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STPCE1HDC

STMicroelectronics

STPCE1HDC by STMicroelectronics

STPCE1HDC by STMicroelectronics is a multi-functional peripheral with 32-bit address and data bus width. It operates at a max clock frequency of 14.318 MHz, suitable for PCI and ISA bus compatibility applications. The package style is grid array with 388 terminals in a square shape, making it ideal for surface mount designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,071 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,071

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Vyrian

USA . 1,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,215

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Anansix

USA . 480 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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480

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$63.212

100+ parts

-

1k+ parts

$56.891

10k+ parts

-

2,140

$63.212

-

$56.891

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Corohmni

South Africa . 1,970 parts In-Stock

1+ parts

$78.482

100+ parts

-

1k+ parts

-

10k+ parts

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1,970

$78.482

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MKK Technologies

India . 2,152 parts In-Stock

1+ parts

$118.867

100+ parts

-

1k+ parts

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10k+ parts

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2,152

$118.867

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-

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DigiPath Technology Company

USA . 2,152 parts In-Stock

1+ parts

$118.867

100+ parts

-

1k+ parts

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10k+ parts

-

2,152

$118.867

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-

-

Parana Technologies

USA . 1,875 parts In-Stock

1+ parts

-

100+ parts

$75.580

1k+ parts

-

10k+ parts

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1,875

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$75.580

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-

Corphita

USA . 1,592 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,592

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Overview

Discover the STPCE1HDC by STMicroelectronics, a cutting-edge multi-functional peripheral that offers unparalleled quality and reliability. Manufactured by industry leader STMicroelectronics, this product is designed to meet the highest standards in performance and efficiency. With a wide range of applications, this versatile component provides exceptional value and benefits to customers looking for top-of-the-line solutions. Upgrade your projects with the STPCE1HDC and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the multi-functional peripherals.

Maximum Supply Voltage: 2.75 V

The high maximum supply voltage allows the peripherals to support a wide range of input power levels.

Address Bus Width: 32

The wide address bus width enables the peripherals to handle large amounts of data efficiently.

Package Shape: SQUARE

The square package shape provides a compact design, saving space in the overall product layout.

No. of Terminals: 388

The high number of terminals facilitates the connectivity of various components and peripherals.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures the peripherals can operate efficiently even at lower power levels.

Maximum Seated Height: 2.38 mm

The low seated height allows for a slim and sleek design of the peripherals.

Width: 35 mm

The compact width makes the peripherals suitable for use in tight spaces or multiple peripheral setups.

External Data Bus Width: 32

The wide external data bus width allows for fast and efficient data transfer between the peripherals and connected devices.

Maximum Clock Frequency: 14.318 MHz

The high maximum clock frequency enables quick processing and response times for the peripherals.

Technical Specifications

Multi-functional Peripherals STPCE1HDC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

-40 TO 115 C OPERATING CASE TEMPERATURE

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

Length:

35 mm

No. of Terminals:

388

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Trade Compliance

STPCE1HDC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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