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ZPSD511B1-70U

STMicroelectronics

ZPSD511B1-70U by STMicroelectronics

ZPSD511B1-70U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and is ideal for embedded applications. Its low-profile design ensures efficient space utilization in compact systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,424 parts In-Stock

1+ parts

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3,424

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Anansix

USA . 1,702 parts In-Stock

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1,702

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Digiode

USA . 451 parts In-Stock

1+ parts

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451

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$57.562

100+ parts

-

1k+ parts

$51.805

10k+ parts

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1,673

$57.562

-

$51.805

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$85.621

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478

$85.621

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MKK Technologies

India . 1,565 parts In-Stock

1+ parts

$108.241

100+ parts

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1,565

$108.241

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DigiPath Technology Company

USA . 1,565 parts In-Stock

1+ parts

$108.241

100+ parts

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1,565

$108.241

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Corphita

USA . 2,934 parts In-Stock

1+ parts

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2,934

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Parana Technologies

USA . 2,055 parts In-Stock

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$68.824

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2,055

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$68.824

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Overview

Unlock unparalleled performance with the ZPSD511B1-70U from STMicroelectronics, a leader in innovative semiconductor solutions. This multi-functional peripheral offers exceptional reliability and versatility, ideal for applications in consumer electronics, industrial automation, and communication systems. With its compact design and energy efficiency, it ensures seamless integration and enhanced productivity, empowering your projects to achieve new heights of excellence and innovation. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and makes the device lightweight, ideal for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

Address Bus Width: 16

The 16-bit address bus width expands memory access capabilities, enhancing performance.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, facilitating multiple layout options.

Power Supplies (V): 5

Operating at a nominal 5 V makes it compatible with standard electronic components and circuits.

No. of Terminals: 80

With 80 terminals, it provides ample I/O connections, supporting diverse functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design helps in maintaining a slim form factor in multi-functional peripherals.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures reliable operation in various power supply conditions.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature of 70 °C ensures reliability in warmer environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature down to 0 °C helps the device perform effectively in colder conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability and enhances connection reliability.

Terminal Position: QUAD

Quad terminal positioning contributes to improved electrical performance and easier board layout.

Maximum Seated Height: 1.6 mm

The low seated height allows for space-efficient designs, ideal for compact high-performance peripherals.

RAM Words: 1024

With 1024 RAM words, it offers sufficient memory for data processing and temporary storage during operations.

Width: 14 mm

A compact width of 14 mm makes it suitable for space-constrained applications.

External Data Bus Width: 8

The 8-bit external data bus width is beneficial for standard data communication protocols.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency of 50 MHz allows for fast processing speeds, enhancing overall performance.

Length: 14 mm

The 14 mm length ensures compatibility with various device footprints while maintaining a compact size.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the device is suitable for general use in various environments.

ROM Bits Size: 256 Bits

With a size of 256 bits, it provides sufficient permanent storage for essential firmware or control algorithms.

Technology: CMOS

Using CMOS technology ensures low power consumption and high efficiency, contributing to longer device lifespans.

Terminal Form: GULL WING

Gull wing terminal forms facilitate easy soldering and provide robust physical connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V simplifies integration in most electronic systems, ensuring broad compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Extensive bus compatibility makes this product a versatile choice for integration into various legacy and modern systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm helps in maintaining compact layouts and high-density designs.

Maximum Standby Current: 0.00002 Amp

A very low maximum standby current enhances power efficiency, crucial for battery-powered devices.

Maximum Access Time: 0.00000007 ns

Ultra-fast access time significantly improves response rates and overall system performance.

No. of I/O Lines: 40

Having 40 I/O lines provides extensive connectivity options for sensors, actuators, and other peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD511B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 8 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD511B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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