Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6Q5EYM10ACR by NXP Semiconductors is a multi-functional peripheral with integrated cache and surface mount capability. It has a max supply voltage of 1.5V and is commonly used in applications such as grid arrays, heat sinks, and bottom terminal positions.
Median Price
$57.512
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Verical
1+ parts
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100+ parts
1k+ parts
10k+ parts
Flip Electronics (Authorized)
Nova Conductors
$71.125
TME
$81.319
Anansix
Digiode
Flip Electronics
Vyrian
Bristol Electronics
One Stop Electronics
$14.000
Ampacity Inc.
$25.000
Aztec Data Supply Inc.
$43.120
Semicontronic
$47.930
$46.732
$46.492
Advanced Electronics
$51.300
$48.735
Continental Prestige Electronics
$69.703
Corohmni
$83.900
Microchip USA
$149.869
Corphita
Perfect Parts
Authorized Procurement Solutions
UNI Independent Distributors
Argo Parts USA
The plastic/epoxy body material ensures durability and lightweight design, making it suitable for portable multi-functional peripherals.
The integrated cache improves processing speed and efficiency, enhancing the overall performance of the multi-functional peripheral.
With surface mount capability, this product can be easily mounted on circuit boards, saving space and simplifying installation.
The high maximum supply voltage allows for reliable and stable operation, ensuring consistent performance.
The wide address bus width enables efficient data transfer, supporting advanced functionalities of the multi-functional peripheral.
The square package shape provides convenient and efficient component placement, maximizing space utilization.
The large number of terminals allows for versatile connectivity options, making it suitable for various input and output devices.
The grid array package style with a heat sink/slug ensures effective heat dissipation, preventing overheating issues and improving longevity.
The low minimum supply voltage saves power and increases energy efficiency, extending the product's battery life.
The tin silver copper terminal finish enhances conductivity and resistance to corrosion, ensuring reliable connections and minimizing signal loss.
The bottom terminal position facilitates easy integration with other components and enables efficient circuit board layout.
The low maximum seated height allows for a compact form factor, enabling space-saving integration in various devices.
The compact width ensures the multi-functional peripheral can fit into small spaces, making it suitable for space-constrained applications.
The inclusion of boundary scan capability enables efficient testing and debugging, reducing development time and improving product quality.
The wide external data bus width enables high-speed data transfer, supporting seamless connectivity with other devices.
The maximum time at peak reflow temperature ensures proper soldering and component attachment during manufacturing, enhancing reliability.
The high peak reflow temperature allows for effective soldering and component bonding, ensuring robust and long-lasting connections.
The compact length of the multi-functional peripheral enhances its versatility and ease of integration into various devices.
The peripheral IC type indicates that this product is designed specifically for various peripheral devices, ensuring compatibility and optimal performance.
The CMOS technology used in this product ensures low power consumption, high performance, and compatibility with modern electronic systems.
The ball terminal form simplifies installation and ensures secure and reliable connections, making it suitable for various applications.
The nominal supply voltage represents the average operating voltage, allowing for stable and efficient performance under normal operating conditions.
The small terminal pitch provides high-density mounting options, enabling the multi-functional peripheral to be used in compact electronic devices.
The fixed point format ensures accurate and precise numerical calculations, enhancing the reliability and quality of data processing.
The moisture sensitivity level indicates that this product can withstand moderate moisture exposure, making it suitable for various environments.
The high speed capability of 1000 rpm ensures fast and efficient data transfer, enhancing overall productivity and performance.
The inclusion of a low power mode allows for energy-efficient operation, conserving power and extending battery life.
Multi-functional Peripherals MCIMX6Q5EYM10ACR attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MCIMX6Q5EYM10ACR Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
SMBJ18CA
Sensitron Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
ESD5Z5.0T1G
ESD5Z5.0T1G by Onsemi is a unidirectional Trans Voltage Suppressor Diode with 5V reverse test voltage and 174W peak power dissipation. It is used for transient suppression in electronic circuits, meeting IEC-61000-4-2, 4-4 standards and UL recognized for reliability.
American Power Devices
Philips Components
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
2N7002-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Frontier Electronics
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
Shenzhen Yixinsemi Electronics
STA1295EOA
STMicroelectronics
MULTIFUNCTION PERIPHERAL;
CY8C4014LQI-422T
Cypress Semiconductor
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
DRA718BJGCBDRQ1
Texas Instruments
DRA718BJGCBDRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and a max clock frequency of 38.4 MHz. Ideal for automotive applications, it features a temperature grade of AUTOMOTIVE and compatibility with CAN, ETHERNET, I2C, IRDA, PCI, SPI, UART, and USB interfaces.
CY8C29566-24AXI
Infineon Technologies
CY8C29566-24AXI by Infineon Technologies is an 8-bit microcontroller with a max clock frequency of 24 MHz. It features 2K RAM and 32768 ROM words, suitable for industrial applications. With a package style of flatpack and low profile, it has a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 85 °C.
