Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MAX2620EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C. Telecom IC type for RF and baseband circuits, suitable for industrial applications.
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Kepictronics
Authorized Procurement Solutions
ChipstoGo Electronic ltd
The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronics.
This feature allows for easy installation and space-saving on printed circuit boards, making it convenient for compact designs.
The square shape helps optimize space utilization on circuit boards, providing efficient design layouts.
With 8 terminals, this product offers connectivity options for various functions, enhancing its versatility in cellphone applications.
The small outline, thin profile, and shrink pitch package style contribute to a compact form factor, perfect for slim cellphone designs.
The high operating temperature range ensures reliability under varying environmental conditions, enhancing the product's performance and longevity.
With a low minimum operating temperature, this product can withstand extreme cold environments, ensuring consistent functionality.
The tin-lead terminal finish provides excellent solderability and reliability, making it easy to integrate and maintain in cellphone manufacturing processes.
The dual terminal position offers increased connectivity options and flexibility in circuit board layout, making it suitable for complex cellphone configurations.
The low seated height contributes to a sleek and compact design, essential for thin and lightweight cellphone designs.
The 3mm width allows for efficient space utilization on circuit boards, enabling a compact and streamlined cellphone layout.
The short time at peak reflow temperature ensures reliable soldering during manufacturing processes, ensuring consistent performance in cellphone assembly.
The high peak reflow temperature allows for secure and robust solder joints, essential for maintaining connectivity and functionality in cellphone applications.
The 3mm length contributes to a compact overall footprint, ideal for space-constrained cellphone designs.
The industrial temperature grade ensures consistent performance across a wide range of operating conditions, making it suitable for rugged cellphone applications.
The bipolar technology used in this product offers high-speed performance and precise signal processing, enhancing the overall functionality of cellphones.
The gull-wing terminal form provides reliable contact and ease of soldering, ensuring secure connections in cellphone circuitry.
This product integrates RF and baseband circuitry, essential for seamless communication and data processing in cellphone networks.
The 3V nominal supply voltage ensures compatibility with standard power sources, making this product easy to integrate into cellphone designs.
The 0.65mm terminal pitch offers precise connections and efficient routing of signals, enabling high-density integration in cellphone circuit boards.
Cellphone ICs MAX2620EUA attributes and parameters. Explore more Cellphone ICs devices from Maxim Integrated
JESD-30 Code:
JESD-609 Code:
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MAX2620EUA Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev OBS 15/Jul/2015
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
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Vivek Jain
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Cavite
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489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138W-7-F
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Transistor & Electronic
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bytesonic Electronics
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
LM317T/NOPB
LM317T/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount with three terminals for easy installation.
Db Lectro
MAX2605EUT+
Analog Devices
MAX2605EUT+ by Analog Devices is a Cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Telecom applications benefit from its baseband circuit and low profile design.
RFFM6903SR
Rf Micro Devices
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 28; Package Code: HLGA; Package Shape: SQUARE;
TRF370417IRGER
TRF370417IRGER by Texas Instruments is a cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 5V and max current of 0.245mA. This RF and baseband circuit has a terminal pitch of 0.5mm, suitable for industrial telecom applications.
LMV227SD/NOPB
LMV227SD/NOPB by Texas Instruments is a cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
HMC818LP4ETR
Analog Devices' HMC818LP4ETR is a 24-terminal cellphone IC in a square chip carrier package with very thin profile. It operates b/w -40 °C to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at 3V supply voltage.
CC2400-STB1
CC2400-STB1 by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, making it ideal for telecom applications.
MAX5865ETM+T
Analog Devices' MAX5865ETM+T is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. Matte Tin finish, 0.8mm height, and 3V supply voltage are key specs for this versatile IC.
CC1101RTKRG3
CC1101RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V. This RF and baseband circuit is ideal for industrial telecom applications due to its compact size and surface-mount capability.
