Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.Some common types of cellphone ICs include:1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.
Add filters
All
Selected
BGA7350,515
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N32
5 mm
1
32
85 Cel
-40 Cel
PLASTIC/EPOXY
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
5 V
YES
RF AND BASEBAND CIRCUIT
INDUSTRIAL
NO LEAD
.5 mm
QUAD
BGU7060Y
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;
S-PQCC-N16
8 mm
3
16
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
260
1.4 mm
1.42 mm
BGU7061,518
BGU7062,518
BGU7063,115
BGU7063,518
30
BLM6G10-30G,118
BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN;
R-PDSO-G16
e3
15.9 mm
SOP
RECTANGULAR
SMALL OUTLINE
245
3.6 mm
28 V
BASEBAND CIRCUIT
TIN
GULL WING
1.37 mm
DUAL
11 mm
BLM6G10-30G,135
BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Length: 15.9 mm;
Tin (Sn)
CC1150RGVT
Texas Instruments
The Texas Instruments CC1150RGVT is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates at temperatures ranging from -40 to 85°C, with a supply voltage of 3V and data rate of 0.5 Mbps. This surface-mount IC has 16 terminals in a square shape, ideal for industrial applications requiring compact design and high performance.
.5 Mbps
e4
4 mm
3 V
CMOS
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
.65 mm
CC1021RSST
The Texas Instruments CC1021RSST is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a data rate of 0.1536 Mbps, making it ideal for telecommunications applications.
.1536 Mbps
7 mm
STA8088TGATR
STMicroelectronics
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
MATTE TIN
40
SKY13524-639LF
Skyworks Solutions
SKY13524-639LF by Skyworks Solutions is a cellphone IC with 14 terminals in a square package style. Operating b/w -30°C to 90°C, it's ideal for RF and baseband circuits at 3.3V supply voltage. With a compact size of 1.6mm x 1.6mm and terminal pitch of 0.4mm, it's suitable for telecom applications requiring surface mount technology.
S-XQCC-N14
1.6 mm
14
90 Cel
-30 Cel
UNSPECIFIED
NOT SPECIFIED
3.3 V
OTHER
.4 mm
HMC832ALP6GETR
Analog Devices
Analog Devices' HMC832ALP6GETR is a cellphone IC with 40 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial telecom applications. It features RF and baseband circuits, operates at 3.3V, and has a compact size of 6x6mm with a terminal pitch of 0.5mm.
S-XQCC-N40
6 mm
.9 mm
HMC832ALP6GE
Analog Devices' HMC832ALP6GE is a 40-terminal cellphone IC with a square package shape and industrial temperature grade. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. This surface-mount IC has a nominal voltage of 3.3V and terminal pitch of 0.5mm, making it ideal for compact designs requiring high performance.
RFX2411
RFX2411 by Skyworks Solutions is a cellphone IC with 16 terminals in a square package. It operates b/w -40 to 125°C, suitable for automotive use. This RF and baseband circuit has a nominal voltage of 3.3V, utilizing CMOS technology for high performance in telecom applications.
S-XQCC-N16
3 mm
125 Cel
.6 mm
AUTOMOTIVE
RFX5000B
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
SKY65364-21
SKY65364-21 by Skyworks Solutions is a cellphone IC with 28 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications, with a nominal voltage of 3.3V. This surface mount IC in square package style is ideal for industrial use due to its compact size and quad terminal position.
S-XQMA-N28
28
MICROELECTRONIC ASSEMBLY
ST25R3912-AQFT
ST25R3912-AQFT by STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.
S-XQCC-N32
AD6688BBPZRL-3000
AD6688BBPZRL-3000 by Analog Devices is a CELLPHONE IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for INDUSTRIAL telecom applications. Features include 0.975V supply voltage, RF and baseband circuitry, and low profile design for compact devices.
S-PBGA-B196
12 mm
196
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.53 mm
.975 V
BALL
.8 mm
BOTTOM
SKY66291-11
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; No. of Terminals: 16; Terminal Position: UNSPECIFIED; Peak Reflow Temperature (C): 260;
S-XXSS-X16
SKY66292-11
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
HPA00420RGVR
Texas Instruments' HPA00420RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With nickel palladium gold finish, it offers a nominal voltage of 3V and terminal pitch of 0.65mm.
2
NICKEL PALLADIUM GOLD
HPA01083RGVR
Texas Instruments' HPA01083RGVR is a cellphone IC with 16 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for RF and baseband circuits. With a compact size of 4x4mm and no-lead terminal form, it suits industrial telecom applications.
HPA02142RGVR
Texas Instruments' HPA02142RGVR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it has a supply voltage of 3V and max current of 4mA. Ideal for RF and baseband circuits, this IC is surface mountable with nickel palladium gold finish.
LCC16,.16SQ,25
4 mA
HPA00452RSTR
Texas Instruments' HPA00452RSTR is a Cellphone IC with 16 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it features RF and baseband circuit technology, NO LEAD terminal form, and 3V supply voltage. Ideal for telecom applications requiring a compact design with high performance.
