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ZPSD502B1-70J

STMicroelectronics

ZPSD502B1-70J by STMicroelectronics

ZPSD502B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its compact chip carrier design ensures efficient space utilization in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,646 parts In-Stock

1+ parts

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4,646

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Anansix

USA . 1,197 parts In-Stock

1+ parts

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1,197

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Digiode

USA . 1,169 parts In-Stock

1+ parts

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1,169

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 369 parts In-Stock

1+ parts

$37.535

100+ parts

-

1k+ parts

$33.782

10k+ parts

-

369

$37.535

-

$33.782

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Corohmni

South Africa . 487 parts In-Stock

1+ parts

$63.973

100+ parts

-

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-

10k+ parts

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487

$63.973

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MKK Technologies

India . 835 parts In-Stock

1+ parts

$70.582

100+ parts

-

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835

$70.582

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DigiPath Technology Company

USA . 835 parts In-Stock

1+ parts

$70.582

100+ parts

-

1k+ parts

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835

$70.582

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Corphita

USA . 1,659 parts In-Stock

1+ parts

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1,659

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Parana Technologies

USA . 999 parts In-Stock

1+ parts

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100+ parts

$44.879

1k+ parts

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999

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$44.879

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Overview

Unlock unparalleled performance with the ZPSD502B1-70J from STMicroelectronics, a leader in cutting-edge technology. This versatile multi-functional peripheral is designed for seamless integration across various applications, offering robust reliability and efficiency. With its compact design and impressive operational range, it enables enhanced productivity while minimizing power consumption. Elevate your projects with this superior solution that embodies quality and innovation—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable in various settings.

Surface Mount: YES

Surface mount technology enables a compact design, facilitating integration into space-constrained applications and enhancing overall product design.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of electronic systems, enhancing versatility.

Address Bus Width: 16

A 16-bit address bus allows for accessing a larger memory space, which is beneficial for complex applications.

Package Shape: SQUARE

The square package shape enables efficient space utilization on PCBs, making it suitable for compact devices.

Power Supplies (V): 5

Operating on standard 5V power supplies simplifies integration with existing components, reducing design complexity.

No. of Terminals: 68

With 68 terminals, this product supports a rich set of I/O options, allowing for significant functionality in a single package.

Package Style (Meter): CHIP CARRIER

Chip carrier style promotes ease of assembly and enhances thermal performance, which is crucial for high-speed operations.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum supply voltage of 4.5 V increases flexibility in power supply design.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures the device remains functional in higher temperature environments, expanding its application range.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable performance in colder climates.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides good solderability and reliability, which is important for long-lasting connections.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates that this product is likely designed for non-volatile applications, ensuring data retention.

Terminal Position: QUAD

The quad terminal position facilitates easy placement on PCBs, improving design efficiency.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm allows for integration into low-profile applications.

RAM Words: 512

With 512 words of RAM, this product supports diverse and complex applications requiring significant memory.

Width: 24.18 mm

Compact width of 24.18 mm fits into various designs without requiring extensive space.

External Data Bus Width: 16

A 16-bit external data bus allows for efficient data processing, improving system performance.

Maximum Clock Frequency: 50 MHz

Operating at a maximum clock frequency of 50 MHz enables high-speed data processing for demanding applications.

Length: 24.18 mm

A length of 24.18 mm complements its width, resulting in a square footprint that is efficient for various layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product is suitable for a wide range of ambient conditions encountered in typical environments.

ROM Bits Size: 512 Bits

With 512 bits of ROM, this product can store essential instructions and firmware, providing versatility in software design.

Technology: CMOS

Using CMOS technology results in low power consumption, which is ideal for battery-operated devices.

Terminal Form: J BEND

J bend terminals provide robust mechanical connections and are suitable for various mounting techniques.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common electronic systems, making it easier to integrate into existing designs.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility increases application flexibility, allowing this product to work across various platforms and systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm facilitates the use of standard PCB fabrication techniques, enhancing manufacturability.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current helps in energy conservation, making it suitable for power-sensitive applications.

Maximum Access Time: 0.00000007 ns

Ultra-fast access time improves data retrieval speeds, making it suitable for high-speed processing tasks.

No. of I/O Lines: 40

With 40 I/O lines, this product is capable of handling multiple input/output tasks simultaneously, enhancing its functionality.

Technical Specifications

Multi-functional Peripherals ZPSD502B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD502B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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