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PSD502B1-70J

STMicroelectronics

PSD502B1-70J by STMicroelectronics

PSD502B1-70J by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max supply voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its compact chip carrier design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,476 parts In-Stock

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2,476

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Vyrian

USA . 1,620 parts In-Stock

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1,620

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Anansix

USA . 1,419 parts In-Stock

1+ parts

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1,419

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,970 parts In-Stock

1+ parts

$19.483

100+ parts

-

1k+ parts

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1,970

$19.483

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IDEA Electronic Components Group

UK . 848 parts In-Stock

1+ parts

$74.261

100+ parts

-

1k+ parts

$66.835

10k+ parts

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848

$74.261

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$66.835

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MKK Technologies

India . 1,292 parts In-Stock

1+ parts

$139.642

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1,292

$139.642

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DigiPath Technology Company

USA . 1,292 parts In-Stock

1+ parts

$139.642

100+ parts

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1,292

$139.642

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Corphita

USA . 2,927 parts In-Stock

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2,927

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Parana Technologies

USA . 2,204 parts In-Stock

1+ parts

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$88.790

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2,204

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$88.790

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Overview

Elevate your designs with the PSD502B1-70J from STMicroelectronics, a trusted leader in cutting-edge technology. This versatile multi-functional peripheral is crafted for reliability and performance, ensuring seamless integration into a range of applications—from automotive to industrial controls. With its compact surface mount design, it maximizes space while delivering exceptional functionality, empowering you to innovate without compromise. Experience unparalleled quality and efficiency that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resilience against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact design and easier automation in assembly processes, which promotes higher efficiency.

Maximum Supply Voltage: 5.5 V

Operating under a maximum supply voltage of 5.5 V enhances the safety and compatibility with low-power devices.

Address Bus Width: 16

The 16-bit address bus width enables access to a larger memory range, making it versatile for complex applications.

Package Shape: SQUARE

The square package shape facilitates optimized PCB layouts, allowing for efficient use of board space.

Power Supplies (V): 5

Powered by a standard 5V supply, ensuring compatibility with most existing electronics and easy integration.

No. of Terminals: 68

With 68 terminals, the device provides ample interfacing options for various components and peripherals.

Package Style (Meter): CHIP CARRIER

Offering a chip carrier style enhances thermal performance and reliability, suited for device operation in challenging environments.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures stable operation in diverse conditions, accommodating fluctuations in power supply.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C allows for deployment in high-temperature environments, broadening application scenarios.

Minimum Operating Temperature: 0 °C

This operational temperature ensures functionality in cooler climates, making it suitable for a wider range of settings.

Terminal Finish: TIN LEAD

Tin-lead terminal finish enhances solderability and durability, ensuring reliable long-term connections.

Terminal Position: QUAD

Quad terminal positioning optimizes space utilization on PCBs, aiding in compact system designs.

Maximum Seated Height: 4.57 mm

The compact seated height allows for space-efficient configurations, crucial in modern electronics design.

RAM Words: 512

Having 512 RAM words significantly boosts data handling capabilities, benefitting applications requiring fast data access.

Width: 24.18 mm

The compact width helps in fitting the device in tight spaces without compromising performance.

External Data Bus Width: 16

A 16-bit external data bus width permits high-speed data transfers, enhancing overall processing performance.

Maximum Clock Frequency: 50 MHz

The 50 MHz clock frequency ensures swift data processing and operational efficiency, making it suitable for demanding applications.

Length: 24.18 mm

The length complements the width, maintaining a compact form factor ideal for modern electronic devices.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates reliable performance under standard operating conditions.

ROM Bits Size: 512 Bits

512 bits of ROM facilitates basic data storage for programs, essential for effective functionality in embedded systems.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making the device suitable for power-sensitive applications.

Terminal Form: J BEND

J bend terminals provide improved mechanical stability during assembly and integration onto PCBs.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V offers reliability and consistency in performance across various applications.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide compatibility with multiple bus architectures ensures interoperability and flexibility in diverse system designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for closely packed terminals, optimizing PCB area usage while maintaining accessibility.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current minimizes power consumption when idle, enhancing overall energy efficiency.

Maximum Access Time: 0.07 ns

A maximum access time of 0.07 ns indicates rapid data retrieval, essential for high-performance applications.

No. of I/O Lines: 40

With 40 I/O lines, the device provides extensive interfacing capabilities for a wide range of peripherals.

Technical Specifications

Multi-functional Peripherals PSD502B1-70J attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

Length:

24.18 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

24.18 mm

Trade Compliance

PSD502B1-70J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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