Loading...

PSD502B1-70LI

STMicroelectronics

PSD502B1-70LI by STMicroelectronics

PSD502B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a max supply voltage of 5.5V, operating temp range from -40 °C to 85°C, and 512 RAM words. Ideal for industrial applications, it supports various bus types and features a compact ceramic package. Its surface mount design ensures efficient integration in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,866 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,866

-

-

-

-

Anansix

USA . 2,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,153

-

-

-

-

Vyrian

USA . 564 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

564

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,351 parts In-Stock

1+ parts

$61.801

100+ parts

-

1k+ parts

$55.621

10k+ parts

-

1,351

$61.801

-

$55.621

-

MKK Technologies

India . 2,253 parts In-Stock

1+ parts

$116.213

100+ parts

-

1k+ parts

-

10k+ parts

-

2,253

$116.213

-

-

-

DigiPath Technology Company

USA . 2,253 parts In-Stock

1+ parts

$116.213

100+ parts

-

1k+ parts

-

10k+ parts

-

2,253

$116.213

-

-

-

Parana Technologies

USA . 1,546 parts In-Stock

1+ parts

-

100+ parts

$73.892

1k+ parts

-

10k+ parts

-

1,546

-

$73.892

-

-

Corphita

USA . 1,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,155

-

-

-

-

Overview

Unlock innovation with the PSD502B1-70LI from STMicroelectronics, a leader in high-quality multi-functional peripherals. Designed for reliability across diverse applications—from industrial automation to consumer electronics—this robust component offers exceptional performance in extreme conditions, ensuring your projects thrive under pressure. Experience unmatched durability, ease of integration, and the peace of mind that comes with STMicroelectronics' commitment to excellence. Embrace the future today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable and high-quality ceramic and metal-sealed co-fired package ensures longevity and reliable performance under various operating conditions.

Surface Mount: YES

Surface mount technology allows for compact design and efficiency in manufacturing, making this product suitable for modern, space-constrained applications.

Maximum Supply Voltage: 5.5 V

The flexibility of a maximum supply voltage of 5.5 V accommodates a wide range of power sources while protecting the device from over-voltage scenarios.

Address Bus Width: 16

The 16-bit address bus width allows for efficient memory addressing, enhancing data processing capabilities for complex applications.

Package Shape: SQUARE

The square shape of the package allows for easier integration into high-density circuit layouts, maximizing space and improving installation efficiency.

No. of Terminals: 68

A total of 68 terminals allows for extensive connectivity options, making this product versatile for various applications requiring numerous input/output channels.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier package style combines easy handling with effective thermal management, crucial for ensuring optimal device performance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with standard power supply levels, enhancing ease of use in diverse applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is designed to perform reliably even in challenging thermal environments, ensuring durability.

Minimum Operating Temperature: -40 °C

Operating effectively at temperatures as low as -40 °C makes this product suitable for use in extreme conditions and harsh environments.

Terminal Position: QUAD

The quad terminal position simplifies the PCB layout, promoting more efficient use of space and easier routing of connections.

Maximum Seated Height: 4.57 mm

A low maximum seated height of 4.57 mm enables compact designs, perfect for applications where space is a critical factor.

RAM Words: 512

512 RAM words provide sufficient memory for storing temporary data, enhancing processing capabilities in data-intensive applications.

Width: 24.105 mm

A standard width of 24.105 mm allows for straightforward integration into existing designs while maintaining excellent performance.

External Data Bus Width: 16

An external data bus width of 16 bits enables high-speed data transfer, increasing overall system efficiency and responsiveness.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz ensures that the device operates at fast processing speeds, making it suitable for real-time applications.

Length: 24.105 mm

Along with the width, the consistent length of 24.105 mm allows for easy alignment in PCB layouts, simplifying design and assembly.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, this product is robust against a wide range of environmental conditions, enhancing reliability in critical applications.

Technology: CMOS

Utilizing CMOS technology ensures lower power consumption and higher efficiency, making this device ideal for battery-operated and energy-sensitive applications.

Terminal Form: J BEND

The J bend terminal form provides improved mechanical stability during soldering, reinforcing connection integrity.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with common electronic components, simplifying power supply design and fostering interoperability.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Broad bus compatibility makes this product versatile, allowing it to be integrated with a wide range of electronic systems and platforms.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a balance between density and ease of soldering, making it user-friendly for assembly processes.

No. of I/O Lines: 40

Having 40 I/O lines enhances the product's connectivity capabilities, allowing for extensive interfacing with other devices and components.

Technical Specifications

Multi-functional Peripherals PSD502B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD502B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20