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PSD503B1-70J

STMicroelectronics

PSD503B1-70J by STMicroelectronics

PSD503B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded systems requiring efficient data handling. Its compact chip carrier design ensures easy integration in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,735

-

-

-

-

Anansix

USA . 2,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,787

-

-

-

-

Vyrian

USA . 480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

480

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,762 parts In-Stock

1+ parts

$23.802

100+ parts

-

1k+ parts

$21.422

10k+ parts

-

1,762

$23.802

-

$21.422

-

MKK Technologies

India . 758 parts In-Stock

1+ parts

$44.759

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$44.759

-

-

-

DigiPath Technology Company

USA . 758 parts In-Stock

1+ parts

$44.759

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$44.759

-

-

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Corohmni

South Africa . 50 parts In-Stock

1+ parts

$68.911

100+ parts

-

1k+ parts

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10k+ parts

-

50

$68.911

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-

-

Corphita

USA . 1,886 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,886

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-

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Parana Technologies

USA . 1,541 parts In-Stock

1+ parts

-

100+ parts

$28.459

1k+ parts

-

10k+ parts

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1,541

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$28.459

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Overview

Unlock the potential of your next project with the PSD503B1-70J from STMicroelectronics, a leader renowned for quality and innovation. This versatile multi-functional peripheral enhances performance while ensuring reliability across various applications, from consumer electronics to industrial controls. With its compact design and robust functionality, it seamlessly integrates into your systems, delivering exceptional value and efficiency that drives success. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-lasting performance and reliability.

Surface Mount: YES

Compact design allows for space-saving on circuit boards, ideal for various applications.

Maximum Supply Voltage: 5.5 V

Compatible with a wide range of power supplies, making it versatile for various designs.

Address Bus Width: 16

Allows for access to a larger memory space, which is beneficial for complex applications.

Package Shape: SQUARE

The square shape aids in easy integration into devices while optimizing space.

Power Supplies (V): 5

Standard supply voltage makes it easy to use with existing power systems.

No. of Terminals: 68

Provides ample connectivity options for complex functionality and interfacing.

Package Style (Meter): CHIP CARRIER

Designed for efficient assembly and reliable performance in various applications.

Minimum Supply Voltage: 4.5 V

Versatile operation range allows for stable performance in various power conditions.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments, ensuring reliability in demanding applications.

Minimum Operating Temperature: 0 °C

Suitable for a variety of environments, making it a flexible choice for different applications.

Terminal Finish: TIN LEAD

Ensures excellent solderability and reliable connectivity in circuit designs.

Terminal Position: QUAD

Facilitates effective space management and connectivity on PCBs.

Maximum Seated Height: 4.57 mm

Low profile design minimizes space requirement in compact applications.

RAM Words: 512

Offers substantial memory for processing requirements of complex tasks.

Width: 24.18 mm

Compact size makes it suitable for tight spaces in multi-functional devices.

External Data Bus Width: 16

Allows efficient data handling and communication between components.

Maximum Clock Frequency: 50 MHz

High-speed operation enables quick processing, enhancing overall system performance.

Length: 24.18 mm

The dimension ensures compatibility with standard PCB layouts for ease of design.

Temperature Grade: COMMERCIAL

Reliable performance in typical commercial environments ensures product longevity.

ROM Bits Size: 1024 Bits

Adequate read-only memory for loading essential firmware and instructions.

Technology: CMOS

Offers low power consumption and high speed, making it energy-efficient.

Terminal Form: J BEND

Facilitates easy insertion and connection in various types of sockets.

Nominal Supply Voltage: 5 V

This standard voltage enhances compatibility with common electronic devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide range of compatibility with various microcontrollers enhances flexibility in design.

Terminal Pitch: 1.27 mm

Standardized pitch allows easy integration into widely used PCB designs.

Maximum Standby Current: 0.00002 Amp

Ultra-low standby current minimizes energy use in idle states, contributing to efficiency.

Maximum Access Time: 0.00000007 ns

Extremely fast access time enhances performance, making it suitable for high-speed applications.

No. of I/O Lines: 40

Provides comprehensive I/O capabilities to connect with multiple peripherals and devices.

Technical Specifications

Multi-functional Peripherals PSD503B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

64K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

1024 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

PSD503B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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