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Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.

Cellphone ICs

Available Parts 356

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Data Rate Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
TCM8030PN by Texas Instruments

TCM8030PN

Texas Instruments

Texas Instruments TCM8030PN is a cellphone IC with 80 terminals in a square package. It operates at -40 to 85°C, suitable for industrial use. With a supply voltage of 3V, it features CMOS technology and is ideal for baseband circuit applications.

S-PQFP-G80

12 mm

1

80

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP80,.55SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

NOT SPECIFIED

3/5

Not Qualified

1.6 mm

Other Telecom ICs

3 V

YES

CMOS

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.5 mm

QUAD

NOT SPECIFIED

12 mm

TRF4900PW by Texas Instruments

TRF4900PW

Texas Instruments

TRF4900PW by Texas Instruments is a 24-terminal cellphone IC with 3V supply voltage. It features CMOS technology, RF and baseband circuit for telecom applications. With a small outline package style, it operates b/w 0-70°C temperature range.

R-PDSO-G24

7.8 mm

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

MAX2338EGI by Maxim Integrated

MAX2338EGI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: VQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

SQUARE

CHIP CARRIER, VERY THIN PROFILE

Not Qualified

.8 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

MAX2021ETX by Maxim Integrated

MAX2021ETX

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e0

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC36,.25SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

245

5

Not Qualified

.8 mm

Other Telecom ICs

.315 mA

5 V

YES

BICMOS

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

MAX2041ETP-T by Maxim Integrated

MAX2041ETP-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.20SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5

Not Qualified

.8 mm

Other Telecom ICs

.145 mA

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX2041ETP by Maxim Integrated

MAX2041ETP

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC20,.20SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5

Not Qualified

.8 mm

Other Telecom ICs

.145 mA

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

MAX2531ETI by Maxim Integrated

MAX2531ETI

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.9 mm

2.75 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

TRF4400PWG4 by Texas Instruments

TRF4400PWG4

Texas Instruments

TRF4400PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

CC2420RTCR by Texas Instruments

CC2420RTCR

Texas Instruments

The Texas Instruments CC2420RTCR is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits, it features CMOS technology and nickel palladium gold terminal finish.

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8,1.8/3.3

Not Qualified

.9 mm

Other Telecom ICs

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2420RTC by Texas Instruments

CC2420RTC

Texas Instruments

CC2420RTC by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8V and 1.8/3.3V. Ideal for RF and baseband circuits due to its CMOS technology and compact size (7x7mm).

S-XQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8,1.8/3.3

Not Qualified

.9 mm

Other Telecom ICs

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

7 mm

CC2420ZRTC by Texas Instruments

CC2420ZRTC

Texas Instruments

CC2420ZRTC by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, CMOS technology, and RF/baseband circuitry. Ideal for telecom applications due to its compact square package and low profile design.

S-XQCC-N48

7 mm

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.8,1.8/3.3

Not Qualified

.9 mm

Other Telecom ICs

1.8 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

7 mm

MAX2039ETP-T by Maxim Integrated

MAX2039ETP-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;

S-XQCC-N20

e0

5 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

VQCCN

LCC20,.20SQ,25

SQUARE

CHIP CARRIER, VERY THIN PROFILE

5

Not Qualified

.8 mm

Other Telecom ICs

.135 mA

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.65 mm

QUAD

5 mm

ADF7021BCPZ by Analog Devices

ADF7021BCPZ

Analog Devices

Analog Devices' ADF7021BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, terminal pitch of 0.5mm, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact square package shape and surface-mount capability.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

40

7 mm

TRF4900PWG4 by Texas Instruments

TRF4900PWG4

Texas Instruments

TRF4900PWG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 0-70°C. It features a supply voltage of 2.5/3.3V and CMOS technology for RF and baseband circuits. The package is small outline, thin profile, with shrink pitch, suitable for telecom applications.

R-PDSO-G24

7.8 mm

1

24

70 Cel

0 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

SI4136-F-BT by Silicon Labs

SI4136-F-BT

Silicon Labs

SI4136-F-BT by Silicon Labs is a cellphone IC with 24 terminals, operating at 3/3.3V. It features a small outline package style and CMOS technology, suitable for RF and baseband circuits in telecom applications. With a temperature range of -40 to 85°C, it offers low supply current at 0.031mA for industrial-grade performance.

R-PDSO-G24

7.8 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.031 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

SI4136-F-GMR by Silicon Labs

SI4136-F-GMR

Silicon Labs

SI4136-F-GMR by Silicon Labs is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Telecom IC type for RF and baseband circuits, with nominal voltage of 3V.

S-XQCC-N28

e3

5 mm

3

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

Not Qualified

.9 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

5 mm

SI4136-F-GM by Silicon Labs

SI4136-F-GM

Silicon Labs

SI4136-F-GM by Silicon Labs is a Cellphone IC with 28 terminals in a square package. Operating at -40 to 85°C, it has a supply voltage of 3V and consumes 0.031mA max current. This RF and baseband circuit is ideal for cellphone applications due to its compact size and low power consumption.

