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PSD501B1-70JI

STMicroelectronics

PSD501B1-70JI by STMicroelectronics

PSD501B1-70JI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates b/w 4.5V to 5.5V. It features a max clock frequency of 36 MHz and supports various bus types, making it ideal for industrial applications. Its compact design includes 68 terminals in a chip carrier package, ensuring efficient integration in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,213 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,213

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-

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Digiode

USA . 3,316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,316

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Anansix

USA . 730 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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730

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$47.981

100+ parts

-

1k+ parts

$43.183

10k+ parts

-

665

$47.981

-

$43.183

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MKK Technologies

India . 1,321 parts In-Stock

1+ parts

$90.225

100+ parts

-

1k+ parts

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10k+ parts

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1,321

$90.225

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DigiPath Technology Company

USA . 1,321 parts In-Stock

1+ parts

$90.225

100+ parts

-

1k+ parts

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10k+ parts

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1,321

$90.225

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Parana Technologies

USA . 2,235 parts In-Stock

1+ parts

-

100+ parts

$57.368

1k+ parts

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10k+ parts

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2,235

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$57.368

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Corphita

USA . 965 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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965

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Overview

Unlock a world of possibilities with the PSD501B1-70JI by STMicroelectronics! Renowned for its exceptional quality and innovation, STMicroelectronics delivers this versatile multi-functional peripheral that seamlessly integrates into your designs. Boasting reliability across various applications, from industrial automation to consumer electronics, this compact powerhouse enhances performance while ensuring efficiency. Experience unmatched value and superior support that elevates your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling more efficient use of space in multi-functional peripherals.

Maximum Supply Voltage: 5.5 V

The relatively low maximum supply voltage ensures compatibility with a wide range of power sources while maintaining operational safety.

Address Bus Width: 16

A 16-bit address bus width allows for efficient memory addressing, facilitating faster data processing and improved performance.

Package Shape: SQUARE

The square package shape is beneficial for thermal management and space efficiency on printed circuit boards.

No. of Terminals: 68

With 68 terminals, this product provides extensive connectivity options, accommodating a variety of peripheral devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances the product's thermal performance and is easier to handle during assembly processes.

Minimum Supply Voltage: 4.5 V

This lower supply voltage allows for greater energy efficiency and reduces overall power consumption in devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating ensures reliability in demanding environments, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures expands the range of applications, including use in harsh environments.

Terminal Position: QUAD

Quad terminal position allows for effective layout design and enhanced signal integrity in high-speed circuits.

Maximum Seated Height: 4.57 mm

A low seated height facilitates low-profile designs, crucial for space-constrained applications.

RAM Words: 512

The 512 RAM words provide significant memory storage, enabling complex processing tasks and better multitasking capabilities.

Width: 24.1808 mm

With a precise width, this component can fit seamlessly into standardized designs and layouts.

External Data Bus Width: 16

A 16-bit external data bus width enhances data throughput, allowing for faster communication with other devices.

Maximum Clock Frequency: 36 MHz

The 36 MHz clock frequency supports high-speed operations, ideal for applications requiring quick response times.

Length: 24.1808 mm

Consistency in length assists in maintaining uniformity in product design, promoting easier integration into systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates high reliability and performance in rigorous conditions, ensuring long-term operation.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, perfect for modern multi-functional peripherals.

Terminal Form: J BEND

J bend terminals enhance solderability and stability during mounting, ensuring reliable connections.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V balances performance and efficiency, making it compatible with most common electronic circuits.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility ensures this product can interface seamlessly with a variety of existing systems, enhancing its adaptability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for easy integration into most PCBs and supports higher density designs.

No. of I/O Lines: 40

The presence of 40 I/O lines provides extensive interfacing options, perfect for complex multi-functional peripheral applications.

Technical Specifications

Multi-functional Peripherals PSD501B1-70JI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

24.1808 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.1808 mm

Trade Compliance

PSD501B1-70JI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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