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AFSC5G37D37T2

NXP Semiconductors

AFSC5G37D37T2 by NXP Semiconductors

RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

Median Price

$28.320

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RFMW

USA . 13 parts In-Stock

1+ parts

$22.680

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$22.680

-

-

-

Richardson RFPD

USA . 1,516 parts In-Stock

1+ parts

$25.700

100+ parts

$23.130

1k+ parts

-

10k+ parts

-

1,516

$25.700

$23.130

-

-

DigiKey

USA . 1,541 parts In-Stock

1+ parts

$49.180

100+ parts

$35.554

1k+ parts

$34.665

10k+ parts

$32.623

1,541

$49.180

$35.554

$34.665

$32.623

Chip1Stop

Japan . 1,720 parts In-Stock

1+ parts

-

100+ parts

$32.200

1k+ parts

$31.900

10k+ parts

-

1,720

-

$32.200

$31.900

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Verical

USA . 1,622 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,622

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-

-

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Rochester

USA . 535 parts In-Stock

1+ parts

-

100+ parts

$28.320

1k+ parts

$25.340

10k+ parts

$23.850

535

-

$28.320

$25.340

$23.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,157 parts In-Stock

1+ parts

$21.546

100+ parts

-

1k+ parts

-

10k+ parts

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3,157

$21.546

-

-

-

Vyrian

USA . 2,777 parts In-Stock

1+ parts

$22.680

100+ parts

-

1k+ parts

-

10k+ parts

-

2,777

$22.680

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-

-

Bristol Electronics

USA . 125 parts In-Stock

1+ parts

$36.000

100+ parts

$29.520

1k+ parts

-

10k+ parts

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125

$36.000

$29.520

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-

Anansix

USA . 2,009 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,009

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-

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Flip Electronics

USA . 535 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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535

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 462 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

-

10k+ parts

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462

$0.512

-

-

-

Northwest PG Solutions

USA . 1,649 parts In-Stock

1+ parts

$0.563

100+ parts

-

1k+ parts

-

10k+ parts

$0.497

1,649

$0.563

-

-

$0.497

Corphita

USA . 2,420 parts In-Stock

1+ parts

$20.412

100+ parts

-

1k+ parts

-

10k+ parts

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2,420

$20.412

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-

-

UNI Independent Distributors

Spain . 7,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,473

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-

-

-

Technical Specifications

Cellphone ICs AFSC5G37D37T2 attributes and parameters. Explore more Cellphone ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Telecom IC Type:

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

AFSC5G37D37T2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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