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Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.

Cellphone ICs

Available Parts 356

Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Data Rate Maximum Gain Tolerance Input Type JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) No. of Channels No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
WLAN7102CZ by NXP Semiconductors

WLAN7102CZ

NXP Semiconductors

RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .7 mm;

S-PQCC-N16

2 mm

3

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC16,.07SQ,16

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.7 mm

214 mA

3.85 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

.4 mm

QUAD

2 mm

CC1260RGZR by Texas Instruments

CC1260RGZR

Texas Instruments

CC1260RGZR by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

CC1260RGZT by Texas Instruments

CC1260RGZT

Texas Instruments

CC1260RGZT by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40°C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

S-PQCC-N48

e4

7 mm

3

1

48

105 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC48,.27SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD SILVER

NO LEAD

.5 mm

QUAD

30

7 mm

AFE7700IALK by Texas Instruments

AFE7700IALK

Texas Instruments

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: FBGA; Package Shape: SQUARE;

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

220

2.65 mm

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

20

17 mm

AD9361BBCZ-CSL by Analog Devices

AD9361BBCZ-CSL

Analog Devices

AD9361BBCZ-CSL by Analog Devices is a cellphone IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 85°C, consuming max 150mA at 1.3V. Ideal for RF and baseband circuits in telecom applications due to its compact size and surface-mount capability.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.7 mm

150 mA

1.3 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9986BBPZ-4D2AC by Analog Devices

AD9986BBPZ-4D2AC

Analog Devices

AD9986BBPZ-4D2AC by Analog Devices is a Cellphone IC with 324 terminals in a square package. It operates b/w -40 to 120 °C, consuming 4070mA at 1V. This RF and baseband circuit is ideal for mobile phone applications due to its compact size and high performance capabilities.

S-PBGA-B324

15 mm

3

1

324

120 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

260

1.72 mm

4070 mA

1 V

YES

RF AND BASEBAND CIRCUIT

BALL

.8 mm

BOTTOM

30

15 mm

EG91EXGA-128-SGNS by Quectel Wireless Solutions

EG91EXGA-128-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' EG91EXGA-128-SGNS is a Cellphone IC with 102 terminals, operating temp. range of -35 to 75°C, and 3.8V supply voltage. It integrates RF and baseband circuits for telecom applications in a compact rectangular package measuring 25mm x 29mm with a seated height of 2.3mm, suitable for surface mount assembly.

Also has Extended temp from -40 Deg c to 85 Deg c

R-XXMA-N102

29 mm

1

102

75 Cel

-35 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.3 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

UNSPECIFIED

25 mm

NRF9160-SIBA-B1A-R7 by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R7

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-B1A-R7 is a CELL IC with RF & baseband circuit. It operates in industrial temp range (-40 to 85°C) with 3.8V supply voltage. This surface-mountable chip has 127 terminals, rectangular shape, and grid array package suitable for cellphone applications.

R-XBGA-N127

16 mm

1

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

NRF9160-SIBA-B1A-R by Nordic Semiconductor Asa

NRF9160-SIBA-B1A-R

Nordic Semiconductor Asa

Nordic Semiconductor's NRF9160-SIBA-B1A-R is a CELL IC with RF & BASEBAND CIRCUIT for telecom. It operates in -40 to 85°C, has 127 terminals in GRID ARRAY package style, and requires 3.8V supply voltage. Ideal for cellphone applications due to its compact RECTANGULAR shape and 0.5mm terminal pitch.

R-XBGA-N127

16 mm

1

127

85 Cel

-40 Cel

UNSPECIFIED

LGA

LGA127,21X30,20

RECTANGULAR

GRID ARRAY

1.1 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

10.5 mm

M95FA-03-STD by Quectel Wireless Solutions

M95FA-03-STD

Quectel Wireless Solutions

M95FA-03-STD by Quectel Wireless Solutions is a cellphone IC with 42 terminals, operating temperature range of -40 to 85°C. It features RF and baseband circuit for telecom applications. This surface-mount IC has a rectangular package style, measuring 19.9mm in width and 23.6mm in length, making it suitable for compact electronic devices.

