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CY8C3666LTI-201

Infineon Technologies

CY8C3666LTI-201 by Infineon Technologies

CY8C3666LTI-201 by Infineon: 5.5V max supply, 33MHz clock freq, 4096 RAM words. Ideal for industrial applications with I2C, USB, PS/2 bus compatibility and -40 to 85°C operating temp range.

Median Price

$9.149

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 467 parts In-Stock

1+ parts

$10.168

100+ parts

-

1k+ parts

-

10k+ parts

$8.312

467

$10.168

-

-

$8.312

Flip Electronics (Authorized)

USA . 9 parts In-Stock

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9

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Rochester

USA . 2 parts In-Stock

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100+ parts

$8.130

1k+ parts

$7.280

10k+ parts

$6.850

2

-

$8.130

$7.280

$6.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 226 parts In-Stock

1+ parts

$8.588

100+ parts

-

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226

$8.588

-

-

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Vyrian

USA . 666 parts In-Stock

1+ parts

$9.040

100+ parts

-

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666

$9.040

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Flip Electronics

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 236 parts In-Stock

1+ parts

$7.680

100+ parts

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236

$7.680

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Corphita

USA . 250 parts In-Stock

1+ parts

$8.136

100+ parts

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250

$8.136

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Component Stockers USA

USA . 3,899 parts In-Stock

1+ parts

$9.130

100+ parts

$11.190

1k+ parts

$11.190

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3,899

$9.130

$11.190

$11.190

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Corohmni

South Africa . 69 parts In-Stock

1+ parts

$17.664

100+ parts

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69

$17.664

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Modulus Dynamics

Lithuania . 3,912 parts In-Stock

1+ parts

$20.009

100+ parts

$19.209

1k+ parts

$18.408

10k+ parts

-

3,912

$20.009

$19.209

$18.408

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Microchip USA

USA . 1,679 parts In-Stock

1+ parts

$25.520

100+ parts

$25.150

1k+ parts

$24.970

10k+ parts

$24.790

1,679

$25.520

$25.150

$24.970

$24.790

Continental Prestige Electronics

USA . 3,735 parts In-Stock

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3,735

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,908 parts In-Stock

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1,908

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Perfect Parts

USA . 381 parts In-Stock

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381

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Overview

Unlock endless possibilities with the CY8C3666LTI-201 by Infineon Technologies. Crafted with precision and reliability, this multi-functional peripheral is designed to elevate your projects to new heights. From its efficient surface mount capability to its wide array of applications, this product offers unparalleled value and benefits. Embrace innovation and experience seamless integration with the CY8C3666LTI-201, where quality meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Provides a wide operating voltage range, making the device versatile and compatible with various power sources.

Package Shape: SQUARE

Square packages are compact and efficient for mounting, enabling a high density of components on a PCB.

Power Supplies (V): 1.8/5

Supports multiple power supply options, allowing flexibility in powering the device according to different requirements.

No. of Terminals: 68

The large number of terminals enables the device to handle a wide range of input and output signals, enhancing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of these package styles offers a balance of efficient heat dissipation, compact size, and thin profile for space-saving solutions.

Minimum Supply Voltage: 1.71 V

Allows for operation even at low supply voltages, increasing the device's versatility and compatibility with various power sources.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, ideal for use in cold environments or applications with varying temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the device.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates that the device's memory cannot be easily altered or erased, ensuring data integrity and security.

Terminal Position: QUAD

Quad terminal position enhances stability and connectivity, reducing the risk of signal interference and improving overall performance.

Maximum Seated Height: 1 mm

With a low seated height, the device can be easily integrated into compact systems or applications with height restrictions.

RAM Words: 4096

Ample RAM capacity for storing and processing data efficiently, enabling smooth operation and multitasking capabilities.

Width: 8 mm

Narrow width facilitates space-saving mounting and integration in devices with limited physical dimensions or board space.

Boundary Scan: YES

Boundary scan support allows for efficient testing and debugging during manufacturing or troubleshooting, ensuring quality and reliability.

Maximum Clock Frequency: 33 MHz

High clock frequency enables fast data processing and communication, suitable for applications with high-speed requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specific duration during assembly processes, ensuring proper soldering and mounting without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable solder joints and component connections during assembly and rework processes.

Length: 8 mm

Compact length makes the device suitable for space-constrained applications or designs, allowing for flexible integration.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making it suitable for rugged applications.

ROM Bits Size: 524288 Bits

Large ROM capacity for storing program data, enabling the device to support complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems and devices.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with regulations, promoting sustainability and safety in electronics manufacturing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance and optimal power efficiency, suitable for a wide range of applications.

Bus Compatibility: I2C; USB; PS/2; 8051

Supports multiple bus protocols, enabling seamless connectivity with various systems and devices for enhanced functionality and versatility.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and connection, maximizing the device's functionality in compact designs or applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring careful handling during storage and assembly to prevent moisture-related damage.

No. of I/O Lines: 46

Abundance of I/O lines enables versatile connectivity and data exchange with external devices, expanding the device's compatibility and functionality.

Technical Specifications

Multi-functional Peripherals CY8C3666LTI-201 attributes and parameters. Explore more Multi-functional Peripherals devices from Infineon Technologies

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; USB; PS/2; 8051

Maximum Clock Frequency:

33 MHz

JESD-30 Code:

S-XQCC-N68

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC68,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

RAM Words:

4096

ROM Bits Size:

524288 Bits

Maximum Seated Height:

1 mm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

8 mm

Trade Compliance

CY8C3666LTI-201 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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