Loading...

PSD501B1-70LI

STMicroelectronics

PSD501B1-70LI by STMicroelectronics

PSD501B1-70LI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features an industrial temperature range (-40 °C to 85°C) and supports various bus types. Ideal for embedded systems, it offers 512 RAM words and a max clock frequency of 36 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,797

-

-

-

-

Digiode

USA . 2,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,456

-

-

-

-

Anansix

USA . 431 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

431

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,116 parts In-Stock

1+ parts

$57.591

100+ parts

-

1k+ parts

$51.832

10k+ parts

-

1,116

$57.591

-

$51.832

-

MKK Technologies

India . 630 parts In-Stock

1+ parts

$108.296

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$108.296

-

-

-

DigiPath Technology Company

USA . 630 parts In-Stock

1+ parts

$108.296

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$108.296

-

-

-

Corphita

USA . 4,623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,623

-

-

-

-

Parana Technologies

USA . 1,599 parts In-Stock

1+ parts

-

100+ parts

$68.859

1k+ parts

-

10k+ parts

-

1,599

-

$68.859

-

-

Overview

Unlock the potential of your designs with the PSD501B1-70LI by STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multi-functional peripheral is crafted for reliability, offering robust performance across industrial applications—from automation to embedded systems. Its ceramic, metal-sealed construction ensures durability under extreme conditions, while seamless integration enhances efficiency. Experience exceptional value and elevate your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed body provides excellent protection against environmental factors, ensuring longevity and reliability in various applications.

Surface Mount: YES

Support for surface mounting enables efficient assembly and compact design in modern electronic devices, saving space and improving performance.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a wide range of power supplies while ensuring safety and preventing damage.

Address Bus Width: 16

With a 16-bit address bus, this product supports a substantial memory range, enhancing its capability to handle complex tasks.

Package Shape: SQUARE

The square package shape enables easy integration into designs, allowing for efficient use of PCB space.

No. of Terminals: 68

A high terminal count of 68 provides extensive connectivity options, facilitating complex interfacing and functionality.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design with a window allows for better thermal management and accessibility for diagnostics.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures operational efficiency across a range of typical power levels, enhancing versatility.

Maximum Operating Temperature: 85 °C

The product can operate at high temperatures, making it suitable for industrial environments and reducing the risk of overheating.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures reliable performance in extreme conditions, ideal for outdoor or harsh environments.

Terminal Position: QUAD

Quad terminal positioning enhances routing flexibility and can simplify PCB layout, improving overall design efficiency.

Maximum Seated Height: 4.57 mm

A compact seated height ensures that the device can fit into low-profile applications without compromising performance.

RAM Words: 512

512 words of RAM offer significant processing capability for handling various data tasks and applications effectively.

Width: 24.105 mm

The compact width enables space-efficient designs, contributing to smaller and lighter electronic devices.

External Data Bus Width: 16

Supporting a 16-bit data bus allows the device to handle larger data blocks at once, improving speed and efficiency.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz delivers high-speed processing capability suitable for demanding applications.

Length: 24.105 mm

A well-defined length contributes to a compact form factor, promoting better integration in space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product is reliable in challenging environments, adding to its robust service life.

Technology: CMOS

Utilizing CMOS technology enables lower power consumption while maintaining high performance, making it cost-effective.

Terminal Form: J BEND

J-bend terminals facilitate easier soldering and improved connectivity, enhancing installation reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with standard electrical systems, promoting compatibility with existing infrastructure.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility allows for integration with various architectures, increasing versatility and ease of replacement in existing systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for finer pitch boards, enhancing component density and reducing footprint.

No. of I/O Lines: 40

With 40 I/O lines, the product can interface with a multitude of devices and sensors, broadening its application scope.

Technical Specifications

Multi-functional Peripherals PSD501B1-70LI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-J68

Length:

24.105 mm

No. of I/O Lines:

40

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.105 mm

Trade Compliance

PSD501B1-70LI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20