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LS1026ASE8MQA

NXP Semiconductors

LS1026ASE8MQA by NXP Semiconductors

LS1026ASE8MQA by NXP Semiconductors is a multi-functional peripheral with a package body made of plastic/epoxy. It has a max supply voltage of 0.93V and an address bus width of 14. This versatile component is compatible with I2C, PCI, SPI, UART, and USB buses and can be used in various applications requiring high-performance peripherals.

Median Price

$66.632

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,960 parts In-Stock

1+ parts

-

100+ parts

$71.075

1k+ parts

-

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9,960

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$71.075

-

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Rochester

USA . 3,060 parts In-Stock

1+ parts

-

100+ parts

$62.190

1k+ parts

$55.640

10k+ parts

$52.370

3,060

-

$62.190

$55.640

$52.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,297 parts In-Stock

1+ parts

-

100+ parts

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3,297

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Digiode

USA . 2,214 parts In-Stock

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2,214

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Anansix

USA . 711 parts In-Stock

1+ parts

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711

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Flip Electronics

USA . 60 parts In-Stock

1+ parts

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,163 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

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1,163

$7.000

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AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$8.229

100+ parts

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506

$8.229

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One Stop Electronics

USA . 1,356 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,356

$9.000

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Corohmni

South Africa . 327 parts In-Stock

1+ parts

$68.069

100+ parts

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327

$68.069

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Aztec Data Supply Inc.

USA . 3,149 parts In-Stock

1+ parts

$68.776

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3,149

$68.776

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Vigor

Singapore . 2,473 parts In-Stock

1+ parts

$104.360

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2,473

$104.360

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Microchip USA

USA . 2,188 parts In-Stock

1+ parts

$185.920

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2,188

$185.920

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UNI Independent Distributors

Spain . 8,322 parts In-Stock

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8,322

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Continental Prestige Electronics

USA . 5,529 parts In-Stock

1+ parts

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5,529

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Corphita

USA . 2,870 parts In-Stock

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2,870

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QUARKTWIN TECHNOLOGY LTD

USA . 2,134 parts In-Stock

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2,134

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Argo Parts USA

USA . 1,415 parts In-Stock

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1,415

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Aranea Global

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Discover a world of possibilities with the LS1026ASE8MQA by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability for all their products. The LS1026ASE8MQA falls under the category of Multi-functional Peripherals, making it an essential component for various applications. What sets this product apart is its incredible value, offering customers unparalleled benefits and advantages. Unlock seamless connectivity with its I2C, PCI, SPI, UART, and USB bus compatibility, while its compact design allows for easy integration. Experience innovation like never before with the LS1026ASE8MQA!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy body material makes this multi-functional peripheral lightweight and durable, perfect for portable devices.

Surface Mount: YES

The surface mount capability of this product allows for easy installation and integration into various devices, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 0.93 V

With a maximum supply voltage of 0.93 V, this multi-functional peripheral ensures efficient and reliable performance, delivering optimal power to support multiple functions.

Address Bus Width: 14

The 14-bit address bus width provides a large address space, enabling seamless communication and compatibility with a wide range of devices and systems.

Package Shape: SQUARE

The square package shape offers enhanced stability and space utilization, making it suitable for densely packed electronic devices.

No. of Terminals: 780

With 780 terminals, this multi-functional peripheral allows for versatile connectivity options, enabling it to interface with various components and systems effectively.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high-density packaging and excellent electrical performance, making it an ideal choice for compact and high-performance devices.

Minimum Supply Voltage: 0.87 V

The minimum supply voltage of 0.87V ensures reliable operation even under low power conditions, making it energy-efficient and suitable for battery-powered devices.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish ensures excellent conductivity and corrosion resistance, guaranteeing long-term reliability and optimal performance.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom allows for easy and compact PCB layout design, enabling efficient use of space and facilitating easy assembly.

Maximum Seated Height: 2.61 mm

The maximum seated height of 2.61 mm ensures a compact and low-profile design, making it suitable for applications with limited vertical space.

Width: 23 mm

With a width of 23 mm, this multi-functional peripheral offers a compact form factor, allowing it to be easily integrated into various devices without occupying much space.

Boundary Scan: YES

The inclusion of boundary scan capability simplifies testing and debugging during production and ensures a reliable and efficient manufacturing process.

External Data Bus Width: 64

The wide external data bus width of 64 bits enables high-speed data transfer, facilitating faster processing and enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product ensures proper soldering and avoids component damage during assembly.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C guarantees secure solder connections, ensuring robust and reliable operation even under demanding conditions.

Length: 23 mm

The length of 23 mm provides a compact footprint, allowing for easy integration and installation in space-constrained applications.

Technology: CMOS

The CMOS technology employed in this multi-functional peripheral offers low power consumption, high-speed performance, and compatibility with a wide range of systems.

Terminal Form: BALL

The ball terminal form enables reliable and efficient solder connections, ensuring high-quality electrical connections and long-term durability.

Nominal Supply Voltage: 0.9 V

With a nominal supply voltage of 0.9 V, this multi-functional peripheral offers stable and consistent power delivery, ensuring reliable performance in a wide range of applications.

Bus Compatibility: I2C, PCI, SPI, UART, USB

With compatibility for multiple bus interfaces, including I2C, PCI, SPI, UART, and USB, this product can seamlessly communicate and integrate with various systems and devices.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm provides sufficient spacing for easy PCB trace routing, ensuring reliable electrical connections and straightforward assembly.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 ensures proper handling and storage requirements, minimizing the risk of moisture-induced damage and maintaining product integrity.

No. of I/O Lines: 76

With 76 I/O lines, this multi-functional peripheral offers versatile input and output capabilities, enabling it to interface with various peripherals and components effectively.

Technical Specifications

Multi-functional Peripherals LS1026ASE8MQA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, PCI, SPI, UART, USB

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

LS1026ASE8MQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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