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AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.

Median Price

$235.970

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,500 parts In-Stock

1+ parts

$235.970

100+ parts

$221.810

1k+ parts

$207.650

10k+ parts

-

1,500

$235.970

$221.810

$207.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 425 parts In-Stock

1+ parts

$243.874

100+ parts

-

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425

$243.874

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Chip Stock

USA . 10,680 parts In-Stock

1+ parts

-

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10,680

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Vyrian

USA . 3,042 parts In-Stock

1+ parts

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3,042

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 9 parts In-Stock

1+ parts

$0.144

100+ parts

-

1k+ parts

-

10k+ parts

$0.139

9

$0.144

-

-

$0.139

Northwest PG Solutions

USA . 542 parts In-Stock

1+ parts

$0.159

100+ parts

-

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$0.140

542

$0.159

-

-

$0.140

Parana Technologies

USA . 3,745 parts In-Stock

1+ parts

$7.093

100+ parts

-

1k+ parts

$6.597

10k+ parts

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3,745

$7.093

-

$6.597

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IDEA Electronic Components Group

UK . 1,348 parts In-Stock

1+ parts

$7.627

100+ parts

-

1k+ parts

$7.246

10k+ parts

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1,348

$7.627

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$7.246

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DigiPath Technology Company

USA . 2,341 parts In-Stock

1+ parts

$11.898

100+ parts

$11.422

1k+ parts

-

10k+ parts

$11.422

2,341

$11.898

$11.422

-

$11.422

AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$12.700

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330

$12.700

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Semicontronic

India . 1,289 parts In-Stock

1+ parts

$218.200

100+ parts

$212.745

1k+ parts

$211.654

10k+ parts

-

1,289

$218.200

$212.745

$211.654

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Corphita

USA . 296 parts In-Stock

1+ parts

$231.039

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296

$231.039

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A-Z Elektronik GmbH

Germany . 3,375 parts In-Stock

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3,375

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RC Electronics

USA . 2,545 parts In-Stock

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2,545

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Alle Elektronik GmbH

Germany . 2,250 parts In-Stock

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2,250

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Component Stockers USA

USA . 1,252 parts In-Stock

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1,252

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Overview

Elevate your cellphone performance with the AD6657BBCZRL by Analog Devices, a cutting-edge RF and baseband circuit designed to enhance your communication experience. With a package style featuring a low profile and fine pitch, this industrial-grade IC offers superior quality and reliability. From seamless connectivity to improved signal processing, this innovative solution exceeds expectations. Trust Analog Devices for top-notch telecommunications ICs that deliver unparalleled value and benefits to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material ensures durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable makes it easier to mount and solder onto PCBs, saving space and making manufacturing processes more efficient.

Power Supplies (V): 1.8

The low power supply voltage of 1.8V helps in reducing power consumption and extending battery life in mobile devices.

No. of Terminals: 144

Having a high number of terminals allows for a greater level of connectivity and functionality within the IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, enhancing the longevity of the IC.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V ensures compatibility with a wide range of devices and power sources.

Technical Specifications

Cellphone ICs AD6657BBCZRL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

AD6657BBCZRL Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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