.95 mm
HPA00471RSSR
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
HPA00471RUZR
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4;
J-N3-B3E6-LR
Telit Communications Plc
Telit Communications Plc's J-N3-B3E6-LR is a cellphone IC with 24 terminals, operating temp. range of -40 to 85°C. It features RF and baseband circuits, suitable for telecom applications. The small outline package measures 12.2mm x 16mm with a seated height of 2.4mm, making it ideal for compact devices.
R-PDSO-N24
16 mm
24
SON
2.4 mm
12.2 mm
ADC31RF80IRMPT
Texas Instruments' ADC31RF80IRMPT is a 72-terminal cellphone IC with a square package shape and nickel palladium gold finish. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits in telecom applications. With a low profile of 0.9mm, it features a supply current of 1439mA at 1.15V nominal voltage.
S-XQCC-N72
10 mm
72
1439 mA
1.15 V
ADC31RF80IRMP
Texas Instruments' ADC31RF80IRMP is a cellphone IC with 72 terminals in a square chip carrier package. Operating from -40 to 85°C, it features RF and baseband circuits, 1.15V supply voltage, and 1439mA max current draw. Ideal for telecom applications due to its compact size and industrial temperature grade suitability.
ST25R3913-AQFT
ST25R3913-AQFT from STMicroelectronics is a compact RF and baseband circuit IC designed for automotive applications. It operates within -40 °C to 125 °C, features a 3.3V supply, and comes in a very thin profile with 32 terminals. Ideal for cellphone integration, it ensures reliable performance in demanding environments.
A2I25H060GNR1
RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
R-PDSO-G17
17.53 mm
17
HSOP
SMALL OUTLINE, HEAT SINK/SLUG
2.67 mm
LDMOS
9.02 mm
A2I25H060NR1
RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 17; Package Code: HSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;
MHT2001NR1
RF AND BASEBAND CIRCUIT; Terminal Finish: TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
AFE7799IABJ
AFE7799IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 85°C and features RF AND BASEBAND CIRCUIT for telecom applications. The package measures 17x17 mm with a terminal pitch of 0.8mm, making it suitable for compact mobile devices.
RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000
S-PBGA-B400
e1
17 mm
400
FBGA
GRID ARRAY, FINE PITCH
2.65 mm
TIN SILVER COPPER
ADRF5545ABCPZN
Analog Devices' ADRF5545ABCPZN is a 40-terminal cellphone IC with a square package shape and nickel palladium gold finish. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF and baseband circuit integration. The chip carrier has a very thin profile, measures 6x6 mm, and supports a nominal voltage of 5V.
105 Cel
LARA-R202-02B
U-blox Ag
LARA-R202-02B by U-blox Ag is a Cellphone IC with TS 16949 screening. Features RF and baseband circuit for telecom, operates at -20 to 65°C, and requires 3.8V supply voltage. Ideal for compact devices due to its small size of 24x26mm and low seated height of 2.87mm.
-40 to 85 extended operating temp available
R-XLGA-N100
26 mm
4
100
65 Cel
-20 Cel
LGA
LGA100(UNSPEC)
GRID ARRAY
TS 16949
2.87 mm
3.8 V
24 mm
AFSC5G26D37T2
RF AND BASEBAND CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD; Maximum Time At Peak Reflow Temperature (s): 40;
NICKEL GOLD
MWPR1124ZVHT
RF AND BASEBAND CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL GOLD;
ADRF5549BCPZN
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
ADRF5547BCPZN
Analog Devices' ADRF5547BCPZN is a 40-terminal cellphone IC with a square surface mount package. It operates b/w -40 to 105°C, ideal for industrial telecom applications. With a nominal voltage of 5V and RF front end circuit type, it offers high performance in a compact chip carrier package.
RF FRONT END CIRCUIT
S2-LPTXQTR
STMicroelectronics S2-LPTXQTR is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C. It features RF and baseband circuits, suitable for telecom applications with a nominal voltage of 3V.
S-XQCC-N24
LCC24,.16SQ,20
LX5584BLQ-TR
Microchip Technology
LX5584BLQ-TR by Microchip Technology is a Cellphone IC with 16 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for cellphone applications.
1.023 mm
AFE7920IABJ
AFE7920IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a terminal pitch of 0.8mm and measures 17x17mm, making it ideal for cellphone applications.
BGA400,20X20,32
A3I25X050NR1
RF AND BASEBAND CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
ADRF6650ACPZ-RL7
Analog Devices' ADRF6650ACPZ-RL7 is a 56-terminal cellphone IC with BICMOS technology, operating from -40 to 105 °C. It features RF and baseband circuits, suitable for telecom applications. The chip carrier package has a very thin profile, measuring 8mm x 8mm in size.
S-XQCC-N56
56
BICMOS
ADRF6650ACPZ
Analog Devices' ADRF6650ACPZ is a 56-terminal cellphone IC in a square chip carrier package. Operating from -40 to 105°C, it's ideal for RF and baseband circuits with a nominal voltage of 3.3V. Utilizing BiCMOS technology, this industrial-grade IC has a very thin profile at 0.8mm seated height.
SARA-R410M-63B
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 4;
© 2023 All rights reserved
