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TDA2SGBRQABCQ1

Texas Instruments

TDA2SGBRQABCQ1 by Texas Instruments

TDA2SGBRQABCQ1 by Texas Instruments is a 32-bit microprocessor with 760 terminals, operating at up to 38.4 MHz. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB interfaces in a compact square package with a low power mode and boundary scan feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,449 parts In-Stock

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4,449

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Digiode

USA . 3,915 parts In-Stock

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3,915

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Sunrise Surplus Inc.

USA . 277 parts In-Stock

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277

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Inventory MP

USA . 51 parts In-Stock

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51

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Bristol Electronics

USA . 51 parts In-Stock

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51

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,017 parts In-Stock

1+ parts

$11.000

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1,017

$11.000

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AZTECH Wire

Italy . 275 parts In-Stock

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$17.431

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275

$17.431

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Parana Technologies

USA . 675 parts In-Stock

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$58.706

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675

$58.706

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ChromeModa Solutions

Germany . 6,939 parts In-Stock

1+ parts

$65.962

100+ parts

$54.089

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6,939

$65.962

$54.089

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IDEA Electronic Components Group

UK . 648 parts In-Stock

1+ parts

$65.962

100+ parts

$62.664

1k+ parts

$59.366

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648

$65.962

$62.664

$59.366

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Corohmni

South Africa . 48 parts In-Stock

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$78.013

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48

$78.013

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Corphita

USA . 2,821 parts In-Stock

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2,821

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DigiPath Technology Company

USA . 1,435 parts In-Stock

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$59.471

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1,435

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$59.471

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Overview

Experience unmatched performance and reliability with the TDA2SGBRQABCQ1 by Texas Instruments, a cutting-edge multi-functional peripheral for automotive applications. Designed with precision and expertise, this product offers customers unparalleled value and benefits in their projects. From its advanced technology to its wide range of bus compatibility, this device ensures seamless integration and optimal functionality. Trust Texas Instruments for quality and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and stability to the product, ensuring a longer lifespan.

Maximum Supply Voltage: 1.2 V

The higher maximum supply voltage allows for compatibility with various power sources and enhances overall performance.

Minimum Operating Temperature: -40 °C

With a wide range of operating temperature, this product can function effectively in diverse environmental conditions.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

The product's compatibility with multiple bus interfaces enables seamless connectivity and communication with different devices.

Peripheral IC Type: MICROPROCESSOR, RISC

The use of RISC architecture in the microprocessor ensures efficient and high-speed processing of data, making this product suitable for various applications.

Technical Specifications

Multi-functional Peripherals TDA2SGBRQABCQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

750 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TDA2SGBRQABCQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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