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ZPSD501B1V-20U

STMicroelectronics

ZPSD501B1V-20U by STMicroelectronics

ZPSD501B1V-20U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5 V. It features 512 RAM words and supports various bus types, making it ideal for embedded applications. Its low-profile design ensures efficient space utilization in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,788

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-

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Vyrian

USA . 2,480 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,480

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-

-

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Anansix

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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900

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,822 parts In-Stock

1+ parts

$24.425

100+ parts

-

1k+ parts

$21.983

10k+ parts

-

1,822

$24.425

-

$21.983

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MKK Technologies

India . 173 parts In-Stock

1+ parts

$45.930

100+ parts

-

1k+ parts

-

10k+ parts

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173

$45.930

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DigiPath Technology Company

USA . 173 parts In-Stock

1+ parts

$45.930

100+ parts

-

1k+ parts

-

10k+ parts

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173

$45.930

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-

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Corphita

USA . 2,523 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,523

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Parana Technologies

USA . 952 parts In-Stock

1+ parts

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100+ parts

$29.204

1k+ parts

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10k+ parts

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952

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$29.204

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Overview

Unlock endless possibilities with the ZPSD501B1V-20U from STMicroelectronics, a leader in quality and innovation. This versatile multi-functional peripheral is designed to enhance performance across diverse applications, from consumer electronics to industrial automation. With its low-profile design and robust compatibility, it ensures seamless integration and reliability, delivering exceptional value that empowers your projects while optimizing efficiency and functionality. Choose STMicroelectronics for unmatched quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Being a surface mount device allows for compact designs and easier integration into modern circuit boards, enhancing the overall efficiency of assembly.

Maximum Supply Voltage: 5.5 V

The ability to operate with a maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply systems, providing flexibility in design.

Address Bus Width: 16

With a 16-bit address bus width, the product can handle a larger memory space, which is ideal for applications requiring significant data processing capabilities.

Package Shape: SQUARE

A square package shape ensures uniform distribution of heat and efficient use of PCB space, making it suitable for dense electronic assemblies.

No. of Terminals: 80

Having 80 terminals allows for multiple connections, facilitating versatile interfacing options with various hardware components.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile design is excellent for applications where height is a constraint, making it an excellent choice for portable devices.

Minimum Supply Voltage: 2.7 V

With a minimum supply voltage of 2.7 V, the product can operate efficiently in low-power applications, contributing to energy conservation.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C indicates the product can function in various environments, expanding its usability.

Terminal Position: QUAD

Quad terminal position offers better signal integrity and noise immunity, contributing to stable performance in complex applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm facilitates compact device designs, ideal for space-constrained applications.

RAM Words: 512

The inclusion of 512 RAM words allows for ample data storage for processing tasks, enhancing the product's capability for heavy computational workloads.

Width: 14 mm

A width of 14 mm supports easy integration into tight spaces within PCB layouts while still providing robustness.

External Data Bus Width: 16

With a 16-bit external data bus width, this product can transfer more data simultaneously, improving performance for data-intensive tasks.

Maximum Clock Frequency: 33.33 MHz

A maximum clock frequency of 33.33 MHz enables fast processing speeds, making it efficient for applications requiring quick data handling.

Length: 14 mm

The length of 14 mm allows for a compact footprint, making it suitable for a variety of compact electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade signifies that the product is built for a range of moderate environments, appealing to general consumer use.

Technology: CMOS

Using CMOS technology results in low power consumption and high noise immunity, making this product effective for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and mounting, simplifying the assembly process on PCB designs.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is ideal for many modern applications, ensuring compatibility with low-voltage systems.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility with various architectures makes this product highly versatile, suitable for integration in multi-faceted systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density package designs, enabling space-saving circuit board layouts.

No. of I/O Lines: 40

With 40 I/O lines, this product supports a wide array of interfacing options, enhancing its capability to interact with multiple peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD501B1V-20U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

ZPSD501B1V-20U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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