Loading...

PSD502B1-15U

STMicroelectronics

PSD502B1-15U by STMicroelectronics

PSD502B1-15U by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded applications. Its low-profile design ensures efficient space utilization in compact devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,567

-

-

-

-

Anansix

USA . 1,657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

-

-

-

-

Digiode

USA . 1,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,344

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,613 parts In-Stock

1+ parts

$58.191

100+ parts

-

1k+ parts

-

10k+ parts

-

2,613

$58.191

-

-

-

IDEA Electronic Components Group

UK . 1,188 parts In-Stock

1+ parts

$59.804

100+ parts

-

1k+ parts

$53.823

10k+ parts

-

1,188

$59.804

-

$53.823

-

MKK Technologies

India . 1,657 parts In-Stock

1+ parts

$112.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$112.457

-

-

-

DigiPath Technology Company

USA . 1,657 parts In-Stock

1+ parts

$112.457

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$112.457

-

-

-

Corphita

USA . 4,574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,574

-

-

-

-

Parana Technologies

USA . 1,008 parts In-Stock

1+ parts

-

100+ parts

$71.504

1k+ parts

-

10k+ parts

-

1,008

-

$71.504

-

-

Overview

Elevate your projects with the PSD502B1-15U from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral is designed for exceptional reliability and efficiency, catering to various applications from consumer electronics to industrial automation. With its compact design and low power consumption, it offers unparalleled performance without compromising quality. Trust STMicroelectronics to deliver the cutting-edge technology that empowers your designs to achieve more!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology enables compact designs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a wide range of typical electronic components.

Address Bus Width: 16

A 16-bit address bus width facilitates access to larger memory spaces, enhancing performance in data-intensive applications.

Package Shape: SQUARE

The square shape aids in efficient circuit board layout and placement, optimizing space utilization.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies design considerations and integration with common power sources.

No. of Terminals: 80

With 80 terminals, this product supports a significant number of connections, making it versatile for complex applications.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design reduces height, allowing it to fit into thin devices and compact configurations.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for operation in a wider voltage range, enhancing compatibility with various power sources.

Maximum Operating Temperature: 70 °C

The operating temperature of up to 70 °C ensures reliability in hotter environments, making it suitable for many industrial applications.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C enables functionality in a variety of climates, ensuring versatility for outdoor use.

Terminal Finish: TIN LEAD

Tin-lead finishes offer excellent solderability and durability, enhancing reliability in electronic assembly.

Ultraviolet Erasable: N

Non-ultraviolet erasable design simplifies data integrity, making it ideal for applications where constant data retention is critical.

Terminal Position: QUAD

Quad terminal position facilitates effective integration into multilayer circuit boards, enhancing overall design efficiency.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm supports low-profile circuit designs, beneficial in compact hardware solutions.

RAM Words: 512

512 RAM words provide sufficient memory for temporary data storage, enhancing the performance of applications.

Width: 14 mm

A compact width of 14 mm makes it suitable for tight spaces on PCBs, optimal for modern electronic designs.

External Data Bus Width: 16

The 16-bit external data bus width allows for fast data transfers, improving processing speed in demanding applications.

Maximum Clock Frequency: 34.48 MHz

Operating at a clock frequency of 34.48 MHz ensures efficient processing capabilities for advanced computing tasks.

Length: 14 mm

The 14 mm length complements the width in achieving a compact footprint, allowing more components on each PCB.

Temperature Grade: COMMERCIAL

Rated as commercial grade, it promises a balance of performance and reliability for everyday applications.

ROM Bits Size: 512 Bits

With 512 bits of ROM, the product can store essential data efficiently, aiding in quick information retrieval.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it ideal for portable devices.

Terminal Form: GULL WING

Gull wing terminals ensure reliable soldering connections and improved contact with PCB pads, enhancing durability.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, the product is versatile and compatible with most electronic designs and components.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

The wide bus compatibility ensures ease of integration into various existing systems, enhancing its application scope.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density mounting while maintaining soldering accuracy, vital for miniaturized applications.

Maximum Standby Current: 0.00002 Amp

An exceptionally low standby current minimizes power consumption during inactivity, extending battery life in portable devices.

Maximum Access Time: 0.00000015 ns

A very fast maximum access time ensures quick response times for applications requiring immediate data processing.

No. of I/O Lines: 40

With 40 I/O lines, this product can interface with multiple peripherals simultaneously, enhancing its functionality and flexibility.

Technical Specifications

Multi-functional Peripherals PSD502B1-15U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

Additional Features:

32K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

34.48 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

512 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD502B1-15U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20