S-XQCC-N28

e3

5 mm

3

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.031 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

5 mm

SI4136-F-GTR by Silicon Labs

SI4136-F-GTR

Silicon Labs

SI4136-F-GTR by Silicon Labs is a cellphone IC with 24 terminals in a small outline, thin profile package. Operating b/w -40 to 85°C, it features RF and baseband circuits for telecom applications. With matte tin finish and gull wing terminals, it's ideal for industrial use at 3V supply voltage.

R-PDSO-G24

e3

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

Not Qualified

1.2 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

4.4 mm

SI4136-F-GT by Silicon Labs

SI4136-F-GT

Silicon Labs

SI4136-F-GT by Silicon Labs is a cellphone IC with 24 terminals, operating at 3/3.3V. It features a small outline package style and CMOS technology, suitable for RF and baseband circuits in industrial telecom applications. With a temperature range of -40 to 85°C, it offers low supply current of 0.031mA for efficient performance.

R-PDSO-G24

e3

7.8 mm

3

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

3/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.031 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

GULL WING

.65 mm

DUAL

4.4 mm

MAX2308ETI-T by Maxim Integrated

MAX2308ETI-T

Maxim Integrated

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3/3.3

Not Qualified

.8 mm

Other Telecom ICs

.0415 mA

2.75 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

AD6650ABCZ by Analog Devices

AD6650ABCZ

Analog Devices

AD6650ABCZ by Analog Devices is a Cellphone IC with 121 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PBGA-B121

e1

12 mm

1

121

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

1.85 mm

3.3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

12 mm

MAX2150ETI-T by Maxim Integrated

MAX2150ETI-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N28

e0

5 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC28,.2SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3/3.3

Not Qualified

.9 mm

Other Telecom ICs

.107 mA

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

5 mm

CC1150RSTR by Texas Instruments

CC1150RSTR

Texas Instruments

The Texas Instruments CC1150RSTR is a cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8/3.6V and peak reflow temperature of 260°C. Ideal for RF and baseband circuits in industrial telecom applications due to its CMOS technology and compact size.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

CC1150RST by Texas Instruments

CC1150RST

Texas Instruments

CC1150RST by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V. This RF and baseband circuit has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.

S-XQCC-N16

e4

4 mm

3

1

16

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC16,.16SQ,25

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.65 mm

QUAD

30

4 mm

AD8341ACPZ-REEL7 by Analog Devices

AD8341ACPZ-REEL7

Analog Devices

AD8341ACPZ-REEL7 by Analog Devices is a 24-terminal cellphone IC with 5V power supply, operating b/w -40 to 85°C. It features RF and baseband circuitry in a square chip carrier package suitable for industrial applications.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.145 mA

5 V

YES

BIPOLAR

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

4 mm

TRF370333IRGER by Texas Instruments

TRF370333IRGER

Texas Instruments

TRF370333IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 5V and max current of 235mA. This RF and baseband circuit has a terminal pitch of 0.5mm, making it suitable for industrial telecom applications.

S-PQCC-N24

e4

4 mm

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

235 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TRF370333IRGETG4 by Texas Instruments

TRF370333IRGETG4

Texas Instruments

TRF370333IRGETG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and a compact square package suitable for surface mounting.

S-PQCC-N24

e4

4 mm

2

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

.235 mA

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

4 mm

MAX2058ETL-T by Maxim Integrated

MAX2058ETL-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MAX2058ETL by Maxim Integrated

MAX2058ETL

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N40

e0

6 mm

1

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

MAX9985ETX-T by Maxim Integrated

MAX9985ETX-T

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

QUAD

6 mm

MAX9985ETX by Maxim Integrated

MAX9985ETX

Maxim Integrated

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

S-XQCC-N36

e0

6 mm

1

1

36

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Not Qualified

.8 mm

5 V

YES

BICMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

NO LEAD

.5 mm

QUAD

6 mm

CC1000PW by Texas Instruments

CC1000PW

Texas Instruments

CC1000PW by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuitry for telecom applications, and CMOS technology in a small outline package suitable for industrial use.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000YZR by Texas Instruments

CC1000YZR

Texas Instruments

CC1000YZR by Texas Instruments is a Cellphone IC with 28 terminals in a rectangular package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

CC1000YZ by Texas Instruments

CC1000YZ

Texas Instruments

CC1000YZ by Texas Instruments is a cellphone IC with 28 terminals in a rectangular grid array package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a thin profile of 0.652mm, it supports power supplies of 2.5/3.3V for industrial-grade performance.

