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XDRA767PSIGACD

Texas Instruments

XDRA767PSIGACD by Texas Instruments

XDRA767PSIGACD by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it features AEC-Q100 screening level and supports CAN, Ethernet, I2C, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,997 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,997

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Vyrian

USA . 3,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,959

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$5.281

100+ parts

-

1k+ parts

-

10k+ parts

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737

$5.281

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One Stop Electronics

USA . 1,378 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,378

$12.000

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Corohmni

South Africa . 38 parts In-Stock

1+ parts

$21.153

100+ parts

-

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38

$21.153

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Parana Technologies

USA . 577 parts In-Stock

1+ parts

$55.176

100+ parts

$5,123.969

1k+ parts

$49.659

10k+ parts

-

577

$55.176

$5,123.969

$49.659

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DigiPath Technology Company

USA . 1,079 parts In-Stock

1+ parts

$60.756

100+ parts

-

1k+ parts

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10k+ parts

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1,079

$60.756

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ChromeModa Solutions

Germany . 5,535 parts In-Stock

1+ parts

$61.996

100+ parts

$50.837

1k+ parts

-

10k+ parts

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5,535

$61.996

$50.837

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IDEA Electronic Components Group

UK . 148 parts In-Stock

1+ parts

$61.996

100+ parts

$58.896

1k+ parts

$55.796

10k+ parts

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148

$61.996

$58.896

$55.796

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Corphita

USA . 658 parts In-Stock

1+ parts

-

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658

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Overview

Experience the next level of innovation with the XDRA767PSIGACD by Texas Instruments. Crafted with precision and expertise, this multi-functional peripheral offers unparalleled quality and reliability. Whether you're in the automotive industry or require high-performance peripherals for your project, this product delivers exceptional value and benefits. With cutting-edge technology and a wide range of bus compatibility, the XDRA767PSIGACD ensures seamless integration and optimal performance. Elevate your projects with Texas Instruments' superior quality peripherals.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand daily wear and tear, making the product long-lasting.

Maximum Supply Voltage: 1.2 V

Efficient power consumption, reducing electricity costs in the long run.

Width: 23 mm

Compact size makes it easy to fit into any workspace, saving valuable desk space.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance, making the product energy efficient.

Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB

Wide range of bus compatibility allows for versatile connectivity options, suitable for various devices.

Technical Specifications

Multi-functional Peripherals XDRA767PSIGACD attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B784

Length:

23 mm

No. of I/O Lines:

247

No. of Terminals:

784

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

1.63 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Trade Compliance

XDRA767PSIGACD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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