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TDA2PSXTQABZRQ1

Texas Instruments

TDA2PSXTQABZRQ1 by Texas Instruments

TDA2PSXTQABZRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 760 terminals, and 2.5M RAM words. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,230 parts In-Stock

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4,230

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Vyrian

USA . 2,480 parts In-Stock

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2,480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$12.911

100+ parts

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475

$12.911

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Parana Technologies

USA . 2,128 parts In-Stock

1+ parts

$17.184

100+ parts

-

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$17.400

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2,128

$17.184

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$17.400

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DigiPath Technology Company

USA . 1,491 parts In-Stock

1+ parts

$18.922

100+ parts

$17.408

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1,491

$18.922

$17.408

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ChromeModa Solutions

Germany . 6,180 parts In-Stock

1+ parts

$19.308

100+ parts

$15.833

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6,180

$19.308

$15.833

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IDEA Electronic Components Group

UK . 1,728 parts In-Stock

1+ parts

$19.308

100+ parts

$18.343

1k+ parts

$17.377

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1,728

$19.308

$18.343

$17.377

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One Stop Electronics

USA . 1,601 parts In-Stock

1+ parts

$31.000

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1,601

$31.000

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Corohmni

South Africa . 988 parts In-Stock

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$59.182

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988

$59.182

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Corphita

USA . 4,289 parts In-Stock

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4,289

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Overview

Experience the ultimate in performance and reliability with the TDA2PSXTQABZRQ1 from Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. This multi-functional peripheral is perfect for a wide range of applications, offering unmatched versatility and efficiency. With top-notch quality and exceptional value, this product is sure to enhance your projects and streamline your operations. Trust Texas Instruments to provide you with the best solutions for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable use.

Maximum Supply Voltage: 1.2 V

The low maximum supply voltage ensures energy efficiency and reduces the risk of overheating.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into different systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

RAM Words: 2.5M

Large RAM capacity of 2.5M words ensures smooth and efficient multitasking capabilities.

Maximum Clock Frequency: 38.4 MHz

High maximum clock frequency enables fast data processing and high performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various interfaces.

Technical Specifications

Multi-functional Peripherals TDA2PSXTQABZRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

TDA2PSXTQABZRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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