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PSD501B1-70U

STMicroelectronics

PSD501B1-70U by STMicroelectronics

The STMicroelectronics PSD501B1-70U is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and is ideal for embedded systems requiring low-profile packaging. Its commercial temperature range ensures reliable performance in diverse applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,014 parts In-Stock

1+ parts

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4,014

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Digiode

USA . 1,062 parts In-Stock

1+ parts

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1k+ parts

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1,062

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Anansix

USA . 763 parts In-Stock

1+ parts

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763

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,253 parts In-Stock

1+ parts

$17.474

100+ parts

-

1k+ parts

$15.726

10k+ parts

-

2,253

$17.474

-

$15.726

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MKK Technologies

India . 826 parts In-Stock

1+ parts

$32.858

100+ parts

-

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10k+ parts

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826

$32.858

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DigiPath Technology Company

USA . 826 parts In-Stock

1+ parts

$32.858

100+ parts

-

1k+ parts

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10k+ parts

-

826

$32.858

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-

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Corphita

USA . 4,081 parts In-Stock

1+ parts

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4,081

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Parana Technologies

USA . 958 parts In-Stock

1+ parts

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100+ parts

$20.892

1k+ parts

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958

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$20.892

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Overview

Unlock unparalleled performance with the PSD501B1-70U from STMicroelectronics, a trusted leader in innovative multi-functional peripherals. Designed for versatility and reliability, this compact package enhances your projects in consumer electronics, automotive systems, and industrial applications. Experience superior quality and robust functionality, ensuring seamless integration and efficiency for your designs. Elevate your solutions today with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of PCB space, enabling easier integration into modern electronics.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V ensures compatibility with a wide range of standard power supply systems.

Address Bus Width: 16

A 16-bit address bus allows for a larger addressable memory space, enhancing the performance and capability of devices using this product.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, making it suitable for space-constrained applications.

Power Supplies (V): 5

Operating at a standard power supply of 5V makes it convenient to power while minimizing design complexity.

No. of Terminals: 80

With 80 terminals, this product offers extensive connectivity options for various interfacing needs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style minimizes height, perfect for sleek designs in consumer electronics.

Minimum Supply Voltage: 4.5 V

The range of minimum supply voltage allows for flexibility in power supply design and battery-operated applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures stable performance under various environmental conditions.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C permits usage in a wider range of environments, contributing to versatility.

Terminal Finish: TIN LEAD

Tin lead terminal finishes provide excellent solderability and reliability, essential for effective PCB assembly.

Ultraviolet Erasable: N

Not being ultraviolet erasable simplifies the product's usage as it reduces potential failures in applications requiring security against accidental erasure.

Terminal Position: QUAD

Quad terminal positioning offers better mechanical stability on the PCB, ensuring enhanced connectivity.

Maximum Seated Height: 1.6 mm

A maximum seated height of just 1.6 mm contributes to low-profile designs, making integration into slim devices possible.

RAM Words: 512

With 512 RAM words, this peripheral offers sufficient memory for handling diverse applications, enabling better data manipulation.

Width: 14 mm

A width of 14 mm provides a compact form factor, facilitating easy placement on motherboard layouts.

External Data Bus Width: 16

A 16-bit external data bus width allows for faster data transfer rates, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

Operating at a clock frequency of up to 50 MHz ensures quick response times and efficient processing, making it suitable for high-speed applications.

Length: 14 mm

A uniform length of 14 mm ensures compatibility in restricted design spaces, maintaining a neat design aesthetic.

Temperature Grade: COMMERCIAL

With a commercial temperature grade, this product can operate effectively in various consumer electronics, enhancing its application scope.

ROM Bits Size: 256 Bits

The 256 bits of ROM bits size provides enough storage for essential firmware, making the device more functional.

Technology: CMOS

CMOS technology guarantees low power consumption and high noise immunity, ideal for battery-operated and portable devices.

Terminal Form: GULL WING

Gull-wing terminals facilitate easy soldering, enhancing assembly efficiency in production.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V ensures consistent performance while being widely compatible with existing power sources.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

The high degree of bus compatibility ensures that this peripheral can be integrated into a vast array of legacy and modern systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows fine-pitch PCBs to utilize this part, improving design options.

Maximum Standby Current: 0.00002 Amp

The exceptionally low maximum standby current enhances energy efficiency, extending battery life in portable applications.

Maximum Access Time: 0.00000007 ns

With an extremely fast maximum access time, this product ensures rapid data retrieval and processing speed, ideal for high-performance systems.

No. of I/O Lines: 40

Having 40 I/O lines increases the versatility of the peripheral, allowing for multiple simultaneous connections and functionalities.

Technical Specifications

Multi-functional Peripherals PSD501B1-70U attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

ROM Bits Size:

256 Bits

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

14 mm

Trade Compliance

PSD501B1-70U Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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