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CC1111F8RSP

Texas Instruments

CC1111F8RSP by Texas Instruments

Multifunction Peripherals; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$5.603

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,774 parts In-Stock

1+ parts

$5.603

100+ parts

$4.568

1k+ parts

$3.045

10k+ parts

-

8,774

$5.603

$4.568

$3.045

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,125 parts In-Stock

1+ parts

$5.323

100+ parts

-

1k+ parts

-

10k+ parts

-

3,125

$5.323

-

-

-

Vyrian

USA . 8,357 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,357

-

-

-

-

Euro-Tech

UK . 980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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980

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,432 parts In-Stock

1+ parts

$5.043

100+ parts

-

1k+ parts

-

10k+ parts

-

1,432

$5.043

-

-

-

Native Components

USA . 181 parts In-Stock

1+ parts

$14.200

100+ parts

-

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-

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181

$14.200

-

-

-

Northwest PG Solutions

USA . 963 parts In-Stock

1+ parts

$15.620

100+ parts

$14.058

1k+ parts

-

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963

$15.620

$14.058

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-

AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$18.030

100+ parts

-

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-

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744

$18.030

-

-

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Parana Technologies

USA . 1,301 parts In-Stock

1+ parts

$30.951

100+ parts

-

1k+ parts

$69.908

10k+ parts

-

1,301

$30.951

-

$69.908

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ChromeModa Solutions

Germany . 6,263 parts In-Stock

1+ parts

$34.776

100+ parts

$28.516

1k+ parts

-

10k+ parts

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6,263

$34.776

$28.516

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IDEA Electronic Components Group

UK . 1,129 parts In-Stock

1+ parts

$34.776

100+ parts

$33.037

1k+ parts

$31.298

10k+ parts

-

1,129

$34.776

$33.037

$31.298

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Corohmni

South Africa . 3,080 parts In-Stock

1+ parts

$37.511

100+ parts

-

1k+ parts

-

10k+ parts

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3,080

$37.511

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-

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DigiPath Technology Company

USA . 2,267 parts In-Stock

1+ parts

-

100+ parts

$31.354

1k+ parts

-

10k+ parts

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2,267

-

$31.354

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Technical Specifications

Multi-functional Peripherals CC1111F8RSP attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

CPU Family:

8051

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

21

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

4096

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC1111F8RSP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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