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ZPSD501B1-70UI

STMicroelectronics

ZPSD501B1-70UI by STMicroelectronics

ZPSD501B1-70UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at 5V. It features a max clock frequency of 36 MHz, and its industrial-grade design supports -40 °C to 85 °C. Ideal for embedded systems, it offers robust performance in compact applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,619 parts In-Stock

1+ parts

-

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3,619

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Vyrian

USA . 1,814 parts In-Stock

1+ parts

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1,814

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Anansix

USA . 1,804 parts In-Stock

1+ parts

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1,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 628 parts In-Stock

1+ parts

$31.288

100+ parts

-

1k+ parts

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10k+ parts

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628

$31.288

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IDEA Electronic Components Group

UK . 2,027 parts In-Stock

1+ parts

$40.511

100+ parts

-

1k+ parts

$36.460

10k+ parts

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2,027

$40.511

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$36.460

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MKK Technologies

India . 2,332 parts In-Stock

1+ parts

$76.179

100+ parts

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2,332

$76.179

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$76.179

100+ parts

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2,332

$76.179

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Corphita

USA . 3,327 parts In-Stock

1+ parts

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3,327

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Parana Technologies

USA . 400 parts In-Stock

1+ parts

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100+ parts

$48.437

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400

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$48.437

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Overview

Unlock the full potential of your designs with the ZPSD501B1-70UI from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile multi-functional peripheral that seamlessly enhances your applications. With robust performance in extreme conditions, this low-profile package ensures reliability and efficiency. Elevate your projects today with a component that embodies excellence and dependability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials enhances the product's reliability and longevity.

Surface Mount: YES

The surface mount capability allows for compact design and easy integration into various electronic devices.

Maximum Supply Voltage: 5.5 V

This voltage range is suitable for most modern electronic applications, ensuring compatibility.

Address Bus Width: 16

A 16-bit address bus width allows for efficient data handling and supports larger memory requirements.

Package Shape: SQUARE

The square package shape contributes to a compact footprint, saving space on circuit boards.

Power Supplies (V): 5

Standard 5V power supply compatibility makes it easy to integrate into common systems.

No. of Terminals: 80

With 80 terminals, this product supports a wide range of connections and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack design minimizes height, making it ideal for low-profile applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for greater flexibility in power supply designs.

Maximum Operating Temperature: 85 °C

This product can operate in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The capability to function in low temperatures ensures reliability in harsh conditions.

Terminal Finish: TIN LEAD

Tin-lead finish provides excellent solderability and corrosion resistance, ensuring long-term performance.

Terminal Position: QUAD

Quad terminal positioning optimizes space and improves signal integrity.

Maximum Seated Height: 1.6 mm

The low seated height supports compact designs, which are vital for minimizing device size.

RAM Words: 512

512 RAM words provide enough memory for various operational tasks, enhancing performance.

Width: 14 mm

A compact width of 14mm allows for versatile placement in space-constrained environments.

External Data Bus Width: 16

Support for a 16-bit data bus width improves data transfer rates and overall system performance.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz facilitates fast processing, meeting high-speed application demands.

Length: 14 mm

The length of 14mm complements the width, resulting in a compact performance package.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in a wide range of environmental conditions.

ROM Bits Size: 256 Bits

256 bits of ROM memory provides adequate storage for essential firmware and application code.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing leads enhance soldering reliability and simplify PCB assembly.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures compatibility with common logic levels in electronic circuits.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility allows for easy integration with a variety of microcontrollers and processors.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for dense packaging, beneficial in space-limited applications.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances energy efficiency, crucial for battery-operated devices.

Maximum Access Time: 0.00000007 ns

The fast access time enables high-speed processing, making it suitable for performance-critical applications.

No. of I/O Lines: 40

Forty I/O lines provide ample interfacing options for connecting peripherals and components.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-70UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

ZPSD501B1-70UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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