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ZPSD501B1-15U

STMicroelectronics

ZPSD501B1-15U by STMicroelectronics

ZPSD501B1-15U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its compact flatpack design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,211 parts In-Stock

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Anansix

USA . 2,009 parts In-Stock

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2,009

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Vyrian

USA . 398 parts In-Stock

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398

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,890 parts In-Stock

1+ parts

$49.706

100+ parts

-

1k+ parts

$44.735

10k+ parts

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1,890

$49.706

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$44.735

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MKK Technologies

India . 1,091 parts In-Stock

1+ parts

$93.468

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$93.468

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DigiPath Technology Company

USA . 1,091 parts In-Stock

1+ parts

$93.468

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1,091

$93.468

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Corphita

USA . 2,704 parts In-Stock

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2,704

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Parana Technologies

USA . 1,129 parts In-Stock

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$59.431

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$59.431

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Overview

Unlock unparalleled performance with the ZPSD501B1-15U from STMicroelectronics, a leader in high-quality multi-functional peripherals. Designed for efficiency and reliability, this low-profile solution enhances your applications across various sectors, ensuring optimal power management and compatibility with a range of architectures. Experience reduced setup complexities and improved system responsiveness, empowering your projects to achieve their full potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure longevity and reliability in various operational environments.

Surface Mount: YES

Surface mount technology allows for compact designs, saving space on circuit boards.

Maximum Supply Voltage: 5.5 V

Operating up to 5.5V provides flexibility in power supply options suitable for diverse applications.

Address Bus Width: 16

A 16-bit address bus enables efficient data handling and improved memory access capabilities.

Package Shape: SQUARE

Square package shape facilitates systematic placement and assembly on circuit boards.

Power Supplies (V): 5

Standard 5V power supply requirement simplifies integration into existing designs.

No. of Terminals: 80

A high terminal count allows for extensive connectivity options and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

Low-profile design is ideal for compact applications and enhances thermal performance.

Minimum Supply Voltage: 4.5 V

Supports a wide voltage range for versatile usage in various scenarios.

Maximum Operating Temperature: 70 °C

High operating temperature range ensures reliability in demanding environments.

Minimum Operating Temperature: 0 °C

Guaranteed operation in low-temperature settings enhances usability.

Terminal Finish: TIN LEAD

Tin-lead finish ensures good solderability and enhances durability.

Terminal Position: QUAD

Quad terminal placement minimizes space while maximizing connectivity.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for space-constrained applications.

RAM Words: 512

Generous RAM capacity supports complex processing tasks and improves performance.

Width: 14 mm

Compact width allows for easy integration into various form factors.

External Data Bus Width: 16

16-bit external data bus enhances communication speed and efficiency.

Maximum Clock Frequency: 34.48 MHz

High clock frequency allows for rapid processing, making it suitable for performance-critical applications.

Length: 14 mm

Optimal length aids in a compact design while allowing for efficient thermal management.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability for general consumer applications.

ROM Bits Size: 256 Bits

Suitable ROM size supports essential boot and runtime functions without excessive overhead.

Technology: CMOS

CMOS technology offers low power consumption and high density, ideal for portable devices.

Terminal Form: GULL WING

Gull wing terminals provide reliable mechanical and electrical connection, facilitating handling.

Nominal Supply Voltage: 5 V

Common supply voltage ensures compatibility with a wide range of peripherals.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility enhances versatility across multiple platforms and applications.

Terminal Pitch: 0.65 mm

Fine pitch facilitates high-density layouts while maintaining assembly efficiency.

Maximum Standby Current: 0.00002 Amp

Low standby current helps in reducing overall power consumption, making it energy efficient.

Maximum Access Time: 0.00000015 ns

Ultra-fast access time significantly improves data retrieval and processing speeds.

No. of I/O Lines: 40

A large number of I/O lines allows for extensive interfacing with various devices and components.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-15U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD501B1-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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