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S2-LPTXQTR

STMicroelectronics

S2-LPTXQTR by STMicroelectronics

STMicroelectronics S2-LPTXQTR is a cellphone IC with 24 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C. It features RF and baseband circuits, suitable for telecom applications with a nominal voltage of 3V.

Median Price

$138.530

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 3,170 parts In-Stock

1+ parts

$2.560

100+ parts

$1.750

1k+ parts

$1.420

10k+ parts

-

3,170

$2.560

$1.750

$1.420

-

Element14

Singapore . 3,690 parts In-Stock

1+ parts

$274.500

100+ parts

$202.860

1k+ parts

$145.890

10k+ parts

-

3,690

$274.500

$202.860

$145.890

-

EBV Elektronik

Germany . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 93 parts In-Stock

1+ parts

$1.678

100+ parts

-

1k+ parts

-

10k+ parts

-

93

$1.678

-

-

-

Digiode

USA . 1,143 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

-

10k+ parts

-

1,143

$2.318

-

-

-

TME

Poland . 16,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.650

16,000

-

-

-

$1.650

Anansix

USA . 2,793 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,793

-

-

-

-

Vyrian

USA . 2,166 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,925 parts In-Stock

1+ parts

$1.270

100+ parts

-

1k+ parts

-

10k+ parts

-

8,925

$1.270

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.678

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.678

-

-

-

Corphita

USA . 1,270 parts In-Stock

1+ parts

$2.196

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$2.196

-

-

-

IDEA Electronic Components Group

UK . 64 parts In-Stock

1+ parts

$15.383

100+ parts

-

1k+ parts

$13.845

10k+ parts

-

64

$15.383

-

$13.845

-

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$16.050

100+ parts

-

1k+ parts

-

10k+ parts

-

204

$16.050

-

-

-

Advanced Electronics

New Zealand . 28 parts In-Stock

1+ parts

$18.427

100+ parts

$16.769

1k+ parts

$15.110

10k+ parts

-

28

$18.427

$16.769

$15.110

-

MKK Technologies

India . 494 parts In-Stock

1+ parts

$28.927

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$28.927

-

-

-

DigiPath Technology Company

USA . 494 parts In-Stock

1+ parts

$28.927

100+ parts

-

1k+ parts

-

10k+ parts

-

494

$28.927

-

-

-

Continental Prestige Electronics

USA . 3,700 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

-

10k+ parts

-

3,700

-

$1.260

-

-

Parana Technologies

USA . 1,073 parts In-Stock

1+ parts

-

100+ parts

$18.393

1k+ parts

-

10k+ parts

-

1,073

-

$18.393

-

-

Overview

Upgrade your cellphone experience with the S2-LPTXQTR by STMicroelectronics. As a leading manufacturer in cellphone ICs, STMicroelectronics delivers unparalleled quality and reliability. This surface mount device boasts a square package shape with 24 terminals, making it ideal for a range of applications. With a maximum operating temperature of 105°C and a nominal supply voltage of 3V, this RF and baseband circuit offers exceptional performance. Trust STMicroelectronics to provide cutting-edge technology that enhances your device's functionality and efficiency. Experience the difference with the S2-LPTXQTR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto printed circuit boards, saving time and cost in the manufacturing process.

Package Shape: SQUARE

Square package shape provides a compact design that can easily fit into tight spaces, making it ideal for small and portable devices.

No. of Terminals: 24

Having 24 terminals allows for a wide range of input and output connections, enabling versatile functionality for the cellphone IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design for optimal performance and compactness.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand extreme heat conditions, enhancing its durability and reliability.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 volts allows for energy efficiency and compatibility with standard power sources, making it a practical choice for various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting, improving signal transmission and overall performance of the cellphone IC.

Technical Specifications

Cellphone ICs S2-LPTXQTR attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

S2-LPTXQTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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