Loading...

TDA2EGBDQCBDQ1

Texas Instruments

TDA2EGBDQCBDQ1 by Texas Instruments

TDA2EGBDQCBDQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and 38.4 MHz max clock frequency. Ideal for automotive applications due to AEC-Q100 screening level and CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,613

-

-

-

-

Digiode

USA . 1,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,711

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$15.534

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$15.534

-

-

-

Corohmni

South Africa . 209 parts In-Stock

1+ parts

$21.493

100+ parts

-

1k+ parts

-

10k+ parts

-

209

$21.493

-

-

-

One Stop Electronics

USA . 1,501 parts In-Stock

1+ parts

$34.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,501

$34.000

-

-

-

Parana Technologies

USA . 2,000 parts In-Stock

1+ parts

$52.546

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$52.546

-

-

-

DigiPath Technology Company

USA . 1,379 parts In-Stock

1+ parts

$57.859

100+ parts

$53.230

1k+ parts

-

10k+ parts

-

1,379

$57.859

$53.230

-

-

ChromeModa Solutions

Germany . 3,919 parts In-Stock

1+ parts

$59.040

100+ parts

$48.413

1k+ parts

-

10k+ parts

-

3,919

$59.040

$48.413

-

-

IDEA Electronic Components Group

UK . 776 parts In-Stock

1+ parts

$59.040

100+ parts

$56.088

1k+ parts

$53.136

10k+ parts

-

776

$59.040

$56.088

$53.136

-

Lixinc

USA . 18,313 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,313

-

-

-

-

Corphita

USA . 3,633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,633

-

-

-

-

Overview

Discover the ultimate solution for your multi-functional peripherals with the TDA2EGBDQCBDQ1 by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. Whether you're in the automotive industry or looking to enhance your electronic devices, this versatile component is sure to exceed your expectations. Experience seamless integration, high-speed performance, and unmatched efficiency with the TDA2EGBDQCBDQ1. Elevate your projects to the next level with this innovative solution from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material offers durability and lightweight design, making the product easy to handle and transport.

Maximum Supply Voltage: 1.2 V

Operates efficiently within the specified voltage range, ensuring optimal performance.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the product meets automotive quality standards, making it reliable for automotive applications.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments without compromising performance.

RAM Words: 512K

Large RAM capacity allows for efficient processing and storage of data, improving overall performance.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Supports a variety of bus interfaces, making it versatile and compatible with different systems and devices.

Technical Specifications

Multi-functional Peripherals TDA2EGBDQCBDQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B538

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

186

No. of Terminals:

538

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

1.298 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Trade Compliance

TDA2EGBDQCBDQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19