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ZPSD501B1V-25U

STMicroelectronics

ZPSD501B1V-25U by STMicroelectronics

ZPSD501B1V-25U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its low-profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,553 parts In-Stock

1+ parts

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4,553

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Digiode

USA . 4,156 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,156

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Anansix

USA . 2,416 parts In-Stock

1+ parts

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100+ parts

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2,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,267 parts In-Stock

1+ parts

$27.583

100+ parts

-

1k+ parts

$24.824

10k+ parts

-

1,267

$27.583

-

$24.824

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MKK Technologies

India . 316 parts In-Stock

1+ parts

$51.867

100+ parts

-

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316

$51.867

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DigiPath Technology Company

USA . 316 parts In-Stock

1+ parts

$51.867

100+ parts

-

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10k+ parts

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316

$51.867

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Corphita

USA . 1,715 parts In-Stock

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1,715

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Parana Technologies

USA . 335 parts In-Stock

1+ parts

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100+ parts

$32.979

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10k+ parts

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335

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$32.979

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Overview

Elevate your designs with the ZPSD501B1V-25U from STMicroelectronics, a leading name in innovative semiconductor solutions. This versatile multi-functional peripheral is engineered for efficiency and reliability, making it ideal for various applications—from consumer electronics to automotive systems. Enjoy superior performance with a low-profile design that optimizes space while ensuring robust operation across diverse environments. Choose quality and innovation for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resilience against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a broad range of voltage supply, making it compatible with various power sources.

Address Bus Width: 16

A 16-bit address bus allows for extensive memory addressing, enabling complex applications.

Package Shape: SQUARE

The square shape facilitates easy placement on PCBs and aligns well with grid layouts.

No. of Terminals: 80

With 80 terminals, it provides sufficient connectivity options for versatile functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design aids in reducing overall height in compact systems.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage enhances compatibility with various power systems.

Maximum Operating Temperature: 70 °C

Its ability to operate at high temperatures ensures reliability in demanding environments.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, suitable for various indoor and outdoor applications.

Terminal Position: QUAD

Quad terminal position facilitates easy routing and layout on printed circuit boards.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for designs requiring a slim profile.

RAM Words: 512

512 words of RAM allows for efficient data handling and processing, suitable for embedded applications.

Width: 14 mm

Compact width contributes to space-efficient designs in multi-functional systems.

External Data Bus Width: 16

Having a 16-bit external data bus enhances data transfer rates and processing capabilities.

Maximum Clock Frequency: 33.33 MHz

A high clock frequency supports better performance for demanding applications.

Length: 14 mm

Short length ensures that the product can fit into tight spaces in electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grading means it is suitable for a broad range of everyday applications.

Technology: CMOS

CMOS technology offers low power consumption, making it energy efficient for prolonged usage.

Terminal Form: GULL WING

Gull-wing terminals allow for easy soldering and reliable connections on PCBs.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is standard across many devices, enhancing compatibility.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Compatibility with a wide range of bus architectures facilitates integration into existing systems.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is standard for many applications, promoting ease of assembly.

No. of I/O Lines: 40

With 40 I/O lines, this product can interface with a variety of devices for added functionality.

Technical Specifications

Multi-functional Peripherals ZPSD501B1V-25U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

ZPSD501B1V-25U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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