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STPCC0166BTI3

STMicroelectronics

STPCC0166BTI3 by STMicroelectronics

STPCC0166BTI3 by STMicroelectronics is a 32-bit multifunctional peripheral IC with 388 terminals. It operates at a max clock frequency of 14.318 MHz and supports PCI and ISA bus compatibility. Ideal for industrial applications requiring high-speed data processing in compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,748

-

-

-

-

Digiode

USA . 670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

670

-

-

-

-

Anansix

USA . 239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

239

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,975 parts In-Stock

1+ parts

$79.157

100+ parts

-

1k+ parts

$71.241

10k+ parts

-

1,975

$79.157

-

$71.241

-

Corohmni

South Africa . 112 parts In-Stock

1+ parts

$79.510

100+ parts

-

1k+ parts

-

10k+ parts

-

112

$79.510

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-

-

MKK Technologies

India . 1,066 parts In-Stock

1+ parts

$148.849

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$148.849

-

-

-

DigiPath Technology Company

USA . 1,066 parts In-Stock

1+ parts

$148.849

100+ parts

-

1k+ parts

-

10k+ parts

-

1,066

$148.849

-

-

-

Corphita

USA . 3,318 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,318

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-

-

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Parana Technologies

USA . 1,793 parts In-Stock

1+ parts

-

100+ parts

$94.644

1k+ parts

-

10k+ parts

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1,793

-

$94.644

-

-

Overview

Discover the STPCC0166BTI3 by STMicroelectronics, a top-tier Multi-functional Peripherals component crafted with precision and expertise. This versatile device offers seamless integration into various applications, providing unparalleled value to customers seeking efficiency and performance. Embrace the cutting-edge technology of STMicroelectronics and elevate your projects with the quality and reliability that only a trusted manufacturer can deliver. Elevate your projects to new heights with the STPCC0166BTI3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring easy handling and long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making the product suitable for compact setups.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, the product can handle power fluctuations effectively, increasing its reliability.

Address Bus Width: 32

A wider address bus width allows for efficient data transfer and processing, improving the overall performance of the product.

Package Shape: SQUARE

The square package shape makes the product easy to integrate into various systems and reduces the risk of damage during handling or shipping.

Power Supplies (V): 3.3

The power supply of 3.3V is a common standard in many applications, ensuring compatibility and ease of use.

No. of Terminals: 388

A high number of terminals allow for more connectivity options and functionality, making the product versatile and capable of handling various tasks.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical characteristics, enhancing the overall reliability and efficiency of the product.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures that the product can operate in low power conditions, saving energy and reducing costs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function in a wide range of environments, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can withstand harsh cold conditions, increasing its durability and reliability.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and stable performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy installation and maintenance, simplifying the overall use of the product.

Maximum Seated Height: 2.38 mm

The low maximum seated height makes the product suitable for slim devices and compact setups, offering flexibility in design.

Width: 35 mm

The compact width of 35mm allows for easy integration into different setups and reduces the overall footprint of the product.

External Data Bus Width: 32

A wide external data bus width enables high-speed data transfer and efficient communication, enhancing the performance of the product.

Maximum Clock Frequency: 14.318 MHz

The high maximum clock frequency enables fast processing speeds and smooth operation, making the product suitable for demanding tasks.

Length: 35 mm

The compact length of 35mm allows for easy placement and integration into various systems, saving space and enabling flexibility in design.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures that the product can withstand harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

Being a multifunction peripheral IC type, the product offers versatile functionality and can perform multiple tasks, providing value for money.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption, high speed, and reliable operation, making it an efficient choice.

Terminal Form: BALL

The ball terminal form offers good electrical contact and thermal performance, ensuring stable connections and efficient heat dissipation.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, the product operates at an optimal power level, enhancing its performance and longevity.

Bus Compatibility: PCI; ISA

Compatibility with PCI and ISA bus systems allows for easy integration into various setups and expands the product's connectivity options.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27mm enables high-density mounting and efficient use of space, making the product suitable for compact designs.

Speed: 66 rpm

With a speed of 66rpm, the product can deliver fast and efficient performance, making it suitable for high-speed data processing and communication tasks.

Technical Specifications

Multi-functional Peripherals STPCC0166BTI3 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

NO

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCC0166BTI3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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