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TDA2EGAHQABCRQ1

Texas Instruments

TDA2EGAHQABCRQ1 by Texas Instruments

TDA2EGAHQABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and 38.4 MHz max clock frequency. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,026 parts In-Stock

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5,026

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Digiode

USA . 1,313 parts In-Stock

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1,313

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Chip Stock

USA . 214 parts In-Stock

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214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$12.108

100+ parts

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561

$12.108

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One Stop Electronics

USA . 958 parts In-Stock

1+ parts

$16.000

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958

$16.000

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Corohmni

South Africa . 706 parts In-Stock

1+ parts

$23.903

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706

$23.903

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Parana Technologies

USA . 2,085 parts In-Stock

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$71.934

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2,085

$71.934

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ChromeModa Solutions

Germany . 6,447 parts In-Stock

1+ parts

$80.825

100+ parts

$66.276

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6,447

$80.825

$66.276

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IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$80.825

100+ parts

$76.784

1k+ parts

$72.742

10k+ parts

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1,352

$80.825

$76.784

$72.742

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Lixinc

USA . 11,312 parts In-Stock

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11,312

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DigiPath Technology Company

USA . 2,113 parts In-Stock

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$72.872

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2,113

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$72.872

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Corphita

USA . 980 parts In-Stock

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980

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Overview

Unlock a world of possibilities with the TDA2EGAHQABCRQ1 by Texas Instruments, a cutting-edge multi-functional peripheral that exceeds expectations in quality and performance. Designed with precision by a trusted manufacturer, this versatile device is a game-changer in automotive technology, offering seamless integration with various bus compatibilities like CAN, Ethernet, and USB. Experience unparalleled efficiency and reliability with its advanced features, making it the ultimate choice for your next project. Elevate your work to new heights with the TDA2EGAHQABCRQ1 and witness the difference it can make in your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product easy to handle and long-lasting.

Maximum Supply Voltage: 1.2 V

The product operates at a low maximum supply voltage, which helps in conserving energy and reducing power consumption.

Address Bus Width: 16

Having a wider address bus width helps in efficiently transferring data and instructions within the device.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh conditions and operate reliably in various environments.

RAM Words: 512K

The product has a large RAM capacity, allowing it to handle multiple tasks simultaneously without slowing down.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and fast.

Bus Compatibility: CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

The product is compatible with various bus protocols, enabling seamless connectivity with other devices and systems.

Technical Specifications

Multi-functional Peripherals TDA2EGAHQABCRQ1 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

215

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

512K

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

TDA2EGAHQABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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