Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6Q5EYM10ACR by NXP Semiconductors is a multi-functional peripheral with integrated cache and surface mount capability. It has a max supply voltage of 1.5V and is commonly used in applications such as grid arrays, heat sinks, and bottom terminal positions.
Median Price
$57.512
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Verical
1+ parts
-
100+ parts
1k+ parts
10k+ parts
Flip Electronics (Authorized)
Nova Conductors
$71.125
TME
$81.319
Anansix
Digiode
Flip Electronics
Vyrian
Bristol Electronics
One Stop Electronics
$14.000
Ampacity Inc.
$25.000
Aztec Data Supply Inc.
$43.120
Semicontronic
$47.930
$46.732
$46.492
Advanced Electronics
$51.300
$48.735
Continental Prestige Electronics
$69.703
Corohmni
$83.900
Microchip USA
$149.869
Corphita
Perfect Parts
Authorized Procurement Solutions
UNI Independent Distributors
Argo Parts USA
The plastic/epoxy body material ensures durability and lightweight design, making it suitable for portable multi-functional peripherals.
The integrated cache improves processing speed and efficiency, enhancing the overall performance of the multi-functional peripheral.
With surface mount capability, this product can be easily mounted on circuit boards, saving space and simplifying installation.
The high maximum supply voltage allows for reliable and stable operation, ensuring consistent performance.
The wide address bus width enables efficient data transfer, supporting advanced functionalities of the multi-functional peripheral.
The square package shape provides convenient and efficient component placement, maximizing space utilization.
The large number of terminals allows for versatile connectivity options, making it suitable for various input and output devices.
The grid array package style with a heat sink/slug ensures effective heat dissipation, preventing overheating issues and improving longevity.
The low minimum supply voltage saves power and increases energy efficiency, extending the product's battery life.
The tin silver copper terminal finish enhances conductivity and resistance to corrosion, ensuring reliable connections and minimizing signal loss.
The bottom terminal position facilitates easy integration with other components and enables efficient circuit board layout.
The low maximum seated height allows for a compact form factor, enabling space-saving integration in various devices.
The compact width ensures the multi-functional peripheral can fit into small spaces, making it suitable for space-constrained applications.
The inclusion of boundary scan capability enables efficient testing and debugging, reducing development time and improving product quality.
The wide external data bus width enables high-speed data transfer, supporting seamless connectivity with other devices.
The maximum time at peak reflow temperature ensures proper soldering and component attachment during manufacturing, enhancing reliability.
The high peak reflow temperature allows for effective soldering and component bonding, ensuring robust and long-lasting connections.
The compact length of the multi-functional peripheral enhances its versatility and ease of integration into various devices.
The peripheral IC type indicates that this product is designed specifically for various peripheral devices, ensuring compatibility and optimal performance.
The CMOS technology used in this product ensures low power consumption, high performance, and compatibility with modern electronic systems.
The ball terminal form simplifies installation and ensures secure and reliable connections, making it suitable for various applications.
The nominal supply voltage represents the average operating voltage, allowing for stable and efficient performance under normal operating conditions.
The small terminal pitch provides high-density mounting options, enabling the multi-functional peripheral to be used in compact electronic devices.
The fixed point format ensures accurate and precise numerical calculations, enhancing the reliability and quality of data processing.
The moisture sensitivity level indicates that this product can withstand moderate moisture exposure, making it suitable for various environments.
The high speed capability of 1000 rpm ensures fast and efficient data transfer, enhancing overall productivity and performance.
The inclusion of a low power mode allows for energy-efficient operation, conserving power and extending battery life.
Multi-functional Peripherals MCIMX6Q5EYM10ACR attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MCIMX6Q5EYM10ACR Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
STPCE1EDBI
STMicroelectronics
STPCE1EDBI by STMicroelectronics is a multi-functional peripheral with 32-bit address and external data bus width. It operates at a max clock frequency of 14.318 MHz, suitable for PCI and ISA bus compatibility applications. The package style is grid array with 388 terminals in a square shape, making it ideal for surface mount designs.
CY8C28452-24PVXI
Cypress Semiconductor
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
DRA404BIPTP
Texas Instruments
MULTIFUNCTION PERIPHERAL;
MCIMX6G3DVM05AA
Freescale Semiconductor
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
PSD513B1-90LI
PSD513B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus types, making it ideal for industrial applications. Its compact ceramic package ensures durability in extreme temperatures from -40 °C to 85°C.
ZPSD501B1V-25L
ZPSD501B1V-25L by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its compact ceramic package ensures reliable performance in commercial environments.
LH75401N0Q100C0,55
NXP Semiconductors
NXP Semiconductors' LH75401N0Q100C0,55 is a Multi-functional Peripheral IC with 24-bit Address Bus, 16-bit External Data Bus, and 20 MHz Clock Frequency. Ideal for applications requiring CAN, SSP, and UART(3) bus compatibility in a compact FLATPACK package.
MGM13P12F512GA-V2R
Silicon Labs
Multifunction Peripherals;
CYBL10561-56LQXI
CYBL10561-56LQXI by Cypress Semiconductor is a multi-functional peripheral with 36 I/O lines, 8192 RAM words, and 48 MHz clock frequency. It is used in industrial applications for its CMOS technology, I2C bus compatibility, and wide operating temperature range from -40 to 85 °C.
STPCC0390BTC3
STPCC0390BTC3 by STMicroelectronics is a 32-bit multifunctional peripheral IC with 388 terminals. It operates at a max clock frequency of 14.318 MHz and supports PCI and ISA bus compatibility. This CMOS technology device has a package style of grid array, making it suitable for various commercial applications requiring high-speed data processing.
XDRA777PSIGACD
XDRA777PSIGACD by Texas Instruments is a multi-functional peripheral with 32-bit address bus width, 64-bit external data bus width, and 38.4 MHz max clock frequency. Ideal for automotive applications, it features AEC-Q100 screening level and supports CAN, Ethernet, I2C, SPI, UART, and USB bus compatibility.
DRA404HSCIPTP
DRB402BIPTP
STID337-YCB
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
DRA404IZDU
CY8C4125AZI-M443
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
DRE402IPTP
DRA722AHGABCQ1
DRA722AHGABCQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and a max clock frequency of 27 MHz. Ideal for automotive applications, this microprocessor features a CMOS technology, operates at temperatures ranging from -40 to 125 °C, and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.
DRF404IPTP
SSM1105V-90T1T
SSM1105V-90T1T by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and operates b/w 2.7V to 3.6V. It features a low-profile, fine-pitch package with 100 terminals, ideal for compact applications. Its commercial grade ensures reliable performance up to 70 °C.
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MCIMX535DVV1CR2
Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
MCIMX535DVV2C
MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.
MCIMX6Q5EYM10ADR
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MCIMX6Q5EYM10ACR
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
MCIMX6Q5EYM12AC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MCIMX257CJM4AR2
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM12AD
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6Q6AVT10ACR
MULTIFUNCTION PERIPHERAL; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 40; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCIMX6Q5EYM10AE
Multifunction Peripherals; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MCIMX6G2AVM07AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX351AJQ5C
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX357CJQ5CR2
MCIMX6G2DVM05AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX356AJQ5C
MCIMX356AJQ5CR2
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER OVER NICKEL; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCIMX6Y0DVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y0CVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Q5EYM10CC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 32;
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