Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.Some common types of cellphone ICs include:1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.
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TRF6901PTR
Texas Instruments
TRF6901PTR by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, with supply voltage of 2/3.3V and current draw of 0.04mA. Ideal for RF and baseband circuits in telecom applications due to its low profile design and fine pitch style.
S-PQFP-G48
e4
7 mm
1
48
85 Cel
-40 Cel
PLASTIC/EPOXY
LFQFP
QFP48,.35SQ,20
SQUARE
FLATPACK, LOW PROFILE, FINE PITCH
260
2/3.3
Not Qualified
1.6 mm
Other Telecom ICs
.04 mA
2.7 V
YES
RF AND BASEBAND CIRCUIT
INDUSTRIAL
NICKEL PALLADIUM GOLD
GULL WING
.5 mm
QUAD
30
MAX2620E/D
Maxim Integrated
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1;
X-XUUC-N
e0
UNSPECIFIED
DIE
UNCASED CHIP
240
3 V
BIPOLAR
TIN LEAD
NO LEAD
UPPER
20
MAX2620EUA
MAX2620EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C. Telecom IC type for RF and baseband circuits, suitable for industrial applications.
S-PDSO-G8
3 mm
8
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
.65 mm
DUAL
MAX9982ETP
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N20
5 mm
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.8 mm
5 V
BICMOS
MAX9989ETP
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;
VQCCN
CHIP CARRIER, VERY THIN PROFILE
MAX1958ETP
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
245
3.6 V
BASEBAND CIRCUIT
MAX1959ETP
MAX4003EBL-T
MAX4003EBL-T by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits. With a very thin profile of 0.67mm, it has a terminal pitch of 0.5mm ideal for telecom applications.
S-PBGA-B8
1.52 mm
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.67 mm
CMOS
BALL
BOTTOM
MAX4003EUA
MAX4003EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.
TRF5901PT
TRF5901PT by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates at -40 to 85°C, consuming 0.053mA at 3V supply voltage. This RF and baseband circuit uses CMOS technology for industrial applications.
3
.053 mA
AD6635BB
Analog Devices
AD6635BB by Analog Devices is a Cellphone IC with 324 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5V and 3.3V. This BASEBAND CIRCUIT technology uses CMOS and is suitable for industrial telecom applications.
S-PBGA-B324
19 mm
324
BGA
BGA324,18X18,40
GRID ARRAY
225
2.5,3.3
3.5 mm
2.5 V
TIN LEAD SILVER
1 mm
MAX2046ETJ-T
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N32
32
MAX2010ETI-T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N28
28
LCC28,.2SQ,20
5
.0121 mA
ADF4360-7BCPZRL
Analog Devices' ADF4360-7BCPZRL is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
S-XQCC-N24
e3
4 mm
24
LCC24,.16SQ,20
3.3
3.3 V
MATTE TIN
DSL01-010SC5
STMicroelectronics
DSL01-010SC5 by STMicroelectronics is a compact baseband circuit IC designed for cellphone applications. It features a 5-terminal gull-wing design with a peak reflow temp of 260 °C and max time at peak of 30s. Its plastic/epoxy package ensures durability in mobile devices.
R-PDSO-G5
RECTANGULAR
SMALL OUTLINE
DSL01-024SC5
DSL01-024SC5 by STMicroelectronics is a compact baseband circuit IC designed for cellphone applications. It features a 5-terminal gull-wing design with a peak reflow temp of 260 °C and a max time at peak of 30s. Its plastic/epoxy package ensures durability in mobile devices.
ADF4360-8BCPZRL
Analog Devices' ADF4360-8BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85 °C.
TRF6903PTR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
2.5/3.3
GC5316IZED
GC5316IZED by Texas Instruments is a Cellphone IC with 388 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.5V and 3.3V. This RF and baseband circuit has a terminal pitch of 1mm, making it ideal for telecom applications.
S-PBGA-B388
e1
27 mm
388
HBGA
BGA388,26X26,40
GRID ARRAY, HEAT SINK/SLUG
1.5,3.3
2.5 mm
1.5 V
TIN SILVER COPPER
TRF4903PW
TRF4903PW by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and max supply current of 0.042mA. It features RF and baseband circuits for telecom applications, in a small outline package suitable for industrial temperature range.
R-PDSO-G24
7.8 mm
TSSOP24,.25
NOT SPECIFIED
2.7
1.2 mm
.042 mA
4.4 mm
MAX2388EGC-T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: SQUARE;
S-XQCC-N12
12
.9 mm
MAX2620EUA-T
MAX2620EUA-T by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature ranges from -40 to 85°C. It's a RF and baseband circuit for telecom applications with nominal voltage of 3V.
