R422S-00B
SARA-R422S-01B
SARA-R422M8S-00B
SARA-R422-00B
SARA-R422M10S-01B
SARA-R500S-00B
SARA-R510AWS-01B
TELECOM CIRCUIT;
SARA-R410M-02B-04
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 96; Package Code: LGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 4;
SARA-R510S-01B
SARA-U201-04B-00
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 96; Package Code: BCC; Package Shape: RECTANGULAR;
SARA-R410M-02B-03
RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 96; Package Code: LGA; Package Shape: RECTANGULAR;
SARA-U201-03B-00
SARA-R500S-01B
SARA-R422-01B
SARA-R510M8S-61B
SARA-R412M-02B-03
SARA-R412M-02B-02
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 96; Package Code: LGA; Package Shape: RECTANGULAR; No. of Functions: 1;
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