MCIMX6QP6AVT1ABR
NXP Semiconductors
Multifunction Peripherals;
ZPSD511B1-70J
ZPSD511B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 1024 RAM words and supports various bus architectures, making it ideal for embedded applications. Its compact chip carrier design ensures efficient integration in space-constrained environments.
ZPSD512B1-15L
ZPSD512B1-15L by STMicroelectronics is a versatile CMOS peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports multiple bus types, and is ideal for embedded systems requiring reliable data processing. Its compact ceramic package ensures efficient thermal management in commercial applications.
CY8C4014LQI-421
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HQCCN; Package Shape: SQUARE;
CY8C29466-24PVXI
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
STA2065A
STA2065A by STMicroelectronics is a multi-functional peripheral IC with 32K RAM words. It operates in industrial temperature range (-40 to 85 °C) and supports CAN, I2C, I2S, SPI, SSP, UART USB bus compatibility. The package style is grid array with thin profile and fine pitch terminals for surface mount applications.
LS1026AXN8T1A
LS1026AXN8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, USB buses and has a max supply voltage of 1.03V. Ideal for applications requiring high-speed data processing and connectivity.
CY8C4124PVI-442T
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
66AK2H06DAAWA2
The Texas Instruments 66AK2H06DAAWA2 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature range, suitable for microprocessor applications requiring Ethernet, I2C, PCI, SPI, UART, and USB compatibility. The package style is grid array with 1517 terminals and a terminal pitch of 1mm.
CY8C3246PVI-147T
Infineon's CY8C3246PVI-147T is a 48-terminal CMOS peripheral IC with 8192 RAM words, operating at up to 25 MHz. Ideal for applications requiring compatibility with various bus protocols like I2C, SPI, and UART. This multi-functional device has a small outline package style and operates b/w -40°C to 85°C.
TDA2SGBRQABCQ1
TDA2SGBRQABCQ1 by Texas Instruments is a 32-bit microprocessor with 760 terminals, operating at up to 38.4 MHz. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB interfaces in a compact square package with a low power mode and boundary scan feature.
X66AK2G12ABY60
X66AK2G12ABY60 by Texas Instruments is a Multi-functional Peripheral IC with 32-bit External Data Bus Width and 16-bit Address Bus Width. It operates b/w 0-70 °C, compatible with CAN, ETHERNET, I2C, PCI, SPI, UART, USB buses. This low-profile device has 625 terminals in a square package for various commercial applications.
STPCC0310BTC3
STPCC0310BTC3 by STMicroelectronics is a 32-bit multifunction peripheral IC with 388 terminals. It operates at a max clock frequency of 100 MHz and supports PCI and ISA bus compatibility. This CMOS technology device has a package style of grid array, making it suitable for various commercial applications requiring high-speed data processing.
CY8C5888LTI-LP097
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
STPCV1KEBI
STPCV1KEBI by STMicroelectronics is a versatile multi-functional peripheral with a 32-bit address bus and operates at a max supply voltage of 3.6 V. It features industrial-grade temperature tolerance from -40 °C to 105 °C and supports boundary scan. Ideal for applications requiring reliable performance in compact designs, it comes in a square grid array package.
CYBL10563-68FNXIT
CYBL10563-68FNXIT by Cypress: 68-terminal GRID ARRAY with 48 MHz clock, 8192 RAM words. Ideal for industrial applications requiring I2C bus compatibility and operating temperatures from -40 to 85 °C.
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MCIMX535DVV1CR2
Freescale Semiconductor
Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
MCIMX535DVV2C
MCIMX535DVV2C by NXP Semiconductors is a CMOS technology chip with 529 terminals in a square package. It operates b/w 1.3-1.4 V, has a terminal pitch of 0.8 mm, and can withstand peak reflow temperature of 260°C. Ideal for multi-functional peripherals requiring fine-pitch grid array packaging.
MCIMX6Q5EYM10ADR
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MCIMX6Q5EYM10ACR
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
MCIMX6Q5EYM12AC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;
MCIMX257CJM4AR2
MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6Q5EYM12AD
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6Q6AVT10ACR
MULTIFUNCTION PERIPHERAL; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 40; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 260;
MCIMX6Q5EYM10AE
Multifunction Peripherals; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
MCIMX6G2AVM07AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX351AJQ5C
Multifunction Peripherals; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX357CJQ5CR2
MCIMX6G2DVM05AB
MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX356AJQ5C
MCIMX356AJQ5CR2
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER OVER NICKEL; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
Multifunction Peripherals; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCIMX6Y0DVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Y0CVM05AB
Multifunction Peripherals; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
MCIMX6Q5EYM10CC
MULTIFUNCTION PERIPHERAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 32;
Supply Digital Components
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