MAX2685EEE-T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
R-PDSO-G16
4.89 mm
16
SSOP
SMALL OUTLINE, SHRINK PITCH
1.73 mm
.635 mm
3.9 mm
MAX2690EUB-T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G10
10
1.092 mm
2.9465 mm
MAX4003EUA-T
MAX4003EUA-T by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, RF and baseband circuit for telecom applications.
MAX5865ETM-T
MAX5865ETM-T by Maxim Integrated is a 48-terminal cellphone IC with 2 channels. It operates b/w -40 to 85°C, offering an output voltage of up to 3V in OFFSET BINARY code. Ideal for RF and baseband circuits, this CMOS technology chip has a compact square package style suitable for telecom applications.
DIFFERENTIAL
S-XQCC-N48
2
VOLTAGE
OFFSET BINARY
LCC48,.27SQ,20
1.8,3.3
Codecs
MAX9989ETP-T
AD6636BBCZ
Analog Devices' AD6636BBCZ is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, making it ideal for telecom applications.
S-PBGA-B256
17 mm
256
1.85 mm
1.8 V
AD6636CBCZ
AD6636CBCZ by Analog Devices is a Cellphone IC with 256 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 1.8V, making it ideal for cellphone applications.
AD8340ACPZ-WP
AD8340ACPZ-WP by Analog Devices is a cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, with a supply voltage of 5V and max current draw of 0.15mA. This RF and baseband circuit technology is ideal for industrial telecom applications requiring very thin profile components.
.15 mA
AD8348ARUZ
AD8348ARUZ by Analog Devices is a Cellphone IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 5V and uses BIPOLAR technology for BASEBAND CIRCUIT in telecom applications. The package is RECTANGULAR, PLASTIC/EPOXY material, with GULL WING terminals and a small outline of 9.7mm x 4.4mm x 1.2mm dimensions.
R-PDSO-G28
9.7 mm
TSSOP28,.25
ADF4360-0BCPZ
Analog Devices' ADF4360-0BCPZ is a 24-terminal cellphone IC with 3.3V supply, operating from -40 to 85°C. It features BICMOS tech, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package style.
ADF4360-0BCPZRL
Analog Devices' ADF4360-0BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package style with a very thin profile for industrial use.
ADF4360-1BCPZ
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
ADF4360-2BCPZ
Analog Devices' ADF4360-2BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.
ADF4360-3BCPZ
ADF4360-3BCPZ by Analog Devices is a cellphone IC with a square package shape and 24 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.3 V. This IC is commonly used in baseband circuit applications.
ADF4360-3BCPZRL
Analog Devices ADF4360-3BCPZRL is a 24-terminal cellphone IC with 3.3V power supply, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in industrial telecom applications due to its compact square chip carrier package style.
ADF4360-3BCPZRL7
Analog Devices' ADF4360-3BCPZRL7 is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, -40 to 85°C temperature range, and matte tin finish. Ideal for baseband circuits in telecom applications due to its compact square package and low profile design.
ADF4360-4BCPZ
Analog Devices' ADF4360-4BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial settings.
ADF4360-4BCPZRL
Analog Devices' ADF4360-4BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features BICMOS technology, quad terminal position, and matte tin finish. Ideal for baseband circuits in telecom applications, it has a compact square package with a very thin profile and can withstand industrial temperatures from -40 to 85°C.
ADF4360-5BCPZ
Analog Devices' ADF4360-5BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, BICMOS technology, and -40 to 85 °C operating temperature range. It features a square package shape, matte tin finish, and quad terminal position. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
ADF4360-6BCPZ
Analog Devices' ADF4360-6BCPZ is a 24-terminal cellphone IC with 3.3V supply voltage, operating from -40 to 85 °C. It features BICMOS technology, matte tin finish, and quad terminal position for baseband circuit applications in industrial telecom settings.
ADF4360-6BCPZRL7
Analog Devices' ADF4360-6BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for baseband circuits in industrial telecom applications due to its compact square package and low profile design.
TRF4903PWR
TRF4903PWR by Texas Instruments is a cellphone IC with 24 terminals, operating voltage of 2.7V, and low supply current of 0.043mA. It features RF and baseband circuits for telecom applications. The package is small outline, thin profile, suitable for surface mount with a rectangular shape made of plastic/epoxy material.
.043 mA
CC1020RUZR
The Texas Instruments CC1020RUZR is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
S-PQCC-N32
LCC32,.27SQ,25
CC1020RUZ
The Texas Instruments CC1020RUZ is a cellphone IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC1101RTKG3
CC1101RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8-3.6V. It features a square shape, nickel palladium gold finish, and industrial temperature grade suitable for RF and baseband circuits. This chip carrier has a very thin profile, measures 4x4mm in size, and can withstand peak reflow temperatures up to 260°C in surface mount applications.
S-PQCC-N20
LCC20,.16SQ,20
1.8/3.6
.95 mm
CC1101RTKRG3
CC1101RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V. This RF and baseband circuit is ideal for industrial telecom applications due to its compact size and surface-mount capability.
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