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TDA2SABRQABCQ1

Texas Instruments

TDA2SABRQABCQ1 by Texas Instruments

TDA2SABRQABCQ1 by Texas Instruments is a multi-functional peripheral IC with 760 terminals, operating at -40 to 125 °C. It features a max clock frequency of 38.4 MHz and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, USB. Ideal for automotive applications due to AEC-Q100 screening level and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,787 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,787

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Digiode

USA . 2,844 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,844

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$7.052

100+ parts

-

1k+ parts

-

10k+ parts

-

570

$7.052

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One Stop Electronics

USA . 725 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

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10k+ parts

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725

$9.000

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Corohmni

South Africa . 2,365 parts In-Stock

1+ parts

$21.664

100+ parts

-

1k+ parts

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10k+ parts

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2,365

$21.664

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Parana Technologies

USA . 1,851 parts In-Stock

1+ parts

$43.289

100+ parts

-

1k+ parts

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10k+ parts

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1,851

$43.289

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-

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DigiPath Technology Company

USA . 590 parts In-Stock

1+ parts

$47.666

100+ parts

$43.853

1k+ parts

-

10k+ parts

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590

$47.666

$43.853

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ChromeModa Solutions

Germany . 3,557 parts In-Stock

1+ parts

$48.639

100+ parts

$39.884

1k+ parts

-

10k+ parts

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3,557

$48.639

$39.884

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IDEA Electronic Components Group

UK . 240 parts In-Stock

1+ parts

$48.639

100+ parts

$46.207

1k+ parts

$43.775

10k+ parts

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240

$48.639

$46.207

$43.775

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Corphita

USA . 3,277 parts In-Stock

1+ parts

-

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3,277

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Overview

Enhance your automotive electronics with the TDA2SABRQABCQ1 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. This multi-functional peripheral offers unparalleled performance and versatility, making it the ideal choice for a wide range of applications. From CAN to USB compatibility, this product delivers seamless connectivity and functionality. Experience the value and benefits of this high-quality device, designed to elevate your projects to the next level. Upgrade to the TDA2SABRQABCQ1 and unlock limitless possibilities in automotive electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2V ensures safe operation and protection of the device.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand tough environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

The use of a RISC microprocessor in the product ensures efficient processing and performance.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

The product is compatible with a wide range of communication protocols, making it versatile and suitable for various applications.

Technical Specifications

Multi-functional Peripherals TDA2SABRQABCQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

247

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

2.5M

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

750 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TDA2SABRQABCQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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