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STPCE1HDBC

STMicroelectronics

STPCE1HDBC by STMicroelectronics

STPCE1HDBC by STMicroelectronics is a multifunction peripheral IC with a 32-bit address bus and operates at supply voltages of 2.5V to 3.3V. It features a max clock frequency of 14.318 MHz and supports PCI/ISA bus compatibility. Ideal for commercial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,600

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-

-

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Vyrian

USA . 2,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,082

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Digiode

USA . 514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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514

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 530 parts In-Stock

1+ parts

$18.449

100+ parts

-

1k+ parts

$16.604

10k+ parts

-

530

$18.449

-

$16.604

-

MKK Technologies

India . 1,231 parts In-Stock

1+ parts

$34.692

100+ parts

-

1k+ parts

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10k+ parts

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1,231

$34.692

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DigiPath Technology Company

USA . 1,231 parts In-Stock

1+ parts

$34.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,231

$34.692

-

-

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Corohmni

South Africa . 546 parts In-Stock

1+ parts

$54.737

100+ parts

-

1k+ parts

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546

$54.737

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Corphita

USA . 3,356 parts In-Stock

1+ parts

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100+ parts

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3,356

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Parana Technologies

USA . 617 parts In-Stock

1+ parts

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100+ parts

$22.058

1k+ parts

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10k+ parts

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617

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$22.058

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Overview

Unlock unparalleled performance with the STPCE1HDBC from STMicroelectronics, a leader in innovative technology. Designed for versatility, this multi-functional peripheral enhances your electronic designs with its robust reliability and efficiency. Seamlessly integrate it into diverse applications, from consumer electronics to industrial automation, and enjoy superior quality backed by decades of expertise. Elevate your projects with the unmatched value and benefits of ST’s cutting-edge solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides protection against environmental factors, ensuring longevity and reliability.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern electronic boards.

Maximum Supply Voltage: 2.7 V

With a low maximum supply voltage, this peripheral is energy-efficient, making it suitable for battery-operated devices.

Address Bus Width: 32

A wider address bus improves data handling capabilities, enhancing performance for demanding applications.

Package Shape: SQUARE

The square package shape facilitates ease of placement on circuit boards, optimizing space utilization.

Bit Size: 32

Having a 32-bit architecture allows for enhanced processing capabilities, suitable for complex computations.

Power Supplies (V): 2.5,3.3

Dual voltage options provide flexibility in power supply design, accommodating various system requirements.

No. of Terminals: 388

A high number of terminals supports extensive connectivity, enabling versatile functionalities in data transfer.

Package Style (Meter): GRID ARRAY

Grid array packages offer high pin density and improved electrical performance for advanced circuitry.

Minimum Supply Voltage: 2.45 V

A low minimum supply voltage enhances flexibility for operation in lower voltage environments.

Maximum Operating Temperature: 85 °C

Able to operate at high temperatures, this peripheral is robust enough for industrial applications.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C allows for utilization in various environments, from cold to moderate temperatures.

Terminal Finish: TIN LEAD

Tin lead finish provides excellent solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal management and reduces board space requirements.

Maximum Seated Height: 2.38 mm

A low profile minimizes the overall product height, enabling compact designs in multi-functional peripherals.

Width: 35 mm

The width fits well into standardized boards, providing compatibility across various systems and devices.

Boundary Scan: YES

Inclusion of boundary scan enhances testing capabilities, simplifying debugging and production processes.

External Data Bus Width: 32

A 32-bit external data bus enhances data throughput, making it ideal for high-speed applications.

Maximum Clock Frequency: 14.318 MHz

The high clock frequency supports faster computations, improving overall system performance.

Length: 35 mm

The length matches standard design specifications, ensuring versatile integration into existing systems.

Temperature Grade: COMMERCIAL EXTENDED

Meeting commercial extended temperatures ensures reliable operation in diverse conditions and applications.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

As a multifunction peripheral, this IC can handle various tasks, reducing the need for multiple components.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it efficient for modern applications.

Terminal Form: BALL

Ball terminals enhance thermal performance and are easier to solder, improving manufacturing efficiency.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply of 2.5 V ensures lower power demands without sacrificing performance.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA buses allows for versatile integration into existing systems and legacy applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch enables compact designs while ensuring reliable electrical connections.

Speed: 133 rpm

The operational speed of 133 rpm allows for quick data processing, enhancing the overall efficiency of applications.

No. of I/O Lines: 16

With 16 I/O lines, this product supports extensive input and output operations, suitable for complex device interactions.

Technical Specifications

Multi-functional Peripherals STPCE1HDBC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of I/O Lines:

16

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Speed:

133 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCE1HDBC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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