ADRF6658BCPZ
Analog Devices' ADRF6658BCPZ is a 48-terminal cellphone IC with a square package shape and matte tin terminal finish. Operating b/w -40 to 105 °C, it's ideal for RF and baseband circuits in telecom applications. With a compact size of 7x7mm and no-lead terminal form, it offers industrial-grade performance at 3.3V supply voltage.
ADF7021-NBCPZ-RL7
Analog Devices ADF7021-NBCPZ-RL7 is a 48-terminal cellphone IC with 2.5/3.3V power supplies, operating from -40 to 85°C. It features CMOS technology, NO LEAD terminal form, and is ideal for BASEBAND CIRCUIT applications due to its compact square package style and industrial temperature grade suitability.
CC2511F16RSPG3
CC2511F16RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a supply voltage of 3V, this IC is surface mountable and has a terminal pitch of 0.5mm.
MAX2306ETI
Analog Devices' MAX2306ETI is a cellphone IC with 28 terminals, operating at -40 to 85 °C. It has a supply voltage of 3/3.3V and low current draw of 0.0415mA. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package design.
LE910C1EU10T100700
Telit Communications Plc
Telit's LE910C1EU10T100700 is a CELL IC with RF & baseband circuit. Operates b/w -40°C to 85°C, with 3.8V supply voltage. MICROELECTRONIC ASSEMBLY package style, ideal for compact cellphone applications due to its small form factor of 28.2mm x 28.2mm x 2.2mm.
ADRV9010BBCZ-REEL
Analog Devices' ADRV9010BBCZ-REEL is a cellphone IC with 289 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 110°C and supports RF and baseband circuits at a nominal voltage of 1V. Ideal for telecom applications requiring precise signal processing in compact devices.
TLV320AC56CDWR
TLV320AC56CDWR by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It is a BASEBAND CIRCUIT for telecom applications, operating b/w 0-70°C in small outline package style.
SA638
SA638 by NXP Semiconductors is a Cellphone IC with 24 terminals, operating at temperatures from -40 to 85°C. It features BICMOS technology, GULL WING terminals, and supports RF and baseband circuits. The package is small outline, thin profile, with shrink pitch and made of plastic/epoxy for surface mount applications.
SKY65933-11
Skyworks Solutions
SKY65933-11 by Skyworks Solutions is a cellphone IC with 16 terminals in a square MICROELECTRONIC ASSEMBLY package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 1.8V, ideal for telecom applications.
CC1131IRHBRG4Q1
CC1131IRHBRG4Q1 by Texas Instruments is a cellphone IC with 32 terminals, operating at -40 to 85°C. It features RF and baseband circuits, operates at 3V, and has a data rate of 0.25 Mbps. This chip carrier package is suitable for industrial applications requiring high-speed communication in compact devices.
LP3939ILQ
LP3939ILQ by Texas Instruments is a cellphone IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, nominal voltage of 3V, and terminal pitch of 0.5mm for telecom applications.
TLV320AC57DW
TLV320AC57DW by Texas Instruments is a cellphone IC with 20 terminals, operating b/w -40 to 85°C. It has a small outline package style and gull wing terminal form, suitable for baseband circuits in telecom applications. The package dimensions are 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact designs.
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MAX2606EUT+T
MAX2606EUT+T by Analog Devices is a cellphone IC in small outline package with 6 terminals. Operating temp range -40 to 85°C, peak reflow temp 260°C. Telecom IC for baseband circuits with nominal voltage of 2.75V, ideal for industrial applications.
Maxim Integrated
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
MAX2606EUT-T
MAX2620EUA+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
MAX2620EUA+T by Analog Devices is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
MAX2620EUA-T
MAX2902ETI+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2029ETP+
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2044ETP+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2042AETP+
MAX2044ETP+T
MAX20461AATJA/V+
BASEBAND CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Matte Tin (Sn) - annealed;
MAX2042AETP+T
MAX20461AATJD/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;
MAX2041ETP+
MAX20461AATJP/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MAX2041ETP+T
MAX2021ETX+
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2031ETP+
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