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ZPSD501B1-70J

STMicroelectronics

ZPSD501B1-70J by STMicroelectronics

ZPSD501B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications requiring efficient data processing. Its compact chip carrier design ensures easy integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,593 parts In-Stock

1+ parts

-

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4,593

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Anansix

USA . 2,093 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,093

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Vyrian

USA . 1,521 parts In-Stock

1+ parts

-

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1,521

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 3,120 parts In-Stock

1+ parts

$32.764

100+ parts

-

1k+ parts

-

10k+ parts

-

3,120

$32.764

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-

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IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$33.954

100+ parts

-

1k+ parts

$30.559

10k+ parts

-

619

$33.954

-

$30.559

-

MKK Technologies

India . 36 parts In-Stock

1+ parts

$63.849

100+ parts

-

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36

$63.849

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DigiPath Technology Company

USA . 36 parts In-Stock

1+ parts

$63.849

100+ parts

-

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10k+ parts

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36

$63.849

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-

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Parana Technologies

USA . 2,333 parts In-Stock

1+ parts

-

100+ parts

$40.598

1k+ parts

-

10k+ parts

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2,333

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$40.598

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Corphita

USA . 1,989 parts In-Stock

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1,989

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Overview

Unlock your project’s potential with the ZPSD501B1-70J from STMicroelectronics, a trusted leader in innovative technology. This multi-functional peripheral seamlessly integrates performance and reliability, making it ideal for diverse applications in consumer electronics, automotive systems, and industrial controls. Experience exceptional efficiency and flexibility, empowering you to elevate designs while minimizing costs—your pathway to success starts here!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material protects the internal components, ensuring reliability and longevity in operation.

Surface Mount: YES

The surface mount design allows for a compact PCB layout, saving space and enabling more advanced multi-functional setups.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of devices while maintaining safety margins.

Address Bus Width: 16

A 16-bit address bus width allows for a large addressing capability, supporting more extensive memory and device integration.

Package Shape: SQUARE

The square package shape optimizes space on the circuit board, aiding in easier assembly and better thermal management.

Power Supplies (V): 5

Operating at a standard 5 V supply voltage enhances compatibility with numerous electronic systems and devices.

No. of Terminals: 68

With 68 terminals, this product supports extensive connectivity options for peripherals and devices.

Package Style (Meter): CHIP CARRIER

The chip carrier style ensures effective thermal dissipation, contributing to optimal operational performance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows for flexible integration in battery-powered applications.

Maximum Operating Temperature: 70 °C

Operating efficiently up to 70 °C makes this product suitable for industrial applications with higher thermal demands.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable performance in a variety of environments.

Terminal Finish: TIN LEAD

The tin-lead terminal finish improves solderability and reliability of connections in assembling electronic circuits.

Ultraviolet Erasable: N

Not being ultraviolet erasable can enhance data security for applications where information retention is critical.

Terminal Position: QUAD

Quadrant terminal positioning enhances accessibility and ease of soldering, simplifying the assembly process.

Maximum Seated Height: 4.57 mm

A low seated height profile allows for space-efficient stacking and compact designs in multi-functional applications.

RAM Words: 512

With 512 RAM words, this device provides consistent performance for tasks requiring temporary data storage.

Width: 24.18 mm

The consistent width aids in compatibility and simplifies layout design within multi-functional devices.

External Data Bus Width: 16

A 16-bit data bus allows for efficient data handling, supporting high-speed data transfer for demanding applications.

Maximum Clock Frequency: 50 MHz

With a maximum clock frequency of 50 MHz, it ensures rapid processing and responsiveness for multi-functional operations.

Length: 24.18 mm

The balanced length keeps it compact and easy to integrate into various electronic systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade guarantees stable performance in typical operating environments.

ROM Bits Size: 256 Bits

With 256 bits of ROM, it provides sufficient memory for essential firmware or fixed functionality.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operations, making it suitable for energy-efficient designs.

Terminal Form: J BEND

The J-bend terminal form facilitates ease of connection in automated assembly processes.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns perfectly with standards in consumer electronics.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Extensive bus compatibility allows for versatility in integration with many existing systems and technologies.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with many standard PCB designs, easing integration into various projects.

Maximum Standby Current: 0.00002 Amp

A low maximum standby current enhances energy efficiency, making it suitable for battery-operated devices.

Maximum Access Time: 0.00000007 ns

Minimal access time enables ultra-fast data retrieval, significantly improving overall device performance.

No. of I/O Lines: 40

Having 40 I/O lines offers flexibility and expanded interface capabilities for connecting various peripherals.

Technical Specifications

Multi-functional Peripherals ZPSD501B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

ZPSD501B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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