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TDA2LFBTQABCRQ1

Texas Instruments

TDA2LFBTQABCRQ1 by Texas Instruments

TDA2LFBTQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 760 terminals, operating at up to 38.4 MHz. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB interfaces in a compact square package with low power mode and boundary scan capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,360

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Vyrian

USA . 2,759 parts In-Stock

1+ parts

-

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-

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2,759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 527 parts In-Stock

1+ parts

$4.957

100+ parts

-

1k+ parts

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10k+ parts

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527

$4.957

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One Stop Electronics

USA . 1,436 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,436

$5.000

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Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$40.061

100+ parts

-

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2,317

$40.061

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DigiPath Technology Company

USA . 760 parts In-Stock

1+ parts

$44.112

100+ parts

-

1k+ parts

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10k+ parts

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760

$44.112

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-

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ChromeModa Solutions

Germany . 4,111 parts In-Stock

1+ parts

$45.012

100+ parts

$36.910

1k+ parts

-

10k+ parts

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4,111

$45.012

$36.910

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IDEA Electronic Components Group

UK . 1,209 parts In-Stock

1+ parts

$45.012

100+ parts

$42.761

1k+ parts

$40.511

10k+ parts

-

1,209

$45.012

$42.761

$40.511

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Corohmni

South Africa . 3,030 parts In-Stock

1+ parts

$81.715

100+ parts

-

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3,030

$81.715

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Corphita

USA . 3,899 parts In-Stock

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3,899

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Overview

Get ready to experience cutting-edge innovation with the TDA2LFBTQABCRQ1 by Texas Instruments. This multi-functional peripheral boasts top-tier quality and reliability, making it a standout choice for a wide range of applications. From automotive to industrial settings, this product offers unparalleled value, providing customers with seamless performance, efficient operation, and advanced features. Elevate your projects with the TDA2LFBTQABCRQ1 and discover the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2 V ensures efficient power consumption and optimal performance.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards, making it suitable for automotive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

The wide range of bus compatibility options allows the product to easily integrate with various communication protocols, enhancing its versatility.

Technical Specifications

Multi-functional Peripherals TDA2LFBTQABCRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1176 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TDA2LFBTQABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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