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TDA2SABRQABCRQ1

Texas Instruments

TDA2SABRQABCRQ1 by Texas Instruments

TDA2SABRQABCRQ1 by Texas Instruments is a multi-functional peripheral IC with 760 terminals, operating temperature range of -40 to 125 °C, and max clock frequency of 38.4 MHz. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,708

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-

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Vyrian

USA . 3,813 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,813

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 256 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

-

10k+ parts

-

256

$6.420

-

-

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One Stop Electronics

USA . 1,044 parts In-Stock

1+ parts

$23.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,044

$23.000

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Parana Technologies

USA . 845 parts In-Stock

1+ parts

$31.307

100+ parts

$2,907.296

1k+ parts

$28.176

10k+ parts

-

845

$31.307

$2,907.296

$28.176

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DigiPath Technology Company

USA . 2,044 parts In-Stock

1+ parts

$34.472

100+ parts

$31.715

1k+ parts

-

10k+ parts

-

2,044

$34.472

$31.715

-

-

ChromeModa Solutions

Germany . 4,371 parts In-Stock

1+ parts

$35.176

100+ parts

$28.844

1k+ parts

-

10k+ parts

-

4,371

$35.176

$28.844

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IDEA Electronic Components Group

UK . 224 parts In-Stock

1+ parts

$35.176

100+ parts

$33.417

1k+ parts

$31.658

10k+ parts

-

224

$35.176

$33.417

$31.658

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Corohmni

South Africa . 149 parts In-Stock

1+ parts

$55.629

100+ parts

-

1k+ parts

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10k+ parts

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149

$55.629

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Corphita

USA . 2,413 parts In-Stock

1+ parts

-

100+ parts

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2,413

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Overview

Elevate your automotive designs with the TDA2SABRQABCRQ1 by Texas Instruments. This multi-functional peripheral offers unparalleled performance, reliability, and versatility. With a wide range of applications and cutting-edge technology, this product is a game-changer in the industry. Experience the benefits of seamless integration, high-speed processing, and advanced features, all while enjoying the quality and expertise of Texas Instruments. Upgrade your projects today with the TDA2SABRQABCRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the product lightweight and durable, ideal for portable and long-lasting use.

Maximum Supply Voltage: 1.2 V

Operates at a low maximum supply voltage, which can help in reducing power consumption and improving energy efficiency.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures, making it suitable for use in a variety of environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product efficient and fast in processing tasks.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Supports multiple bus interfaces, allowing for versatile connectivity options and easy integration with various devices.

Technical Specifications

Multi-functional Peripherals TDA2SABRQABCRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

750 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TDA2SABRQABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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