Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.Some common types of cellphone ICs include:1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.
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CC1110F16RSP
Texas Instruments
The Texas Instruments CC1110F16RSP is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial applications.
S-XQCC-N36
e4
6 mm
3
1
36
85 Cel
-40 Cel
UNSPECIFIED
HVQCCN
LCC36,.25SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
Not Qualified
.9 mm
Other Telecom ICs
3 V
YES
CMOS
RF AND BASEBAND CIRCUIT
INDUSTRIAL
NICKEL PALLADIUM GOLD
NO LEAD
.5 mm
QUAD
30
CC1110F32RSPR
The Texas Instruments CC1110F32RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit make it ideal for industrial telecom applications. With a low profile of 0.9mm and terminal pitch of 0.5mm, it offers high performance in compact designs.
CC1110F32RSP
CC1110F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V, making it ideal for telecom applications.
CC1110F8RSPR
The Texas Instruments CC1110F8RSPR is a cellphone IC with 36 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, CMOS technology, and RF/baseband circuit for telecom applications. Nominal voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3 make it ideal for industrial use.
CC1110F8RSP
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2029ETP-T
Maxim Integrated
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N20
5 mm
20
.8 mm
5 V
BICMOS
BASEBAND CIRCUIT
.65 mm
MAX2029ETP
e0
245
TIN LEAD
AD6655ABCPZ-150
Analog Devices
AD6655ABCPZ-150 by Analog Devices is a cellphone IC with 64 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8V and max current of 0.805mA. Ideal for baseband circuits, it has a terminal pitch of 0.5mm and MSL level of 3 for industrial applications.
S-XQCC-N64
e3
9 mm
64
LCC64,.35SQ,20
1.8
1 mm
.805 mA
1.8 V
MATTE TIN
AD6655ABCPZ-80
AD6655ABCPZ-80 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85°C. It has a supply voltage of 1.8V and low supply current of 0.42mA. Ideal for baseband circuits, this square chip carrier package is surface mountable with a terminal pitch of 0.5mm.
.42 mA
AD6655ABCPZRL7-125
AD6655ABCPZRL7-125 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and max current of 0.705mA. This BASEBAND CIRCUIT IC comes in a square chip carrier package with matte tin finish, suitable for industrial applications.
.705 mA
AD6655ABCPZRL7-150
AD6655ABCPZRL7-150 by Analog Devices is a cellphone IC with 64 terminals, operating at -40 to 85 °C. It has a supply voltage of 1.8V and consumes 0.805mA current. This BASEBAND CIRCUIT IC comes in a SQUARE package style, suitable for telecom applications.
Matte Tin (Sn)
1605C
Murata Manufacturing
Murata Manufacturing's 1605C is a BASEBAND CIRCUIT for cellphones. It has 16 terminals in IN-LINE package style, with dimensions of 7.62mm width and 22.5mm length. Operating temperature range is 0-70°C, making it ideal for commercial telecom applications.
R-XDIP-T16
22.5 mm
16
70 Cel
0 Cel
DIP
RECTANGULAR
IN-LINE
NOT SPECIFIED
6.84 mm
NO
COMMERCIAL
THROUGH-HOLE
2.54 mm
DUAL
7.62 mm
MAX2392ETI
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: QCCN; Package Shape: RECTANGULAR;
R-XQCC-N28
28
QCCN
LCC28,.2SQ,20
CHIP CARRIER
.04 mA
MAX2396EGI
.038 mA
MAX2401ETI
.043 mA
ALM-1522-BLKG
Broadcom
BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 22; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 2; Nominal Supply Voltage: 5 V;
R-XQMA-N22
2
22
MICROELECTRONIC ASSEMBLY
SI4710-B30-GMR
Silicon Labs
SI4710-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating temp range -20 to 85°C, CMOS tech, and 3.3V supply voltage make it ideal for RF and baseband circuits in telecom applications.
3 mm
-20 Cel
.6 mm
3.3 V
OTHER
SI4710-B30-GM
SI4710-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20 to 85°C, ideal for RF and baseband circuits. With CMOS technology and 3.3V supply voltage, it's perfect for compact telecom applications.
SI4711-B30-GMR
SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.
SI4711-B30-GM
SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.
SI4712-B30-GMR
SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.
SI4713-B30-GMR
SI4713-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this CMOS technology IC has a compact size of 3x3mm and terminal pitch of 0.5mm.
