Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
MAX2620EUA by Maxim Integrated is a cellphone IC with 8 terminals in a small outline, thin profile package. Operating temperature range from -40 to 85°C. Telecom IC type for RF and baseband circuits, suitable for industrial applications.
Median Price
$4.620
Lifecycle Status
Suppliers In-Stock
16
In-Stock Inventory
1k+
Rochester
1+ parts
-
100+ parts
1k+ parts
$4.130
10k+ parts
$3.890
Digiode
$4.883
Nova Conductors
$5.280
Chip Stock
Vyrian
Anansix
Connect4Technologies Inc.
Prism Electronics
Semi Source
R&J Components
Sea View Technologies
Bristol Electronics
Cogito LLC
Lighthouse Electronics, Inc.
Manoshevitz Elec. Sales
PC Components Company LLC
Ampacity Inc.
$4.370
Semicontronic
$4.261
$4.239
Corphita
$4.626
Aranea Global
$5.174
$4.967
MARBEL Systems
$6.655
Texas Native Microelectronics
$7.649
$7.343
$7.114
$6.731
Kenton Components
$9.179
$8.077
AZTECH Wire
$10.760
Qasali Group International
$20.652
$19.207
$18.174
RC Electronics
$5.040
$4.750
$4.660
Kepictronics
Authorized Procurement Solutions
ChipstoGo Electronic ltd
The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronics.
This feature allows for easy installation and space-saving on printed circuit boards, making it convenient for compact designs.
The square shape helps optimize space utilization on circuit boards, providing efficient design layouts.
With 8 terminals, this product offers connectivity options for various functions, enhancing its versatility in cellphone applications.
The small outline, thin profile, and shrink pitch package style contribute to a compact form factor, perfect for slim cellphone designs.
The high operating temperature range ensures reliability under varying environmental conditions, enhancing the product's performance and longevity.
With a low minimum operating temperature, this product can withstand extreme cold environments, ensuring consistent functionality.
The tin-lead terminal finish provides excellent solderability and reliability, making it easy to integrate and maintain in cellphone manufacturing processes.
The dual terminal position offers increased connectivity options and flexibility in circuit board layout, making it suitable for complex cellphone configurations.
The low seated height contributes to a sleek and compact design, essential for thin and lightweight cellphone designs.
The 3mm width allows for efficient space utilization on circuit boards, enabling a compact and streamlined cellphone layout.
The short time at peak reflow temperature ensures reliable soldering during manufacturing processes, ensuring consistent performance in cellphone assembly.
The high peak reflow temperature allows for secure and robust solder joints, essential for maintaining connectivity and functionality in cellphone applications.
The 3mm length contributes to a compact overall footprint, ideal for space-constrained cellphone designs.
The industrial temperature grade ensures consistent performance across a wide range of operating conditions, making it suitable for rugged cellphone applications.
The bipolar technology used in this product offers high-speed performance and precise signal processing, enhancing the overall functionality of cellphones.
The gull-wing terminal form provides reliable contact and ease of soldering, ensuring secure connections in cellphone circuitry.
This product integrates RF and baseband circuitry, essential for seamless communication and data processing in cellphone networks.
The 3V nominal supply voltage ensures compatibility with standard power sources, making this product easy to integrate into cellphone designs.
The 0.65mm terminal pitch offers precise connections and efficient routing of signals, enabling high-density integration in cellphone circuit boards.
Cellphone ICs MAX2620EUA attributes and parameters. Explore more Cellphone ICs devices from Maxim Integrated
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
MAX2620EUA Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev OBS 15/Jul/2015
Maxim Integrated is a leading provider of analog and mixed-signal integrated circuits for a range of industries, including automotive, industrial, communications, consumer, and computing. Founded in 1983 with headquarters in San Jose, California, Maxim has grown to become one of the world’s largest producers of integrated circuits due to its innovative solutions that solve customers’ toughest design challenges. Maxim's broad portfolio includes products such as power management solutions, high-voltage solutions, motor driver solutions, amplifiers and comparators, data converters and interface ICs. For over 35 years, Maxim has continued to push the boundaries of analog integration by providing innovative integrated circuit products that offer the industry’s highest performance and best quality. The company’s commitment to delivering cutting-edge technology enables customers to stay current with changing demands in the market. From automotive check engine lights to fitness trackers worn on the wrist – Maxim enables customers across multiple industries to create groundbreaking products through their advanced IC designs. Maxim Integrated is now officially part of Analog Devices.
President & CEO
Tunc Doluca
Senior VP & CFO
Brian C. White
Senior VP, Technology & Manufacturing Group
Vivek Jain
Fabrication
Fab Initiation
Philippines
Cavite
Wafer Capacity
489,000
USA
Beaverton
312,000
Thailand
Chon Buri
194,000
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
2N2222A
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
LM358AN
Signetics
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
HMC380QS16GE
Analog Devices
Analog Devices' HMC380QS16GE is a cellphone IC with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 5V, making it ideal for telecom applications.