R-PBGA-B28

4.034 mm

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA28,4X7,20

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5/3.3

Not Qualified

.652 mm

Other Telecom ICs

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

2.339 mm

ADF7021BCPZ-RL7 by Analog Devices

ADF7021BCPZ-RL7

Analog Devices

Analog Devices' ADF7021BCPZ-RL7 is a cellphone IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for baseband circuits in telecom applications due to its compact square package shape and low profile design.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

7 mm

AD6657BBCZRL by Analog Devices

AD6657BBCZRL

Analog Devices

AD6657BBCZRL by Analog Devices is a cellphone IC with 144 terminals in a square grid array package. It operates b/w -40 to 85 °C, with a supply voltage of 1.8V for RF and baseband circuits. The low-profile, fine-pitch design makes it suitable for industrial telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD6657BBCZ by Analog Devices

AD6657BBCZ

Analog Devices

AD6657BBCZ by Analog Devices is a cellphone IC with 144 terminals in a square package. It operates b/w -40 to 85 °C and has a supply voltage of 1.8 V, suitable for RF and baseband circuits in telecom applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.8

Not Qualified

1.4 mm

Other Telecom ICs

1.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

ADL5387ACPZ-WP by Analog Devices

ADL5387ACPZ-WP

Analog Devices

ADL5387ACPZ-WP by Analog Devices is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, square package shape, and quad terminal position. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.

S-XQCC-N24

e3

4 mm

3

1

24

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC24,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

BIPOLAR

BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

4 mm

CC1101RTKR by Texas Instruments

CC1101RTKR

Texas Instruments

CC1101RTKR by Texas Instruments is a cellphone IC with power supplies of 1.8/3.6V, operating temperature range of -40 to 85°C, and RF & baseband circuit type. Its package style is chip carrier with very thin profile, suitable for industrial telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3 MSL.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

CC1101RTK by Texas Instruments

CC1101RTK

Texas Instruments

CC1101RTK by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a package style of chip carrier. Ideal for industrial applications requiring RF communication in compact form factors.

S-PQCC-N20

e4

4 mm

3

1

20

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC20,.16SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1.8/3.6

Not Qualified

.95 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

NO LEAD

.5 mm

QUAD

30

4 mm

TRF4400PWRG4 by Texas Instruments

TRF4400PWRG4

Texas Instruments

TRF4400PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.

R-PDSO-G24

7.8 mm

1

24

60 Cel

-20 Cel

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

NOT SPECIFIED

3

Not Qualified

1.2 mm

Other Telecom ICs

.075 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

.65 mm

DUAL

NOT SPECIFIED

4.4 mm

TRF3710IRGZT by Texas Instruments

TRF3710IRGZT

Texas Instruments

TRF3710IRGZT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 5V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

5

Not Qualified

1 mm

Other Telecom ICs

5 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

ACFM-7102-BLK by Broadcom

ACFM-7102-BLK

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Qualification: Not Qualified;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

ACFM-7102-TR1 by Broadcom

ACFM-7102-TR1

Broadcom

BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-X6

3

1

6

100 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Not Qualified

NO

BASEBAND CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

CC1000-RTB1 by Texas Instruments

CC1000-RTB1

Texas Instruments

CC1000-RTB1 by Texas Instruments is a cellphone IC with 28 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. This CMOS technology device has a small outline package style suitable for industrial applications.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

CC1000-RTR1 by Texas Instruments

CC1000-RTR1

Texas Instruments

CC1000-RTR1 by Texas Instruments is a cellphone IC with 28 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuit for telecom applications, and CMOS technology in a small outline package. Ideal for industrial use due to its nickel palladium gold finish and dual terminal position.

R-PDSO-G28

e4

9.7 mm

3

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

260

2.5/3.3

Not Qualified

1.2 mm

Other Telecom ICs

.001 mA

3 V

YES

CMOS

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

GULL WING

.65 mm

DUAL

30

4.4 mm

ADF7020-1BCPZ-RL by Analog Devices

ADF7020-1BCPZ-RL

Analog Devices

Analog Devices' ADF7020-1BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry, and a compact square package suitable for telecom applications.

S-XQCC-N48

e3

7 mm

3

1

48

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

2.5/3.3

Not Qualified

1 mm

Other Telecom ICs

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

MATTE TIN

NO LEAD

.5 mm

QUAD

30

7 mm

MAX4003EBL by Maxim Integrated

MAX4003EBL

Maxim Integrated

MAX4003EBL by Maxim Integrated is a CELLPHONE IC with 8 terminals in a SQUARE package. It features GRID ARRAY style, operates b/w -40 to 85°C, and has RF & BASEBAND CIRCUIT applications. The IC has a very thin profile of 0.67mm, uses TIN LEAD finish, and requires 3V supply voltage for operation.

S-PBGA-B8

e0

1.52 mm

1

1

8

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.67 mm

3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.5 mm

BOTTOM

1.52 mm