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TS68HC901CFN4

STMicroelectronics

TS68HC901CFN4 by STMicroelectronics

TS68HC901CFN4 by STMicroelectronics is a versatile multi-functional peripheral with a 5V nominal supply and operates at up to 70 °C. It features an 8-bit external data bus, 52 terminals, and supports a max clock frequency of 4 MHz. Ideal for applications requiring reliable data processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,993 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,993

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-

-

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Anansix

USA . 2,780 parts In-Stock

1+ parts

-

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1k+ parts

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2,780

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Vyrian

USA . 1,784 parts In-Stock

1+ parts

-

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1,784

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Tectiva GmbH

Germany . 3 parts In-Stock

1+ parts

-

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-

1k+ parts

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,823 parts In-Stock

1+ parts

$34.425

100+ parts

-

1k+ parts

$30.982

10k+ parts

-

1,823

$34.425

-

$30.982

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Corohmni

South Africa . 156 parts In-Stock

1+ parts

$35.292

100+ parts

-

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156

$35.292

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MKK Technologies

India . 368 parts In-Stock

1+ parts

$64.733

100+ parts

-

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368

$64.733

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DigiPath Technology Company

USA . 368 parts In-Stock

1+ parts

$64.733

100+ parts

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10k+ parts

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368

$64.733

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Corphita

USA . 4,900 parts In-Stock

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4,900

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Parana Technologies

USA . 948 parts In-Stock

1+ parts

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100+ parts

$41.160

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948

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$41.160

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Overview

Elevate your electronic designs with the TS68HC901CFN4 from STMicroelectronics, a leader in innovative technology. This multi-functional peripheral delivers reliability and versatility, ensuring seamless integration into various applications, from industrial controls to consumer electronics. With its robust performance and compact design, you’ll enjoy enhanced efficiency and reduced system complexity. Trust STMicroelectronics for quality that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures longevity and reliability for extended usage in various environments.

Surface Mount: YES

Surface mounting enables compact designs and easier integration into modern electronic devices.

Maximum Supply Voltage: 5.25 V

Compatibility with a wide power range allows flexibility in various applications without risk of over-voltage.

Address Bus Width: 5

A 5-bit address bus width supports a sufficient amount of addressable memory space for many applications.

Package Shape: SQUARE

The square shape is beneficial for space-efficient layouts in circuit design.

Power Supplies (V): 5

Standard 5V operation is widely supported, simplifying power supply design.

No. of Terminals: 52

A high number of terminals allows for extensive connectivity options, essential for multi-functional peripherals.

Package Style (Meter): CHIP CARRIER

Chip carriers are designed for enhancing thermal performance and are ideal for mounting in compact spaces.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage ensures stable operation across a variety of operating conditions.

Maximum Operating Temperature: 70 °C

A high maximum temperature rating indicates robust performance in hotter environments.

Minimum Operating Temperature: 0 °C

Operational from zero°C ensures usability in standard room temperatures.

Terminal Finish: TIN LEAD

Tin-lead finish enhances solderability and provides reliable connections.

Terminal Position: QUAD

Quad terminal positioning optimizes space and enables efficient routing in PCB design.

Maximum Seated Height: 5.08 mm

Low seated height promotes better fit within compact devices, crucial for modern electronics.

Width: 19.1262 mm

Standard width fits well with common PCB dimensions, aiding in seamless integration.

External Data Bus Width: 8

An 8-bit data bus width allows for standard data handling, making it versatile for different applications.

Maximum Clock Frequency: 4 MHz

4 MHz clock frequency provides a good balance of performance for many multi-functional tasks.

Length: 19.1262 mm

Standard length facilitates easy placement on PCBs designed for similar-sized components.

Temperature Grade: COMMERCIAL

Rated for commercial temperatures, ensuring suitability for a wide range of consumer applications.

Technology: HCMOS

High-speed CMOS technology ensures efficient operation and low power consumption.

Terminal Form: J BEND

J-bend terminals provide better mechanical stability and enhanced performance in soldering.

Maximum Supply Current: 6 mA

Low maximum supply current contributes to energy efficiency, a key feature in modern devices.

Nominal Supply Voltage: 5 V

Nominal operation at 5V allows compatibility with a wide range of systems and power sources.

Bus Compatibility: 68000

Compatibility with the 68000 bus standard ensures integration with a variety of legacy systems.

Terminal Pitch: 1.27 mm

The standard terminal pitch allows for easy soldering and compatibility with common PCB layouts.

No. of I/O Lines: 8

Eight I/O lines provide sufficient connectivity for various I/O operations, enhancing multi-functionality.

Technical Specifications

Multi-functional Peripherals TS68HC901CFN4 attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

5

Boundary Scan:

NO

Bus Compatibility:

68000

Maximum Clock Frequency:

4 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e0

Length:

19.1262 mm

No. of I/O Lines:

8

No. of Serial I/Os:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1262 mm

Trade Compliance

TS68HC901CFN4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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