R-XQMA-N42

23.6 mm

1

42

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.65 mm

4 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

19.9 mm

AFE8030IABJ by Texas Instruments

AFE8030IABJ

Texas Instruments

AFE8030IABJ by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40°C to 85°C, has a terminal pitch of 0.8mm, and features RF and baseband circuitry. Ideal for telecom applications requiring fine-pitch grid array packages.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

ACPM-7788-TR1 by Broadcom

ACPM-7788-TR1

Broadcom

RF FRONT END CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 42; Package Shape: RECTANGULAR; Surface Mount: YES; JESD-30 Code: R-XQCC-N42;

R-XQCC-N42

7 mm

1

42

RECTANGULAR

.9 mm

YES

RF FRONT END CIRCUIT

NO LEAD

QUAD

5 mm

EG25GGC-128-SGNS by Quectel Wireless Solutions

EG25GGC-128-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' EG25GGC-128-SGNS is a compact CELL IC with RF & baseband circuit. Operating temp range -35 to 75°C, it has a low profile of 4.9mm making it ideal for space-constrained applications like IoT devices and mobile communication systems. Package style: Microelectronic Assembly, Terminal position: Single.

also available Extended Temperature Range -40 to 80 degree Celsius

R-XSMA-N

51 mm

1

75 Cel

-35 Cel

UNSPECIFIED

SMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

4.9 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

SINGLE

30 mm

AFE8030EDIABJ by Texas Instruments

AFE8030EDIABJ

Texas Instruments

AFE8030EDIABJ by Texas Instruments is a cellphone IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with terminal finish of Tin Silver Copper. This RF and baseband circuit has a compact size of 17x17mm for telecom applications.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

BC66NB-04-STD by Quectel Wireless Solutions

BC66NB-04-STD

Quectel Wireless Solutions

Quectel Wireless Solutions BC66NB-04-STD is a CELL IC with 58 terminals, operating temp -35 to 75°C. Telecom IC for RF and baseband circuits, package style MICROELECTRONIC ASSEMBLY. Ideal for compact applications requiring low power consumption.

EXTENDED TEMP AVAILABLE WITH -40 TO 85

R-XQMA-N58

17.7 mm

1

58

75 Cel

-35 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

15.8 mm

AFE8030EDIALK by Texas Instruments

AFE8030EDIALK

Texas Instruments

AFE8030EDIALK by Texas Instruments is a Cellphone IC with 400 terminals in a square package. It operates b/w -40 to 85°C, with peak reflow temp of 220°C. This RF and baseband circuit is ideal for telecom applications due to its fine pitch grid array style and bottom terminal position.

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, FINE PITCH

220

2.65 mm

YES

RF AND BASEBAND CIRCUIT

TIN LEAD

BALL

.8 mm

BOTTOM

17 mm

A7682E by Simcom Wireless Solutions

A7682E

Simcom Wireless Solutions

A7682E by Simcom Wireless Solutions is a Cellphone IC with 85 terminals in a square package. It operates b/w -40°C to 85°C, with a seated height of 2.4mm and nominal voltage of 3.8V. This RF and baseband circuit is ideal for mobile communication devices due to its compact size and temperature range suitability.

S-XXMA-N85

19.6 mm

1

85

85 Cel

-40 Cel

UNSPECIFIED

XMA

SQUARE

MICROELECTRONIC ASSEMBLY

2.4 mm

3.8 V

NO

RF AND BASEBAND CIRCUIT

NO LEAD

UNSPECIFIED

19.6 mm

BG95M1LA-64-SGNS by Quectel Wireless Solutions

BG95M1LA-64-SGNS

Quectel Wireless Solutions

Quectel Wireless Solutions' BG95M1LA-64-SGNS, a CELL IC with 102 terminals in MICROELECTRONIC ASSEMBLY, operates b/w -35°C to 75°C. This RF and BASEBAND CIRCUIT has a nominal voltage of 3.3V, ideal for compact cellphone designs due to its small dimensions of 19.9mm width and 23.6mm length.

EXTENDED TEMP AVAILABLE WITH -40 TO 85

R-XQMA-N102

23.6 mm

1

102

75 Cel

-35 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

NO

RF AND BASEBAND CIRCUIT

NO LEAD

QUAD

19.9 mm

MPCI-L210-03S-03 by U-blox Ag

MPCI-L210-03S-03

U-blox Ag

RF AND BASEBAND CIRCUIT;

RF AND BASEBAND CIRCUIT

TOBY-L210-03S-03 by U-blox Ag

TOBY-L210-03S-03

U-blox Ag

TOBY-L210-03S-03 by U-blox Ag is a Cellphone IC with 152 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a compact size of 24.8mm x 35.6mm and low seated height of 2.87mm, it's ideal for mobile device designs.

-40 to 85 extended operating temp available

R-XBGA-N152

35.6 mm

1

152

65 Cel

-20 Cel

UNSPECIFIED

LGA

RECTANGULAR

GRID ARRAY

2.87 mm

3.8 V

YES

RF AND BASEBAND CIRCUIT

NO LEAD

BOTTOM

24.8 mm