LARA-R202-02B-03
U-blox Ag
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 4;
TRF3701IRHCG4
TRF3701IRHCG4 by Texas Instruments is a cellphone IC with 16 terminals, operating at -40 to 85°C. It features a supply voltage of 5V, RF and baseband circuit for telecom applications, and terminal pitch of 0.8mm. This chip carrier package is ideal for industrial use due to its low supply current of 0.145mA.
TCM4300PZR
Texas Instruments TCM4300PZR is a cellphone IC with 100 terminals in a square package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a low profile flatpack design with gull wing terminals, ideal for telecom applications.
LT5575EUF#TRPBF
Linear Technology
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2900ETI+T
Analog Devices' MAX2900ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating from -40 to 85°C, it's ideal for industrial telecom applications requiring RF and baseband circuit integration. With a nominal voltage of 4.5V, this IC features a very thin profile and matte tin terminal finish for robust performance.
BG77LA-64-SGNS
Quectel Wireless Solutions
BG77LA-64-SGNS by Quectel Wireless Solutions is a BASEBAND CIRCUIT Telecom IC with 94 terminals, RECTANGULAR package shape, and 3.3V supply voltage. It operates b/w -35°C to 75°C, making it suitable for cellphone applications requiring compact design and surface mount capability.
CC1111F16RSPG3
CC1111F16RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it has a supply voltage of 3V and uses CMOS technology for RF and baseband circuits. Ideal for telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3.
AD6634XBC
AD6634XBC by Analog Devices is a Cellphone IC with 196 terminals in a square GRID ARRAY package. Operating temp range -40 to 70 °C, CMOS tech, and 2.5V supply voltage make it ideal for BASEBAND CIRCUIT applications.
ST25R3911B-AQFT
STMicroelectronics
RF AND BASEBAND CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ADL5387ACPZ-WP
ADL5387ACPZ-WP by Analog Devices is a Cellphone IC with 24 terminals, operating at -40 to 85°C. It features a 5V supply voltage, square package shape, and quad terminal position. Ideal for baseband circuits in telecom applications due to its industrial temperature grade and bipolar technology.
MAX19995AETX+
MAX19995AETX+ by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 36 terminals in a square package style, and requires 5V supply voltage. Ideal for RF and baseband circuits in telecom applications due to its small form factor and high-temperature tolerance.
LMH6523SQ
RF AND BASEBAND CIRCUIT;
MAX2010ETI+
MAX2010ETI+ by Analog Devices is a Cellphone IC with BICMOS tech. It operates b/w -40 to 85 °C, has 28 terminals in a square package style, and requires 5V nominal voltage. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface mount capability.
TRF4400PWRG4
TRF4400PWRG4 by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features CMOS technology, RF and baseband circuit for telecom applications. The package is small outline, thin profile, with shrink pitch, suitable for surface mount assembly.
ADF4360-3BCPZRL
Analog Devices ADF4360-3BCPZRL is a 24-terminal cellphone IC with 3.3V power supply, operating from -40 to 85°C. It features BICMOS technology, matte tin finish, and quad terminal position. Ideal for baseband circuits in industrial telecom applications due to its compact square chip carrier package style.
CC2510F16RHHR
CC2510F16RHHR by Texas Instruments is a Cellphone IC with 36 terminals in a square package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology features CMOS, no-lead terminals, and is suitable for industrial telecom applications.
LMV228TL/NOPB
LMV228TL/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a max operating temperature of 85°C and min of -40°C, making it suitable for industrial applications. With a max supply current of 8mA, it is designed for RF and baseband circuit use in telecommunications.
TLV320AC57DW
TLV320AC57DW by Texas Instruments is a cellphone IC with 20 terminals, operating b/w -40 to 85°C. It has a small outline package style and gull wing terminal form, suitable for baseband circuits in telecom applications. The package dimensions are 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact designs.
ADF7020-1BCPZ-RL7
ADF7020-1BCPZ-RL7 by Analog Devices is a cellphone IC with surface mount capability. It has 1 function and comes in a square package shape with 48 terminals. With a temperature range of -40 to 85 °C, it is suitable for industrial applications in RF and baseband circuits.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MAX2606EUT+T
MAX2606EUT+T by Analog Devices is a cellphone IC in small outline package with 6 terminals. Operating temp range -40 to 85°C, peak reflow temp 260°C. Telecom IC for baseband circuits with nominal voltage of 2.75V, ideal for industrial applications.
Maxim Integrated
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
MAX2606EUT-T
MAX2620EUA+T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
MAX2620EUA+T by Analog Devices is a cellphone IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
MAX2620EUA-T
MAX2902ETI+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2029ETP+
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2044ETP+
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2042AETP+
MAX2044ETP+T
MAX20461AATJA/V+
BASEBAND CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Terminal Finish: Matte Tin (Sn) - annealed;
MAX2042AETP+T
MAX20461AATJD/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn) - annealed;
MAX2041ETP+
MAX20461AATJP/V+
BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MAX2041ETP+T
MAX2021ETX+
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2031ETP+
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved