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DSL01-010SC5

STMicroelectronics

DSL01-010SC5 by STMicroelectronics

DSL01-010SC5 by STMicroelectronics is a compact baseband circuit IC designed for cellphone applications. It features a 5-terminal gull-wing design with a peak reflow temp of 260 °C and max time at peak of 30s. Its plastic/epoxy package ensures durability in mobile devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,899 parts In-Stock

1+ parts

-

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4,899

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Digiode

USA . 4,520 parts In-Stock

1+ parts

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4,520

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Anansix

USA . 1,341 parts In-Stock

1+ parts

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1,341

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 810 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

-

10k+ parts

$0.229

810

$0.238

-

-

$0.229

Northwest PG Solutions

USA . 734 parts In-Stock

1+ parts

$0.262

100+ parts

-

1k+ parts

-

10k+ parts

$0.231

734

$0.262

-

-

$0.231

IDEA Electronic Components Group

UK . 1,164 parts In-Stock

1+ parts

$8.664

100+ parts

-

1k+ parts

$7.797

10k+ parts

-

1,164

$8.664

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$7.797

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MKK Technologies

India . 769 parts In-Stock

1+ parts

$16.291

100+ parts

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769

$16.291

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DigiPath Technology Company

USA . 769 parts In-Stock

1+ parts

$16.291

100+ parts

-

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10k+ parts

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769

$16.291

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$21.450

100+ parts

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455

$21.450

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A-Z Elektronik GmbH

Germany . 7,071 parts In-Stock

1+ parts

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7,071

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Alle Elektronik GmbH

Germany . 4,714 parts In-Stock

1+ parts

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4,714

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Corphita

USA . 3,195 parts In-Stock

1+ parts

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3,195

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Kepictronics

USA . 500 parts In-Stock

1+ parts

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500

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Parana Technologies

USA . 323 parts In-Stock

1+ parts

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100+ parts

$10.359

1k+ parts

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323

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$10.359

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Overview

Unlock the full potential of your mobile devices with the DSL01-010SC5 from STMicroelectronics, a leader in innovative semiconductor solutions. This premium cellphone IC combines reliability and performance in a compact design, making it ideal for advanced telecommunications applications. With its robust construction and superior quality materials, it promises seamless connectivity and enhanced user experiences. Elevate your projects with the trusted expertise of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides excellent durability and resistance to environmental factors, making the IC suitable for various operating conditions.

Surface Mount: YES

Being a surface mount device allows for easier integration and assembly into modern PCB designs, enabling compact and efficient layouts.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the circuit board, making it ideal for high-density designs while ensuring a secure fit.

No. of Terminals: 5

With five terminals, this IC provides sufficient connectivity options while maintaining a simple design, enhancing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for mobile devices where space is at a premium, allowing manufacturers to create sleek designs.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and reliability, enhancing overall performance and longevity of the IC.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and improved electrical performance, accommodating different PCB layouts.

Maximum Time At Peak Reflow Temperature: 30s

With a maximum reflow time of 30 seconds, this IC is designed for compatibility with efficient manufacturing processes, minimizing heat exposure to sensitive components.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C indicates the IC can withstand standard soldering processes, ensuring robust assembly while maintaining performance.

Terminal Form: GULL WING

Gull-wing terminals provide excellent mechanical support and solder connection, leading to improved reliability and easier inspection after assembly.

Telecom IC Type: BASEBAND CIRCUIT

As a baseband circuit, this IC is tailored for telecommunications applications, delivering reliable processing for signal quality and transmission in mobile devices.

Technical Specifications

Cellphone ICs DSL01-010SC5 attributes and parameters. Explore more Cellphone ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

5

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

DSL01-010SC5 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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