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PSD501B1-15LI

STMicroelectronics

PSD501B1-15LI by STMicroelectronics

PSD501B1-15LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features UV erasable memory, ideal for industrial applications requiring reliability in extreme temps (-40 °C to 85°C). With a max clock frequency of 34.48 MHz, it supports various bus architectures.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,994 parts In-Stock

1+ parts

-

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1,994

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Anansix

USA . 1,577 parts In-Stock

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1,577

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Vyrian

USA . 222 parts In-Stock

1+ parts

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222

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,224 parts In-Stock

1+ parts

$44.908

100+ parts

-

1k+ parts

-

10k+ parts

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5,224

$44.908

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IDEA Electronic Components Group

UK . 1,765 parts In-Stock

1+ parts

$56.425

100+ parts

-

1k+ parts

$50.783

10k+ parts

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1,765

$56.425

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$50.783

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MKK Technologies

India . 1,541 parts In-Stock

1+ parts

$106.104

100+ parts

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1,541

$106.104

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DigiPath Technology Company

USA . 1,541 parts In-Stock

1+ parts

$106.104

100+ parts

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1,541

$106.104

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Corphita

USA . 2,587 parts In-Stock

1+ parts

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2,587

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Parana Technologies

USA . 277 parts In-Stock

1+ parts

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$67.465

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277

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$67.465

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Overview

Unlock the potential of your projects with the PSD501B1-15LI from STMicroelectronics, a leader in innovative solutions. This versatile multi-functional peripheral combines robust performance with reliability, making it perfect for industrial applications. With its compact design and wide operating temperature range, it ensures exceptional efficiency in demanding environments, delivering unparalleled value that drives success in your designs. Experience superior quality and innovation you can trust!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired package provides excellent thermal conductivity and reliability, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on PCBs and improving overall product efficiency.

Maximum Supply Voltage: 5.5 V

The operating range with a maximum supply voltage of 5.5 V ensures compatibility with a wide variety of circuits without risk of damage.

Address Bus Width: 16

A 16-bit address bus width enables access to a larger memory space, improving performance for data-intensive tasks.

Package Shape: SQUARE

The square package shape facilitates efficient space usage on PCBs, enhancing design flexibility.

Power Supplies (V): 5

A standardized 5V power supply allows for easy integration with common electronic systems.

No. of Terminals: 68

Having 68 terminals increases connectivity options, supporting extensive interfacing with various peripheral devices.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design with a window provides effective cooling and enhances visibility for inspection.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V increases device tolerance for varying power conditions.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C makes it suitable for harsh environments.

Minimum Operating Temperature: -40 °C

Its functionality in extreme low temperatures (-40 °C) ensures reliability in outdoor or unregulated environments.

Terminal Finish: TIN LEAD

Tin lead terminals provide excellent solderability and long-lasting connections, reducing the risk of failure.

Ultraviolet Erasable: Y

Being ultraviolet erasable allows for reprogramming, adding flexibility and reducing waste in long-term applications.

Terminal Position: QUAD

Quad terminal positioning facilitates better routing on PCBs, optimizing design for performance.

Maximum Seated Height: 4.57 mm

A low seated height allows for tighter packaging density in multi-functional designs.

RAM Words: 512

512 RAM words enable substantial data handling capability, ideal for complex computing tasks.

Width: 24.105 mm

The specific width ensures compatibility with existing designs and layouts of multi-functional peripherals.

External Data Bus Width: 16

A 16-bit external data bus supports faster data transfer rates, enhancing performance in data processing.

Maximum Clock Frequency: 34.48 MHz

With a maximum clock frequency of 34.48 MHz, this device can execute operations quickly, improving responsiveness.

Length: 24.105 mm

Maintaining a specific length aids in creating compact devices while remaining within standard dimensions.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees robust performance in demanding conditions, suitable for factory settings.

ROM Bits Size: 256 Bits

A ROM size of 256 bits allows for basic firmware storage, essential for device initialization and configuration.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption while maintaining high-speed operation and reliability.

Terminal Form: J BEND

J bend terminals simplify the assembly process and improve mechanical stability when mounted on PCBs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V facilitates straightforward power management in diverse electronic applications.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures seamless integration with various microcontrollers, enhancing versatility in system designs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for precise spacing, optimizing the layout for high-density applications.

Maximum Standby Current: 0.00002 Amp

Low standby current minimizes power consumption, making this device highly energy-efficient during idle periods.

Maximum Access Time: 0.15 ns

A maximum access time of 0.15 ns allows for rapid data retrieval, enhancing overall system speed.

No. of I/O Lines: 40

With 40 I/O lines, this product provides ample interfacing options for a variety of peripherals and sensors.

Technical Specifications

Multi-functional Peripherals PSD501B1-15LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

JESD-609 Code:

e0

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

24.105 mm

Trade Compliance

PSD501B1-15LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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