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ADF4360-6BCPZRL7

Analog Devices

ADF4360-6BCPZRL7 by Analog Devices

Analog Devices' ADF4360-6BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates b/w -40 to 85 °C, suitable for baseband circuits in industrial telecom applications due to its compact square package and low profile design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 3,240 parts In-Stock

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Semi Source

USA . 1,500 parts In-Stock

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1,500

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Digiode

USA . 699 parts In-Stock

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699

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Vigor

Singapore . 7,313 parts In-Stock

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$4.390

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$4.390

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Parana Technologies

USA . 3,458 parts In-Stock

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$9.337

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$8.684

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$9.337

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$8.684

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IDEA Electronic Components Group

UK . 812 parts In-Stock

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$10.040

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$9.538

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812

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$15.662

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$15.036

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$15.036

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$15.662

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$15.036

AZTECH Wire

Italy . 307 parts In-Stock

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$19.712

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Semicontronic

India . 674 parts In-Stock

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$567.000

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$552.825

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$549.990

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674

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One Stop Electronics

USA . 819 parts In-Stock

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$738.000

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819

$738.000

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Kepictronics

USA . 4,500 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

USA . 2,991 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,319 parts In-Stock

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Native Components

USA . 453 parts In-Stock

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453

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Northwest PG Solutions

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284

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Corphita

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246

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Overview

Elevate your cellphone technology with the ADF4360-6BCPZRL7 by Analog Devices. Known for their superior quality and innovation, Analog Devices delivers cutting-edge solutions for the telecom industry. This Surface Mount IC offers exceptional performance and reliability, making it ideal for a wide range of applications. With a compact square package shape and low power consumption, this product provides value and efficiency to customers. Upgrade your devices with the ADF4360-6BCPZRL7 and experience the difference Analog Devices can make in your technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto printed circuit boards, making the product suitable for automated manufacturing processes.

Package Shape: SQUARE

The square package shape provides a compact design, optimizing space utilization within a device.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V ensures efficient power consumption and compatibility with standard power supplies.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The multiple package styles offer flexibility in design integration, with options for heat dissipation and thin profile for slim device form factors.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand extended use in various environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably even in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good solderability and corrosion resistance, enhancing the product's reliability.

Technology: BICMOS

Utilizing Bipolar CMOS technology combines the advantages of both technologies, offering high performance and low power consumption in a single product.

Nominal Supply Voltage: 3.3 V

Operating at a standard supply voltage of 3.3V simplifies integration into existing systems and ensures compatibility with common power sources.

Technical Specifications

Cellphone ICs ADF4360-6BCPZRL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

ADF4360-6BCPZRL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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