Loading...

PSD501B1-70UI

STMicroelectronics

PSD501B1-70UI by STMicroelectronics

PSD501B1-70UI by STMicroelectronics is a versatile multi-functional peripheral with a 16-bit address bus and operates at a max voltage of 5.5V. It features 512 RAM words, supports various bus types, and functions effectively in industrial applications from -40 °C to 85°C. Its low-profile design makes it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,762

-

-

-

-

Vyrian

USA . 2,484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,484

-

-

-

-

Digiode

USA . 205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

205

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 456 parts In-Stock

1+ parts

$48.560

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$48.560

-

-

-

IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$49.632

100+ parts

-

1k+ parts

$44.669

10k+ parts

-

1,397

$49.632

-

$44.669

-

MKK Technologies

India . 999 parts In-Stock

1+ parts

$93.330

100+ parts

-

1k+ parts

-

10k+ parts

-

999

$93.330

-

-

-

DigiPath Technology Company

USA . 999 parts In-Stock

1+ parts

$93.330

100+ parts

-

1k+ parts

-

10k+ parts

-

999

$93.330

-

-

-

Corphita

USA . 4,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,011

-

-

-

-

Parana Technologies

USA . 2,104 parts In-Stock

1+ parts

-

100+ parts

$59.343

1k+ parts

-

10k+ parts

-

2,104

-

$59.343

-

-

Overview

Unlock unparalleled performance with the PSD501B1-70UI from STMicroelectronics, a trusted leader in innovative electronics. This multi-functional peripheral boasts high reliability and versatility, making it ideal for industrial automation, automotive applications, and consumer electronics. With its compact design and robust thermal range, you can expect seamless integration and enhanced efficiency, driving your projects to new heights while ensuring long-lasting quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern PCB layouts, enhancing space efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V offers flexibility for various power supply designs, making it suitable for diverse applications.

Address Bus Width: 16

With a 16-bit address bus width, this product can access a larger memory range, increasing its performance in data-intensive applications.

Package Shape: SQUARE

The square shape of the package facilitates efficient layout design, reducing the overall footprint on the PCB.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options, allowing for a versatile interface with multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style enables easy stacking and reduces height, making it ideal for space-constrained designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a wide range of power sources, enhancing its usability.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C allows this product to function in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can be used in harsh climates, adding to its versatility.

Terminal Position: QUAD

Quad terminal positioning aids in efficient layout and provides better signal integrity, improving performance in high-speed applications.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm ensures the component fits well in compact designs without compromising performance.

RAM Words: 512

512 words of RAM provides adequate memory for data storage during processing, allowing for smoother operation.

Width: 14 mm

A width of 14 mm strikes a balance between size and performance, making it suitable for varied applications.

External Data Bus Width: 16

The 16-bit external data bus width supports fast data transfer rates, improving overall system performance.

Maximum Clock Frequency: 36 MHz

A maximum clock frequency of 36 MHz enables high-speed operations, ensuring efficient handling of tasks.

Length: 14 mm

A length of 14 mm assists in maintaining a uniform footprint, facilitating easier integration into circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this product is built to withstand rigorous operating conditions.

Technology: CMOS

Using CMOS technology enables low power consumption while maintaining high-speed performance, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical strength and are ideal for automated soldering processes, enhancing reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is a standard requirement in many applications, making it readily compatible with common devices.

Bus Compatibility: 8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Wide bus compatibility makes this product versatile and ideal for integration with a variety of existing systems.

Terminal Pitch: 0.65 mm

A compact terminal pitch of 0.65 mm enables denser layouts and easier routing on PCBs without compromising performance.

No. of I/O Lines: 40

Having 40 I/O lines allows for extensive interfacing capabilities, making it suitable for applications requiring multiple connections.

Technical Specifications

Multi-functional Peripherals PSD501B1-70UI attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Additional Features:

16K X 16 REPROGRAMMABLE EPROM; GENERAL PURPOSE ZPLD, DECODING ZPLD & PERIPHERAL ZPLD

Address Bus Width:

16

Boundary Scan:

NO

Bus Compatibility:

8031; 80196; 80196SP; 80186; 68HC11; 68HC16; 68330; 68331; 68340; 68302; 16000; Z80; Z8

Maximum Clock Frequency:

36 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

PSD501B1-70UI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20