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ZPSD512B0-15L

STMicroelectronics

ZPSD512B0-15L by STMicroelectronics

ZPSD512B0-15L by STMicroelectronics is a versatile CMOS device with a 16-bit address bus and operates at a max voltage of 5.5V. It features 40 I/O lines, supports various bus types, and functions effectively in commercial applications up to 70 °C. Ideal for multi-functional peripherals, it offers reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,501 parts In-Stock

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Vyrian

USA . 1,239 parts In-Stock

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Anansix

USA . 601 parts In-Stock

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601

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

1+ parts

$34.236

100+ parts

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$30.812

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2,102

$34.236

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$30.812

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Corohmni

South Africa . 703 parts In-Stock

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$50.759

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703

$50.759

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MKK Technologies

India . 597 parts In-Stock

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$64.378

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597

$64.378

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DigiPath Technology Company

USA . 597 parts In-Stock

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$64.378

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597

$64.378

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Corphita

USA . 2,767 parts In-Stock

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2,767

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Parana Technologies

USA . 1,111 parts In-Stock

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$40.934

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$40.934

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Overview

Unlock unparalleled performance with the ZPSD512B0-15L from STMicroelectronics, a leader in innovative multi-functional peripherals. Boasting reliable quality and robust design, this versatile chip excels across diverse applications, from automotive to industrial automation. Its compact ceramic and metal-sealed package ensures durability while maximizing efficiency. Experience enhanced productivity and superior integration that elevate your projects to new heights, all backed by STMicroelectronics' renowned expertise.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed co-fired package ensures durability and thermal stability, making it ideal for various operating conditions.

Surface Mount: YES

Surface mount technology allows for more compact designs and efficient space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5 V, providing flexibility for power management in different circuits.

Address Bus Width: 16

A 16-bit address bus allows for greater addressable memory, making it suitable for more complex applications.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution, enhancing performance and reliability.

Number of Terminals: 68

With 68 terminals, this product can accommodate a variety of connectivity options, making it versatile for different applications.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier style with a window allows for easier integration in products requiring visibility into the chip for testing or diagnostics.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with a broad range of power supply tools, enhancing usability.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this device can function in relatively high thermal environments, ensuring operational reliability.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C ensures the device can be used in a wide range of environments, making it suitable for diverse applications.

Terminal Position: QUAD

Quad terminal positioning facilitates more efficient layout designs, helping in the compact design of circuits.

Maximum Seated Height: 4.57 mm

The low seated height allows for compact design aesthetics and improved space efficiency on the PCB.

Width: 24.105 mm

The compact width is ideal for space-sensitive applications without compromising functionality.

External Data Bus Width: 8

An 8-bit external data bus width provides standard data handling capabilities, ensuring compatibility with many existing systems.

Maximum Clock Frequency: 22 MHz

The high clock frequency of 22 MHz ensures fast processing speeds, making it suitable for high-performance applications.

Length: 24.105 mm

The standardized length simplifies design integration while providing adequate space for circuitry.

Temperature Grade: COMMERCIAL

Commercial temperature grade means this product is suitable for general commercial use, ensuring reliability in everyday applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher noise immunity, enhancing overall performance and efficiency.

Terminal Form: J BEND

J bend terminals provide secured connections in PCB assembly, ensuring reliable performance over time.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many applications, ensuring broad compatibility across various devices.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Wide bus compatibility makes this product versatile and easy to integrate into different systems and architectures.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard and suitable for most manufacturing processes, simplifying PCB layout and assembly.

Number of I/O Lines: 40

With 40 I/O lines, this device can handle multiple inputs and outputs, making it ideal for complex control applications.

Technical Specifications

Multi-functional Peripherals ZPSD512B0-15L attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

22 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

ZPSD512B0-15L Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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