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ZPSD512B1-90LI

STMicroelectronics

ZPSD512B1-90LI by STMicroelectronics

ZPSD512B1-90LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 1024 RAM words, supports various bus types, and functions in industrial applications from -40 °C to 85 °C. Ideal for embedded systems, it offers reliable performance with low standby current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,389 parts In-Stock

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4,389

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Anansix

USA . 1,218 parts In-Stock

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1,218

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Digiode

USA . 844 parts In-Stock

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844

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$60.859

100+ parts

-

1k+ parts

$54.773

10k+ parts

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910

$60.859

-

$54.773

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Corohmni

South Africa . 247 parts In-Stock

1+ parts

$71.468

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247

$71.468

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MKK Technologies

India . 748 parts In-Stock

1+ parts

$114.441

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748

$114.441

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DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$114.441

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748

$114.441

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Parana Technologies

USA . 1,308 parts In-Stock

1+ parts

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100+ parts

$72.766

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1,308

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$72.766

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Corphita

USA . 864 parts In-Stock

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864

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Overview

Elevate your designs with the ZPSD512B1-90LI from STMicroelectronics, a leader in innovative semiconductor solutions. This multi-functional peripheral combines exceptional reliability and versatility, making it perfect for industrial applications. With its robust ceramic and metal-sealed package, it ensures durability even in extreme conditions. Experience faster processing and lower power consumption, delivering unbeatable value and performance for your projects. Upgrade to excellence today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package ensures durability and resistance to environmental factors, making it suitable for robust applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, which is ideal for modern electronic devices.

Maximum Supply Voltage: 5.5 V

Operating at a maximum supply voltage of 5.5 V provides flexibility for integration into various systems without exceeding voltage ratings.

Address Bus Width: 16

A 16-bit address bus width enables efficient data access and larger memory addressing capabilities, enhancing performance in data-intensive applications.

Package Shape: SQUARE

The square package shape offers more efficient space utilization on PCBs, improving layout and design possibilities.

Power Supplies (V): 5

Designed to operate with a 5 V power supply, this product aligns well with standard voltage levels in many electronic systems.

No. of Terminals: 68

Having 68 terminals allows for versatile connectivity options, supporting a wide range of peripheral devices.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier package style with a window facilitates easy access for testing and debugging, enhancing reliability during development.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with lower power systems, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this device suitable for harsh and extreme conditions.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability, ensuring strong connections during assembly.

Ultraviolet Erasable: Y

Being ultraviolet erasable allows for reprogramming and updates, adding flexibility for changes in application design.

Terminal Position: QUAD

The quad terminal position design provides efficient routing and placement on PCBs, leading to optimal performance.

Maximum Seated Height: 4.57 mm

A maximum seated height of 4.57 mm ensures compatibility with low-profile designs, making it ideal for space-constrained applications.

RAM Words: 1024

With 1024 RAM words, this product can handle substantial data storage needs, supporting more complex applications.

Width: 24.105 mm

A compact width of 24.105 mm allows for efficient use of PCB space, facilitating sleeker product designs.

External Data Bus Width: 8

An 8-bit external data bus width allows for standard data interactions, enhancing compatibility with a variety of systems.

Maximum Clock Frequency: 30 MHz

The ability to operate at a maximum clock frequency of 30 MHz allows for faster processing speeds and improved overall performance.

Length: 24.105 mm

The length of 24.105 mm complements its width, adhering to compact design requirements for modern electronics.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades indicates reliability and robustness for use in demanding industrial applications.

ROM Bits Size: 512 Bits

A ROM bit size of 512 bits provides essential non-volatile storage for firmware and critical system data.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, suitable for battery-powered and high-performance devices.

Terminal Form: J BEND

The J bend terminal form offers enhanced mechanical stability during soldering, contributing to the product's reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in many applications, facilitating easy integration into existing systems.

Bus Compatibility: 8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Widespread bus compatibility makes this product versatile and adaptable to various architectures and systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm enables efficient and spaced connections, making it compatible with a variety of manufacturing processes.

Maximum Standby Current: 0.00002 Amp

With a maximum standby current of just 0.00002 A, this product is energy-efficient, contributing to overall low power usage in designs.

Maximum Access Time: 0.00000009 ns

A minimal maximum access time of 0.09 ns ensures rapid data retrieval, enhancing performance in high-speed applications.

No. of I/O Lines: 40

Having 40 I/O lines allows for extensive interfacing options with other components, ensuring flexibility in design and functionality.

Technical Specifications

Multi-functional Peripherals ZPSD512B1-90LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80186; 80196SP; 80196; 68HC11; 68302; 68330; 68340

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

ZPSD512B1-90LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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