SI4713-B30-GM
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SA601DK,112
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
R-PDSO-G20
6.5 mm
PLASTIC/EPOXY
LSSOP
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
1.5 mm
Nickel/Palladium/Gold (Ni/Pd/Au)
GULL WING
4.4 mm
SA601DK,118
SA620DK,112
SA620DK,118
ACFM-7101-TR1G
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 6; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
R-XXMA-X6
6
100 Cel
SKY73420-11
Skyworks Solutions
SKY73420-11 by Skyworks Solutions is a 36-terminal cellphone IC with a square package shape and 0.9mm seated height. It features RF and baseband circuit for telecom applications, operates at 5V supply voltage, and has a terminal pitch of 0.5mm. Ideal for compact devices requiring high-performance RF capabilities.
ADS58C20IPFPR
Texas Instruments ADS58C20IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.
3.45 V
S-PQFP-G80
12 mm
80
HTFQFP
QFP80,.55SQ,20
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
1.2 mm
ADS58C20IPFP
Texas Instruments ADS58C20IPFP is an 80-terminal cellphone IC with a max analog input of 3.45V, operating b/w -40 to 85°C. It features a flatpack package style, gull wing terminal form, and is suitable for RF and baseband circuit applications in the telecom industry.
ADS58C23IPFPR
Texas Instruments ADS58C23IPFPR is an 80-terminal cellphone IC with a max analog input of 3.45V and operating temperature range from -40 to 85°C. Ideal for RF and baseband circuits, this IC has a compact square package style with gull wing terminals suitable for surface mount applications.
SX8652IWLTRT
Semtech
Semtech's SX8652IWLTRT is a Cellphone IC with 14 terminals, operating temp. range of -40 to 85°C, and 1.8V supply voltage. It features a small outline package suitable for baseband circuits in telecom applications.
R-PDSO-N14
4 mm
14
HVSON
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
CC2591RGVRG4
CC2591RGVRG4 by Texas Instruments is a cellphone IC with 16 terminals in a square package. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. This RF front end circuit has a max supply current of 4mA, making it ideal for industrial telecom applications.
S-PQCC-N16
LCC16,.16SQ,25
4 mA
RF FRONT END CIRCUIT
CC2591RGVTG4
RF FRONT END CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
ADF4360-9BCPZRL
Analog Devices' ADF4360-9BCPZRL is a cellphone IC with 24 terminals, operating at 3.3V. It features a square package shape, matte tin finish, and industrial temperature grade. Ideal for baseband circuits in telecom applications due to its compact size (4x4mm) and low profile (1mm).
S-XQCC-N24
24
LCC24,.16SQ,20
3.3
ADF4360-9BCPZ
Analog Devices' ADF4360-9BCPZ is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates at -40 to 85°C, with a supply voltage of 3.3V and terminal pitch of 0.5mm. Ideal for baseband circuits, it features matte tin finish and very thin profile for industrial telecom applications.
AD8366ACPZ-R7
AD8366ACPZ-R7 by Analog Devices is a Cellphone IC with 2 functions, operating at -40 to 85 °C. It features a square package style, 32 terminals, and matte tin finish. Ideal for telecom applications as a baseband circuit with a nominal voltage of 5V.
S-XQCC-N32
32
MAX2306EGI
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N28
240
3/3.3
.0415 mA
2.75 V
MAX2902EGI
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
2.7/4.5
4.5 V
MAX2904EGI
TRF4900PWR
TRF4900PWR by Texas Instruments is a cellphone IC with 24 terminals, operating at 3V. It features a small outline package style and CMOS technology for RF and baseband circuits. Suitable for telecom applications, it has a temperature range of -20 to 60°C.
R-PDSO-G24
7.8 mm
60 Cel
TSSOP
TSSOP24,.25
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
.075 mA
MAX2606EUT-T
MAX2606EUT-T by Maxim Integrated is a small outline, low profile cellphone IC with 6 terminals. Operating temperature ranges from -40 to 85°C. Ideal for baseband circuits in telecom applications due to its compact size and industrial temperature grade suitability.
R-PDSO-G6
2.9 mm
1.45 mm
.95 mm
1.625 mm
MAX2607EUT-T
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: LSSOP; Package Shape: RECTANGULAR;
MAX2608EUT-T
MAX2609EUT-T
MAX2361EGM
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N48
7 mm
48
LCC48,.27SQ,20
.09 mA
2.8 V
AD6634BBC
AD6634BBC by Analog Devices is a Cellphone IC with 196 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, with power supplies of 2.5-3.3V. This BASEBAND CIRCUIT technology uses CMOS and is ideal for telecom applications.
S-PBGA-B196
15 mm
196
BGA
BGA196,14X14,40
GRID ARRAY
2.5,3.3
2.5 V
BALL
BOTTOM
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