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ZPSD501B1-15L

STMicroelectronics

ZPSD501B1-15L by STMicroelectronics

ZPSD501B1-15L by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports multiple bus types, making it ideal for embedded applications. Its compact design ensures efficient integration in various systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,792 parts In-Stock

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1,792

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Anansix

USA . 1,669 parts In-Stock

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1,669

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Vyrian

USA . 289 parts In-Stock

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289

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$18.779

100+ parts

-

1k+ parts

$16.901

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1,080

$18.779

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$16.901

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MKK Technologies

India . 1,067 parts In-Stock

1+ parts

$35.313

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1,067

$35.313

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DigiPath Technology Company

USA . 1,067 parts In-Stock

1+ parts

$35.313

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1,067

$35.313

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Corphita

USA . 1,334 parts In-Stock

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1,334

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Parana Technologies

USA . 974 parts In-Stock

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$22.453

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974

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$22.453

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Overview

Elevate your designs with the ZPSD501B1-15L from STMicroelectronics, a leader in innovative technology. This versatile multi-functional peripheral combines exceptional reliability with a robust ceramic and metal-sealed package, ensuring superior performance across diverse applications—from consumer electronics to industrial systems. With low power consumption and impressive processing capabilities, it offers unmatched value, empowering you to create cutting-edge solutions that stand out in the market.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable material ensures long-term reliability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and faster assembly, saving space on the printed circuit board and enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides compatibility with a wider range of systems and components.

Address Bus Width: 16

A 16-bit address bus allows for addressing a larger memory space, increasing the capability of the peripheral.

Package Shape: SQUARE

The square shape optimizes space utilization on circuit boards, contributing to compact designs.

No. of Terminals: 68

A higher number of terminals can accommodate more connections, enabling greater functionality and versatility.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design with a window allows for easy visual inspection of the chip, enhancing usability during development and troubleshooting.

Minimum Supply Voltage: 4.5 V

The ability to operate at a lower supply voltage improves power efficiency, making it a cost-effective choice for energy-sensitive applications.

Maximum Operating Temperature: 70 °C

This high maximum operating temperature allows for usage in demanding environments, increasing the range of applications.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in a variety of conditions, making it reliable in numerous settings.

Terminal Position: QUAD

Quad terminal positioning allows for more efficient circuit connections, facilitating easy integration into various systems.

Maximum Seated Height: 4.57 mm

A low seated height aids in reducing the overall profile of the packaged device, making it suitable for applications where space is at a premium.

RAM Words: 512

With 512 RAM words available, it provides sufficient memory for performing complex functions and processing data efficiently.

Width: 24.105 mm

A compact width contributes to the versatility of the device in design scenarios with limited space.

External Data Bus Width: 16

A 16-bit external data bus enhances data transfer speeds, resulting in better overall performance for data-intensive applications.

Maximum Clock Frequency: 34.48 MHz

High clock frequency allows for faster processing speeds, improving performance in time-sensitive applications.

Length: 24.105 mm

A consistent length with the width supports a square design, which is advantageous for both efficient design and thermal management.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the unit operates reliably in standard conditions, suitable for a wide range of consumer applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high-speed performance, making it ideal for battery-operated devices.

Terminal Form: J BEND

J bend terminals provide robust mechanical support during installation and improve electrical connection reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V aligns well with common circuits, making it easy to integrate into existing designs.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Compatibility with a wide range of bus standards enhances interoperability, allowing it to function seamlessly in diverse applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm eases the design process and ensures compatibility with commonly used circuit boards.

No. of I/O Lines: 40

With 40 I/O lines available, the device can interface with multiple peripherals or sensors, enhancing its functionality in complex systems.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-15L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD501B1-15L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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